Document Number: 309221-006
Intel® Core™ Duo Processor and
Intel® Core™ Solo Processor
on 65 nm Process
Datasheet
January 2007
2Datasheet
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Designers must not rely on the absence or characteristics of any features or instructions mark ed “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Core™ Duo processor and the Intel® Core™ Solo processor may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See http://www.intel.com/products/processor_number for details.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Intel Core Duo, Intel Core Sol o, Pentium, Intel SpeedStep, MMX and the Intel logo are registered trademarks or trademarks of Intel Corporation
and its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2006 - 2007, Intel Corporation. All rights reserved.
Datasheet 3
Contents
1Introduction..............................................................................................................7
1.1 Terminology .......................................................................................................9
1.2 References .........................................................................................................9
2 Low Power Features ................................................................................................11
2.1 Clock Control and Low Power States ....................................................................11
2.1.1 Core Low-Po we r State s................ .. ................................ ..................... .... 13
2.1.1.1 C0 State..................................................................................13
2.1.1.2 C1/AutoHALT Powerdown State ..................................................13
2.1.1.3 C1/MWAIT Powerdown State ......................................................13
2.1.1.4 Core C2 State...........................................................................13
2.1.1.5 Core C3 State...........................................................................14
2.1.1.6 Core C4 State...........................................................................14
2.1.2 Package Low Power States ......................................................................14
2.1.2.1 Normal State............................................................................ 14
2.1.2.2 Stop-Grant State ......................................................................14
2.1.2.3 Stop Grant Snoop State.............................................................15
2.1.2.4 Sleep State.............................. ..................... ...........................15
2.1.2.5 Deep Sleep State............. ..................... ...................... ..............16
2.1.2.6 Deeper Sleep State................................................................... 16
2.2 Enhanced Intel Speed S tep ® Te chnolog y ..... .. ... .................................................... 17
2.3 Extended Low Power States................................................................................18
2.4 FSB Low Power Enhancements............................................................................ 19
2.5 Processor Power Status Indicator (PSI#) Signal.....................................................19
3 Electrical Specifications...........................................................................................21
3.1 Power and Ground Pins ......................................................................................21
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking......................................................21
3.3 Voltage Identification......................................................................................... 21
3.4 Catastrophic Therm al Pro tec tion............... .. .. ... .. ............................................ ...... 24
3.5 Signal Terminations and Unused Pins...................................................................25
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................25
3.7 FSB Signal Groups.............................................................................................25
3.8 CMOS Signals ...................................................................................................27
3.9 Maximum Ratings . .............................................................................................27
3.10 Processor DC Specifications ................................................................................28
4 Package Mechanical Specifications and Pin Information ..........................................41
4.1 Package Mechanical Specifications.......... .. .. .........................................................41
4.1.1 Package Mechanical Drawin gs........... ... .. .. ..................... .. .. .. .....................41
4.1.2 Processor Component Keep-Out Zones.......... .. .. .. .. ... .. .. .. .. ....................... ..46
4.1.3 Package Loading Specifications .................... .. .. .. ........................ .. ............46
4.1.4 Processor Mass Specifications ..................................................................46
4.2 Processor Pinout and Pin List .............................................................................. 47
4.3 Alphabetical Signals Reference............................................................................49
5 Thermal Specifications and Design Considerations ..................................................79
5.1 Thermal Specifications.......................................................................................85
5.1.1 Thermal Diode.......................................................................................85
5.1.2 Thermal Diode Offset..............................................................................87
5.1.3 Intel® Thermal Monitor................. ..........................................................87
5.1.4 Digital Thermal Sensor (DTS)...................................................................89
5.1.5 Out of Specification Detection .............. .. .. .. ....................... ............. .. ........ 90
4Datasheet
5.1.6 PROCHOT# Sign al Pin ........................... .. ..................... .. ..................... .. ..90
Figures
1 Package-Level Low Power States ................................................................................12
2 Core Low Power States..............................................................................................12
