2005. 2. 3 1/4
SEMICONDUCTOR
TECHNICAL DATA
Revision No : 4
VOLTAGE DETECTOR
Function of this IC is accurately resetting the system after
detecting voltage at the time of switching power on and instantaneous
power off in various CPU systems and other logic systems.
FEATURES
·Current Consumption is Low. ICCL=300μA Typ. ICCH=30μA Typ.
·Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ.
·Hysteresis Voltage is Provided. 50mV Typ.
·Reset Signal Generation Starting Voltages :
KIA7019 1.9V Typ. KIA7033 3.3V Typ.
KIA7021 2.1V Typ. KIA7034 3.4V Typ.
KIA7023 2.3V Typ. KIA7035 3.5V Typ.
KIA7025 2.5V Typ. KIA7036 3.6V Typ.
KIA7027 2.7V Typ. KIA7039 3.9V Typ.
KIA7029 2.9V Typ. KIA7042 4.2V Typ.
KIA7031 3.1V Typ. KIA7045 4.5V Typ.
KIA7032 3.2V Typ.
·Taping Type is also Available.
APPLICATIONS
(1) As Control Circuit of Battery-Backed Memory.
(2) As Measure Against Erroneous Operations at Power ON-OFF.
(3) As Measure Against System Runaway at Instantaneous Break
of Power Supply etc.
(4) As Resetting Function for the CPU-Mounted Equipment,
such as Personal Computers, Printers, VTRs and so forth.
N 1.00
M 0.45 MAX
N
M
C
E
C
E
L
F
F
H
G
K
JA
B
3
21
D
2.30
0.55 MAX
14.00 0.50
0.45
0.85
1.27
1.00
0.45
3.70 MAX
4.80 MAX
4.70 MAX
L
K
J
H
G
F
D
C
B
A
MILLIMETERSDIM
TO-92
+
_
1. V
CC
2. GND
3. OUT
DIM
A
B
D
E
G
H
K
4.70 MAX
2.50 0.20
1.70 MAX
0.45+0.15/-0.10
4.25 MAX
1.50 0.10
0.40 TYP
1.75 MAX
0.75 MIN
0.5+0.10/-0.05
SOT-89
C
J
G
D
123
2. GND
AC
K
J
F
MILLIMETERS
H
1. V
CC
3. OUT
B
E
FF
D
+
_
+
_
Heat Sink is common to (GND)
2
KIA7019AP/AF/AT~
KIA7045AP/AF/AT
BIPOLAR LINEAR INTEGRATED CIRCUIT
VCC
OUT
GND
+
-
EQUIVALENT CIRCUIT
Type No. Marking Type No. Marking Type No. Marking
KIA7019AF/AT 6A KIA7029AF/AT 6F KIA7035AF/AT 6L
KIA7021AF/AT 6B KIA7031AF/AT 6G KIA7036AF/AT 6M
KIA7023AF/AT 6C KIA7032AF/AT 6H KIA7039AF/AT 6N
KIA7025AF/AT 6D KIA7033AF/AT 6J KIA7042AF/AT 6P
KIA7027AF/AT 6E KIA7034AF/AT 6K KIA7045AF/AT 6R
Marking
DIM MILLIMETERS
A
B
D
E
TSM
2.9 0.2
1.6+0.2/-0.1
0.70 0.05
0.4 0.1
2.8+0.2/-0.3
1.9 0.2
0.95
0.16 0.05
0.00-0.10
0.25+0.25/-0.15
C
F
G
H
I
J
K 0.60
L 0.55
A
F
G
G
D
KK
B
E
C
L
H
J
J
I
2
1
3
2
1
3
+
_
+
_
+
_
+
_
+
_
1. VCC
2. OUT
3. GND
2005. 2. 3 2/4
KIA7019AP/AF/AT~KIA7045AP/AF/AT
Revision No : 4
ELECTRICAL CHARACTERISTICS (VCC=5V, VEE=GND, Ta=25℃)
MAXIMUM RATINGS (Ta=25℃)
CHARACTERISTIC SYMBOL RATING UNIT
Supply Voltage VCC -0.3～+15.0 V
Power Dissipation (Package Limitation)
KIA7019AP～45AP
PD
400
mW
KIA7019AF～45AF
500
KIA7019AT～45AT
350
Operating Temperature Topr -30～+85 ℃
Storage Temperature Tstg -55～+150 ℃
CHARACTERISTIC SYMBOL TEST