3 Active VCC and ICC Loadline for Intel Core Duo Processor (SV, LV & ULV) and
Intel Core Solo Processor SV............... .. .. ............ ..................... ... .. ..................... .. .. .. ..35
4 Deeper Sleep VCC and ICC Loadline for Intel Core Duo Processor (SV, LV & ULV) and
Intel Core Solo Processor SV............... .. .. ............ ..................... ... .. ..................... .. .. .. ..36
5 Active VCC and ICC Loadline for Intel Core Solo Processor ULV.......................................37
6 Deeper Sleep VCC and ICC Loadline for Intel Core Solo Processor ULV ..............................38
7 Micro-FCPGA Processor Package Drawing (Sheet 1 of 2) ................................................42
8 Micro-FCPGA Processor Package Drawing (Sheet 2 of 2) ................................................43
9 Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)................................................44
10 Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) ...............................................45
Tables
1 Coordination of Core-Level Low Power States at the Package Level ......... ........................11
2 Voltage Identification Definition..................................................................................21
3 BSEL[2:0] Encodi ng for BCLK Freq uency................................ .. .. ...................... .. .. ........25
4 FSB Pin Groups ........................................................................................................26
5 Processor DC Absolute Maximum Ratings.....................................................................27
6 Voltage and Current Specifications for Intel Core Duo Processor SV (Standard Voltage) .....28
7 Voltage and Current Specifications for Intel Core Solo Processor SV (Standard Voltage).....30
8 Voltage and Current Specif ications for Intel Core Duo Processor LV (Low Voltage).............31
9 Voltage and Current Specifications Intel Core Duo Processor Ultra Low Voltage (ULV) ........3 2
10 Voltage and Current Specifications for Intel Core Solo Processor ULV (Ultra Low Voltage)...33
11 FSB Differential BCLK Specifications............................................................................39
12 AGTL+ Signal Group DC Specifications ........................................................................39
13 CMOS Signal Group DC Specifications..........................................................................40
14 Open Drain Signal Group DC Specifications ..................................................................40
15 The Coordinates of the Processor Pins as Viewed from the Top of the Package..................47
16 The Coordinates of the Processor Pins as Viewed from the Top of the Package .................48
17 Signal Description........... .. .. ..................... ........................................ ..................... ....49
18 Pin Listing by Pin Name.............................................................................................59
19 Pin Listing by Pin Number.......................................................................................... 69
20 Power Specifications for the Intel Core Duo Processor SV (Standard Voltage) ...................80
21 Power Specifications for the Intel Core Solo Processor SV (Standard Voltage)...................81
22 Power Specifications for the Intel Core Duo Processor LV (Low Voltage)...........................82
23 Power Specifications for the Intel Core Duo Processor, Ultra Low Voltage (ULV) ................83
24 Power Specifications for the Intel Core Solo Processor ULV (Ultra Low Voltage).................84
25 Thermal Diode Interface............... .............................................................................85
26 Thermal Diode Parameters using Diode Mode...............................................................86
27 Thermal Diode Parameters using Transistor Mode .........................................................86
28 Thermal Diode ntrim and Diode Correction Toffset..........................................................87
Datasheet 5
Revision History
§
Revision Description Date
-001 Initial Release January 2006
-002
• Added references to ULV processor throughout the document
• Replaced references to the terminology Deep C4 voltage with Intel® En hanced Deeper
Sleep Voltage throughout the document.
• Replaced references to Enhanced Low Power states with C xE Low Power States
•Section 3.10
— Included Table 10 Voltage and Current Specifications for Intel Core Solo Processor
ULV
— Included Figure 5 Active VCC and ICC Load Line fo r In tel Co re Solo Processor ULV
— Included Figure 6 Deeper Sleep VCC and ICC Load Line for Intel Core Solo
Processor ULV
•Chapter 5
— Included Table 24 Power Specifications for the Intel Core Solo Processor ULV (Ultra
Low Voltage)
April 2006
-003 • Added Intel® Core™ Duo Processor T2300E and Intel® Core™ Solo Processor T1400
specifications. May 2006
-004
• Added references to Intel Core Duo Processor, Ultra Low Voltage (ULV) throughout the
document
• CxE low power states now also referred to as Extended Low Power States
•Section 3.10
—Updated Table 6 - Added Icc spec for T2700
— Included Table 9 Vo ltage and Current Specifications Intel Core Duo Processor, Ultra
Low Voltage (ULV)
•Chapter 5
—Updated Table 20 - Added TDP for T2700
— Included Table 23 - Power Specification for Intel Core Duo Processor Ultra Low
Voltage (ULV)
June 2006
-005
•In Chapter 3:
— Added L2500 processor specifications to Table 8.
— Added U2400 processor specifications to Table 9.
•In Chapter 5:
— Added L2500 processor power specifications to Table 22.
— Added U2400 processor power specifications to Table 23.
September 2006
-006
•In Chapter 3:
— Added U1500 processor specifications to Table 10.
•In Chapter 5:
— Added U1500 processor power specifications to Table 24.
January 2007
6Datasheet
Datasheet 7
Introduction
1 Introduction
The Intel® CoreTM Duo processor and the Intel® CoreTM Solo processor are built on
Intel’ s next generation 65 nanometer process technology with copper interconnect. The
Intel Core Solo processor refers to a single core processor and the Intel Core Duo
processor refers to a dual core processor. This document provides specifications for all
Intel Core Duo processor and Intel Core Solo processor in standard voltage (SV), low
voltage (LV) and ultra low voltage (ULV) products.
Note: All instances of the “processor” in this document refer to the Intel Core Duo processor
and Intel Core Solo processor with 2-MB L2 cache, unless specified otherwise.
Intel processor numbers are not a measure of performance. Processor numbers
differentiate features within each processor family, not across different processor
families. See www.intel.com/products/processor_number for details.
The following list provides some of the key features on this processor:
• First dual core processor for mobile
• Supports Intel® Architecture with Dynamic Execution
• On-die, primary 32-KB instruction cache and 32-KB write-back data cache
• On-die, 2-MB second level cache with Advanced Transfer Cache Architecture
• Data Prefetch Logic
• Streaming SIMD Extensions 2 (SSE2) and Streaming SIMD Extensions 3 (SSE3)
•The Intel
Core Duo processor and Intel Core Solo processor standard voltage and
low voltage processors are offered at 667-MHz FSB
• The Intel Core Duo processor and Intel Core Solo processor ultra low voltage are
offered at 533-MHz FSB
• Advanced power management features including Enhanced Intel SpeedStep®
Technology
• Digital thermal sensor (DTS)
•The Intel
Core Duo processor and Intel Core Solo processor standard voltage are
offered in both the Micro-FCPGA and the Micro-FCBGA packages
•Intel
Core Duo processor low voltage is offered only in the Micro-FCBGA package
•The Intel
Core Duo processor and Intel Core Solo processor ultra low vo ltage are
offered only in Micro-FCBGA package
• Execute Disable Bit support for enhanced security
• Intel® Virtualization Technology
• Intel® Enhanced Deeper Sleep and Dynamic Cache Sizing
The processor maintains support for MMX™ technology, Streaming SIMD instructions,
and full compatibility with IA-32 software. The processor features on-die, 32-KB, Lev el
1 instruction and data caches and a 2-MB level 2 cache with Advanced Transfer Cache
Architecture. The processor’s Data Prefetch Logic speculatively fetches data to the L2
cache before the L1 cache requests occurs, resulting in reduced bus cycle penalties.
The processor includes the Data Cache Unit Streamer which enhances the performance
of the L2 prefetcher by requesting L1 warm-ups earlier. In addition, the Writer Order
Buffer depth is enhanced to help with the write-back latency performance.
Introduction
8Datasheet
In addition to supporting the existing Streaming SIMD Extensions 2 (SSE2), there are
13 new instructions which extend the capabilities of Intel processor technology further.
These new instructions are called Streaming SIMD Extensions 3 (SSE3). 3D gr aphics
and other entertainment applications, such as gaming, will have the opportunity to take
advantage of these new instructions as platforms with the processor and SSE3 become
available in the market place.
The processor’s FSB utilizes a split-transaction, deferred reply protocol. The FSB uses
Source-Synchronous Transfer (SST) of address and data to improve performance by
transferring data four times per bus clock. The 4X data bus can deliver data four times
per bus clock and is referred as “quad-pumped” or 4X data bus, the address bus can
deliver addresses two times per bus clock and is referred to as a “double-clocked” or 2X
address bus. W orking together, the 4X data bus and the 2X address bus pro vide a data
bus bandwidth of up to 5.33 GB/second. The FSB uses Advanced Gunning Transceiver
Logic (AGTL+) signaling technology, a variant of GTL+ signaling technology with low
power enhancements.
The processor features Enhanced Intel SpeedStep Technology, which enables real-time
dynamic switching between multiple voltage and frequency points. The processor
features the Auto Halt, Stop Grant, Deep Sleep, and Deeper Sleep low power C-states.
The processor utilizes socketable Micro Flip-Chip Pin Grid Array (Micro-FCPGA) and
surface mount Micro Flip-Chip Ball Grid Array (Micro-FCBGA) package technology. The
Micro-FCPGA package plugs into a 479-hole, surface-mount, Zero Insertion F orce (ZIF)
socket, which is referred to as the mPGA479M socket.
The processor supports the Execute Disable Bit capability. This feature, combined with
a support operating system, allows memory to be marked as executable or non
executable. If code attempts to run in non-executable memory the processor raises an
error to the operating system. This feature can prevent some classes of viruses or
worms that exploit buffer overrun vulner abilities and can thus help impro ve the o v er all
security of the system. See the Intel® Architecture Software Developer's Manual for
more detailed information.