CIRCUIT TEST CONDITION MIN. TYP. MAX. UNIT
Detecting Voltage VS1RL=200Ω
VOL≦0.4V
KIA7019
KIA7021
KIA7023
KIA7025
KIA7027
KIA7029
KIA7031
KIA7032
KIA7033
KIA7034
KIA7035
KIA7036
KIA7039
KIA7042
KIA7045
1.75
1.95
2.15
2.35
2.55
2.75
2.95
3.05
3.15
3.25
3.35
3.45
3.75
4.05
4.35
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.2
3.3
3.4
3.5
3.6
3.9
4.2
4.5
2.05
2.25
2.45
2.65
2.85
3.05
3.25
3.35
3.45
3.55
3.65
3.75
4.05
4.35
4.65
V
Low-Level Output Voltage VOL 1RL=200Ω- - 0.4 V
Output Leakage Current IOH 1VCC=15V - - 0.1 μA
Hysteresis Voltage ΔVs 1RL=200Ω30 50 100 mV
Detecting Voltage
Temperature Coefficient Vs/ΔT1RL=200Ω-±0.01 -%/℃
Circuit Current at on Time IccL 1VCC=Vsmin.-0.05V - 300 500 μA
Circuit Current at off Time IccH 1VCC=5.25V - 30 50 μA
Threshold Operating Voltage Vopr 1RL=200Ω, VOL≦0.4V - 0.8 - V
"L" Transmission Delay Time tpHL 2 RL=1.0kΩ, CL=100pF - 10 - μs
"H" Transmission Delay Time tpLH 2 RL=1.0kΩ, CL=100pF - 15 - μs
Output Current at on Time I IoL I 1VCC=Vsmin.-0.05V, Tc=25℃20 - - mA
Output Current at on Time II IoL II 1 VCC=Vsmin.-0.05V, Tc=-30～+75℃16 - - mA
2005. 2. 3 3/4
KIA7019AP/AF/AT~KIA7045AP/AF/AT
Revision No : 4
A2
M
3
2
1
A1
V1 KIA70XX
10uF/10V
TEST CIRCUIT 1.
TEST CIRCUIT 2.
KIA70XX
1
2
3
M
RL
10uF/10V
RL
L
C
Input
Pulse
0.2uF
/10V
5.0V
3
2
1
KIA70XX
C1
R1
3
2
1
KIA70XX
APPLICATION CIRCUIT
VCC
R2
LED
(1) BATTERY LOW INDICATOR (2) CPU RESETTING
CC
V5V
VCC
Reset
GND
VCC 5V
S
V
Delay Time for Power ON
Reset
(Note)
(1) Connecting of LED and R2 obtains a voltage drop indicator.
(
2
)
Connectin
g
of C1 and selection of time constant with C1 and R1 set the power on dela
y
time.
CPU
2005. 2. 3 4/4
KIA7019AP/AF/AT~KIA7045AP/AF/AT
Revision No : 4
PRECAUTION FOR USE
Lead-Free Soldering Condition.
Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for
components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial
segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering
we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent
excellent reliability.
1. When employing solder reflow method
1) Soldering Condition
ⓐStandard Condition : 250℃(Temperature), 10±1sec. (Time)
ⓑPeak Condition : 260±3℃
2) Recommend temperature profile
3) Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
2. When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices
cause extensive localized temperature rise.
※Please keep a reflow solder operating when Surface Mount Package s Soldering.
Time
(
sec
)
150 C
180 C
Peak : 260 3 C
Temperature ( C)
230 C
250 C
+
_
90 30sec
Preheating Zone
+
_35 5sec
Reflow Zone
+
_
10 1sec
+
_
[Lead-Free Soldering Temperature Profile]