Intel Virtualization Technology is a set of hardware enhancements to Intel server and
client systems that combined with the appropriate software, will enable enhanced
virtualization robustness and performance for both enterprise and consumer uses. Intel
Virtualization Technology forms the foundation of Intel technologies focused on
improved virtualization, safer computing, and system stability. For client systems, Intel
Virtualization Technology’s hardware-based isolation helps provide the foundation for
highly available and more secure client virtualization partitions.
Datasheet 9
Introduction
1.1 Terminology
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document. Chipset references in this document are to the Mobile Intel®
945 Express Chipset family unless specified otherwise.
§
Term Definition
#
A “#” symbol after a signal name refers to an active low signal, indicating a
signal is in the active state when driven to a low level. For example, when
RESET# is low, a reset has been requested. Conversely, when NMI is high,
a nonmaskable interrupt has occurred. In the case of signals where the
name does not imply an active state but describes part of a binary
sequence (such as address or data), the “#” symbol implies that the signal
is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]#
= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).
XXXX means th at the specification or value is yet to be determined.
Front Side Bus
(FSB) Refers to the interface between the processor and system core logic (also
known as the chipset components).
AGTL+ Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+
signaling technology on some Inte l processors.
Document Document
Number
Intel® Core™ Duo Processor and Intel® Core™ Solo Processor on 65 nm
Process Specification Update 309222
Mobile Intel® 945 Express Chipset Family Datasheet 309219
Mobile Intel® 945 Express Chipset Family Specification Update 309220
Intel® I/O Controller Hub 7 (ICH7) Family Datasheet 307013
Intel® I/O Controller Hub 7 (ICH7) Family Spec ification Update 307014
Intel® Architecture Software Developer's Manual
Volume 1 Basic Architecture 253665
Volume 2A: Instruction Set Reference, A-M 253666
Volume 2B: Instruction Set Reference, N-Z 253667
Volume 3A: System Programming Guide 253668
Volume 3B: System Programming Guide 253669
AP-485, Intel® Processor Identification and CPUID Instruction Application
Note 241618
Introduction
10 Datasheet
Datasheet 11
Low Power Features
2 Low Power Features
2.1 Clock Control and Low Power States
The Intel Core Duo processor and Intel Core Solo processor support low power states
both at the individual core level and the package level for optimal power management.
A core may independently enter the C1/AutoHALT, C1/MWAIT, C2, C3, and C4 low
power states. Refer to Figure 2 for a visual representation of the core low power states
for the Intel Core Duo processor and Intel Core Solo processor. When both cores
coincide in a common core low power state, the central power management logic
ensures the Intel Core Duo processor enters the respective package low power state by
initiating a P_LVLx (P_LVL2, P_LVL3, and P_LVL4) I/O read to the Mobile Intel 945
Express Chipset family. Package low power states include Normal, Stop Grant, Stop
Grant Snoop, Sleep, Deep Sleep, and Deeper Sleep. Refer Figure 1 for a visual
representation of the package low-power states for the Intel Core Duo processor and
Intel Core Solo processor and to Table 1 for a mapping of core low power states to
package low power states.
The processor implements two software interfaces for requesting low power states:
MW AIT instruction extensions with sub-state hints and P_L VLx reads to the ACPI P_BLK
register block mapped in the processor’s I/O address space. The P_LVLx I/O reads are
converted to equivalent MWAIT C-state requests inside the processor and do not
directly result in I/O reads on the processor FSB. The monitor address does not need to
be setup before using the P_LVLx I/O read interface. The sub-state hints used for each
P_LVLx read can be configured in a software programmable MSR.
When software running on a core requests the C4 state, that core enters the core C4
state, which is identical to the core C3 state. When both cores have requested C4 then
the Intel Core Duo processor will enter the Deeper Sleep state.
If a core encounters a chipset break event while STPCLK# is asserted, then it asserts
the PBE# output signal. Assertion of PBE# when STPCLK# is asserted indicates to
system logic that individual cores should return to the C0 state and the Intel Core Duo
processor should return to the Normal state. Same mechanism is also applicable for the
Intel Core Solo processor.
NOTE:
1. AutoHALT or MWAIT/C1.
Table 1. Coordination of Core-Level Low Power States at the Package Level
Resolved
Package State Single
Core
Dual Core: Core1 State
C0 C11C2 C3 C4
Core0 / Functional
Core State
C0 Normal Normal Normal Normal Normal Normal
C1†Normal Normal Normal Normal Normal Normal
C2 Stop Grant Normal Normal Stop Grant Stop Grant Stop Grant
C3 Deep Sleep Normal Normal Stop Grant Deep Sleep Deep Sleep
C4 Deeper Sleep Normal Normal Stop Grant Deep Sleep
Deeper Sleep /
Intel®
Enhanced
Deeper Sleep
Low Power Features
12 Datasheet
Figure 1. Package-Level Low Power States
Figure 2. Core Low Power States
Stop
Grant
Snoop
Normal Stop
Grant Deep
Sleep
STPCLK# asserted
Snoop
serviced Snoop
occurs
Deeper
Sleep†
Sleep
SLP# asserted
SLP# de-asserted
DPSLP# asserted
DPSLP# de-asserted DPRSTP# de-asserted
DPRSTP# asserted
STPCLK# de-asserted
† — Deeper Sleep includes the Deeper Sleep and the Intel Enhanced Deeper Sleep state.
C2†
C0
Stop
Grant
Core state
break
P_LVL2 or
MWAIT(C2)
C3†
Core
state
break
P_LVL3 or
MWAIT(C3)
C1/
MWAIT Core state
break
MWAIT(C1)
C1/Auto
Halt
Halt break
HLT instruction
C4† ‡
Core State
break
P_LVL4 or
MWAIT(C4)
STPCLK#
de-asserted
STPCLK#
asserted
STPCLK#
de-asserted
STPCLK#
asserted
STPCLK#
de-asserted
STPCLK#
asserted
halt break = A20M # transition, INIT #, INTR, NMI, PREQ #, RESE T#, SM I#, or APIC interrupt
core state break = (halt break OR Monitor event) AND STPCLK# high (not asserted)
† — STPCLK # assertion and de-assertion have no effect if a core is in C2, C3, or C 4.
‡ — Core C4 state supports the package level Intel Enhanced Deeper sleepstate.
Datasheet 13
Low Power Features
2.1.1 Core Low-Power States
2.1.1.1 C0 State
This is the normal operating state for the Intel Core Duo processor and Intel Core Solo
processor.
2.1.1.2 C1/AutoHALT Powerdown State
C1/AutoHALT is a low power state entered when the processor core executes the HALT
instruction. The processor core will transition to the C0 state upon the occurrence of
SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB interrupt message. RESET# will cause the
processor to immediately initialize itself.
A System Management Interrupt (SMI) handler will return execution to either Normal
state or the AutoHALT Powerdown state. See the Intel® Architecture Software
Developer's Manual, Volume 3A/3B: System Programmer's Guide for more information.
The system can generate an STPCLK# while the processor is in the AutoHALT
Powerdown state. When the system deasserts the STPCLK# interrupt, the processor
will return execution to the HALT state.
While in AutoHALT Powerdown state, the dual core processor will process bus snoops
and snoops from the other core, and the single core processor will process only the bus
snoops. The processor core will enter a snoopable sub-state (not shown in Figure 2) to
process the snoop and then return to the AutoHALT Powerdown state.
2.1.1.3 C1/MWAIT Powerdown State
MWAIT is a low power state entered when the processor core executes the MWAIT
instruction. Processor behavior in the MWAIT state is identical to the AutoHALT state
except that there is an additional event that can cause the processor core to return to
the C0 state: the Monitor event. See the Intel® Architecture Software Developer's
Manual, Volumes 2A/2B: Instruction Set Reference, for more information.
2.1.1.4 Core C2 State
Individual cores of the Intel Core Duo processor and Intel Core Solo processor can
enter the C2 state by initiating a P_LVL2 I/O read to the P_BLK or an MWAIT(C2)
instruction, but the processor will not issue a Stop Grant Acknowledge special bus cy cle
unless the STPCLK# pin is also asserted.
While in C2 state, the dual core processor will process bus snoops and snoops from the
other core, and the single core processor will process only the bus snoops. The
processor core will enter a snoopable sub-state (not shown in Figure 2) to process the
snoop and then return to the C2 state.
Low Power Features
14 Datasheet
2.1.1.5 Core C3 State
Core C3 state is a very low power state the processor core can enter while maintaining
context. Individual cores of the Intel Core Duo processor and Intel Core Solo processor
can enter the C3 state by initiating a P_LVL3 I/O read to the P_BLK or an MWAIT(C3)
instruction. Before entering the C3 state, the processor core flushes the contents of its
L1 caches into the processor’s L2 cache. Except for the caches, the processor core
maintains all its architectural state in the C3 state. The Monitor remains armed if it is
configured. All of the clocks in the processor core are stopped in the C3 state.
Because the core’s caches are flushed the processor keeps the core in the C3 state
when the processor detects a snoop on the FSB or when the other core of the dual core
processor accesses cacheable memory. The processor core will transition to the C0
state upon the occur rence of a Monitor e ven t, SMI#, INIT#, LINT[1:0] (NMI, INTR), or
FSB interrupt message. RESET# will cause the processor core to immediately initialize
itself.
2.1.1.6 Core C4 State
Individual cores of the Intel Core Duo processor and Intel Core Solo processor can
enter the C4 state by initiating a P_LVL4 I/O read to the P_BLK or an MWAIT(C4)
instruction. The processor core behavior in the C4 state is identical to the behavior in
the C3 state. The only difference is that if both processor cores are in C4, then the
central power management logic will request that the entire dual core processor enter
the Deeper Sleep package low power state (see Section 2.1.2.5). The single core
processor would be put into the Deeper Sleep State in C4 state if the low power state
coordination logic is enabled.
To enable the package level Intel Enhanced Deeper Sleep Low V oltage, Dynamic Cache
Sizing and Intel Enhanced Deeper Sleep state fields must be configured in the software
programmable MSR.
2.1.2 Package Low Power States
The package level low power states are applicable for the Intel Core Duo processor as
well as the Intel Core Solo processor. The package level low power states are described
in Section 2.1.2.1 through Section Section 2.1.2.6.
2.1.2.1 Normal State
This is the normal operating state for the processor. The processor enters the Normal
state when at least one of its cores is in the C0, C1/AutoHALT, or C1/MWAIT state.
2.1.2.2 Stop-Grant State
When the STPCLK# pin is asserted, each core of the Intel Core Duo processor and Intel
Core Solo processor enters the Stop-Grant state within 20 bus clocks after the
response phase of the processor-issued Stop Grant Acknowledge special bus cycle.
Processor cores that are already in the C2, C3, or C4 state remain in their current low-
power state. When the STPCLK# pin is deasserted, each core returns to its previous
core low power state.
Since the AGTL+ signal pins receive power from the FSB, these pins should not be
driven (allowing the level to return to VCCP) for minimum power drawn by the
termination resistors in this state. In addition, all other input pins on the FSB should be
driven to the inactive state.
Datasheet 15
Low Power Features
RESET# will cause the processor to immediately initialize itself, but the processor will
stay in Stop-Grant state. When RESET# is asserted by the system the STPCLK#, SLP#,
DPSLP#, and DPRSTP# pins must be deasserted more than 450 µs prior to RESET#
deassertion. When re-entering the Stop-Grant state from the Sleep state, STPCLK#
should be deasserted ten or more bus clocks after the deassertion of SLP#.
While in Stop-Grant state, the processor will service snoops and latch interrupts
delivered on the FSB. The processor will latch SMI#, INIT# and LINT[1:0] interrupts
and will service only one of each upon return to the Normal state.
The PBE# signal may be driven when the processor is in Stop-Gr ant state. PBE# will be
asserted if there is any pending interrupt or monitor event latched within the processor.
Pending interrupts that are blocked by the EFLAGS.IF bit being clear will still cause
assertion of PBE#. Assertion of PBE# indicates to system logic that the entire dual core
processor should return to the Normal state.
A transition to the Stop Grant Snoop state will occur when the processor detects a
snoop on the FSB (see Section 2.1.2.3). A transition to the Sleep state (see
Section 2.1.2.4) will occur with the assertion of the SLP# signal.
2.1.2.3 Stop Grant Snoop State
The processor will respond to snoop or interrupt transactions on the FSB while in Stop-
Grant state by entering the Stop-Grant Snoop state. The processor will stay in this
state until the snoop on the FSB has been serviced (whether by the processor or
another agent on the FSB) or the interrupt has been latched. The processor will return
to the Stop-Grant state once the snoop has been serviced or the interrupt has been
latched.
2.1.2.4 Sleep State
The Sleep state is a low power state in which the processor maintains its context,
maintains the phase-locked loop (PLL), and stops all internal clocks. The Sleep state is
entered through assertion of the SLP# signal while in the Stop-Grant state. The SLP#
pin should only be asserted when the processor is in the Stop-Grant state. SLP#
assertions while the processor is not in the Stop-Grant state is out of specification and
may result in unapproved operation.
In the Sleep state, the processor is incapable of responding to snoop transactions or
latching interrupt signals. No transitions or assertions of signals (with the exception of
SLP#, DPSLP# or RESET#) are allowed on the FSB while the processor is in Sleep
state. Snoop events that occur while in Sleep state or during a transition into or ou t of
Sleep state will cause unpredictable behavior. Any transition on an input signal before
the processor has returned to the Stop-Grant state will result in unpredictable behavior.
If RESET# is driven active while the processor is in the Sleep state, and held active as
specified in the RESET# pin specification, then the processor will reset itself, ignoring
the transition through Stop-Grant State. If RESET# is driven activ e while the processor
is in the Sleep State, the SLP# and STPCLK# signals should be deasserted immediately
after RESET# is asserted to ensure the processor correctly executes the Reset
sequence.
While in the Sleep state, the processor is capable of entering an even lower power
state, the Deep Sleep state, by asserting the DPSLP# pin. (See Section 2.1.2.5.) While
the processor is in the Sleep state, the SLP# pin must be deasserted if another
asynchronous FSB event needs to occur.
Low Power Features
16 Datasheet
2.1.2.5 Deep Sleep State
Deep Sleep state is a very low power state the processor can enter while maintaining
context. Deep Sleep state is entered by asserting the DPSLP# pin while in the Sleep
state. BCLK may be stopped during the Deep Sleep state for additional platform level
power savings. BCLK stop/restart timings on appropriate chipset-based platforms with
the CK410M clock chip are as follows:
• Deep Sleep entry: the system clock chip may stop/tristate BCLK within 2 BCLKs of
DPSLP# assertion. It is permissible to leave BCLK running during Deep Sleep.
• Deep Sleep exit: the system clock chip must drive BCLK to differential DC levels
within 2-3 ns of DPSLP# deassertion and start toggling BCLK within 10 BCLK
periods.
To re-enter the Sleep state, the DP SLP# pin must be deasserted. BCLK can be re-
started after DPSLP# deassertion as described above. A period of 15 microseconds (to
allow for PLL stabilization) must occur before the processor can be considered to be in
the Sleep state. Once in the Sleep state, the SLP # pin must be deasserted to re-enter
the Stop-Grant state.
While in Deep Sleep state, the processor is incapable of responding to snoop
transactions or latching interrupt signals. No transitions of signals are allowed on the
FSB while the processor is in Deep Sleep state. When the processor is in Deep Sleep
state, it will not respond to interrupts or snoop transactions. Any tr ansition on an input
signal before the processor has returned to Stop-Grant state will result in unpredictable
behavior.
2.1.2.6 Deeper Sleep State
The Deeper Sleep state is similar to the Deep Sleep state but reduces core voltage to
one of two lower levels. One lower core voltage level is achieved by entering the base
Deeper Sleep state. The Deeper Sleep state is entered through assertion of the
DPRSTP# pin while in the Deep Sleep state. The other lower core voltage level, the
lowest possible in the processor, is achieved by entering the Intel Enhanced Deeper
Sleep state of Deeper Sleep state. The Intel Enhanced Deeper Sleep state is entered
through assertion of the DPRSTP# pin while in the Deep Sleep only when the L2 cache
has been completely shut down. Refer to Section 2.1.2.6.1 and Section 2.1.2.6.2 for
further details on reducing the L2 cache and entering Intel Enhanced Deeper Sleep
state.
In response to entering Deeper Sleep, the processor will drive the VID code
corresponding to the Deeper Sleep core voltage on the VID[6:0] pins.
Exit from the Deeper Sleep state or Intel Enhanced Deeper Sleep state is initiated by
DPRSTP# deassertion when either core requests a core state other than C4 or either
core requests a processor performance state other than the lowest operating point.
2.1.2.6.1 Intel Enhanced Deeper Sleep State
Intel Enhanced Deeper Sleep state is a sub-state of Deeper Sleep that extends power
saving capabilities by allowing the processor to further reduce core voltage once the L2
cache has been reduced to zero ways and completely shut down. The following events
occur when the processor enters Intel Enhanced Deeper Sleep state:
• The last core entering C4 issues a P_LVL4 I/O read or an MWAIT(C4) instruction
and then progressively reduces the L2 cache to zero.
• The processor drives the VID code corresponding to the Intel Enhanced Deeper
Sleep state core voltage on the VID[6:0] pins.
Datasheet 17
Low Power Features
2.1.2.6.2 Dynamic Cache Sizing
Dynamic Cache Sizing allows the processor to flush and disable a programmable
number of L2 cache ways upon each Deeper Sleep entry under the following
conditions:
• The second core is already in C4 and the Intel Enhanced Deeper Sleep state is
enabled (as specified in Section 2.1.2.6.1).
• The C0 timer, which tracks continuous residency in the Normal package state, has
not expired. This timer is cleared during the first entry into Deeper Sleep to allow
consecutive Deeper Sleep entries to shrink the L2 cache as needed.
• The FSB speed to processor core speed ratio is below the predefined L2 shrink
threshold.
If the FSB speed to processor core speed ratio is above the predefined L2 shrink
threshold, then L2 cache expansion will be requested. If the ratio is zero , then the r atio
will not be taken into account for Dynamic Cache Sizing decisions.
Upon STPCLK# deassertion, the first core exiting the Intel Enhanced Deeper Sleep
state will expand the L2 cache to 2 wa ys and invalidate previously disabled cache ways.
If the L2 cache reduction conditions stated above still exist when the last core returns
to C4 and the package enters Intel Enhanced Deeper Sleep state, then the L2 will be
shrunk to zero again. If a core requests a processor performance state resulting in a
higher ratio than the predefined L2 shrink threshold, the C0 timer expires, or the
second core (not the one currently entering the interrupt routine) requests the C1, C2,
or C3 states, then the whole L2 will be expanded when the next INTR event would
occur.
L2 cache shrink prevention may be enabled as needed on occasion through an
MWAIT(C4) sub-state field. If shrink prevention is enabled, then the processor does not
enter the Intel Enhanced Deeper Sleep state since the L2 cache remains valid and in
full size.
2.2 Enhanced Intel SpeedStep® Technology
Intel Core Duo processor and Intel Core Solo processor feature Enhanced Intel
SpeedStep Technology. Following are the key features of Enhanced Intel SpeedStep
Technology:
• Multiple voltage/frequency operating points provide optimal performance at the
lowest power.
• Voltage/Frequency selection is software controlled by writing to processor MSR’s
(Model Specific Registers).
— If the target frequency is higher than the current frequency, VCC is ramped up
in steps by placing new values on the VID pins and the PLL then locks to the
new frequency.
— If the target frequency is lower than the current frequency, the PLL locks to the
new frequency and the VCC is changed through the VID pin mechanism.
— Software transitions are accepted at any time. If a previous transition is in
progress, the new transition is deferred until the previous transition completes.
• The processor controls voltage ramp rates internally to ensure glitch free
transitions.
• Low transition latency and large number of transitions possible per second.
— Processor core (including L2 cache) is unavailable for up to 10 μs during the
frequency transition
Low Power Features
18 Datasheet
— The bus protocol (BNR# mechanism) is used to block snooping
• Improved Intel® Thermal Monitor mode.
— When the on-die thermal sensor indicates that the die temperature is too high,
the processor can automatically perform a transition to a lower frequency/
voltage specified in a software programmable MSR.
— The processor waits for a fixed time period. If the die temperature is down to
acceptable levels, an up transition to the previous frequency/voltage point
occurs.
— An interrupt is generated for the up and down Intel Thermal Monitor tr ansitions
enabling better system level thermal management.
• Enhanced thermal management features.
— Digital thermal sensor and thermal interrupts
— TM1 in addition to TM2 in case of non successful TM2 transition.
— dual core thermal management synchronization.
Each core in the Intel Core Duo processor implements an independent MSR for
controlling Enhanced Intel SpeedStep Technology, but both cores must operate at the
same frequency and voltage. The processor has performance state coordination logic to
resolve frequency and voltage requests from the two cores into a single frequency and
voltage request for the package as a whole. If both cores request the same frequency
and voltage then the Intel Core Duo processor will transition to the requested common
frequency and voltage. If the two cores have different frequency and voltage requests
then the Intel Core Duo processor will take the highest of the two frequencies and
voltages as the resolved request and transition to that frequency and voltage.
2.3 Extended Low Power States
The Extended low power states (C1E, C2E, C3E, C4E) optimize for power by forcibly
reducing the performance state of the processor when it enters a package low power
state. Instead of directly transitioning into the package low power states, the extended
low power state first reduces the performance state of the processor by performing an
Enhanced Intel SpeedStep Technology transition down to the lowest operating point.
Upon receiving a break event from the package low power state, control will be
returned to software while an Enhanced Intel SpeedStep Technology transition up to
the initial operating point occurs. The advantage of this feature is that it significantly
reduces leakage while in the package low power states.
The processor implements two software interfaces for requesting extended low power
states: MWAIT instruction extensions with sub-state hints and via BIOS by configuring
a software programmable MSR bit to automatically promote package low power states
to extended low power states.
Note: C2E and C4E must be enabled via the BIOS for the processor to remain within
specification.
Enhance d I ntel SpeedStep Techno logy transitions are multistep processes that require
clocked control. These transitions cannot occur when the processor is in the Sleep or
Deep Sleep package low power states since processor clocks are not active in these
states. C4E is an exception to this rule when the Hard C4E configuration is enabled in a
software progr ammable MSR bit. This C4E low power state configuration will lower core
voltage to the Deeper Sleep level while in Deeper Sleep and, upon exit, will
automatically transition to the lowest oper ating v oltage and frequency to reduce snoop
service latency. The transition to the lowest operating point or back to the original
software requested point may not be instantaneous. Furthermore, upon very frequent
transitions between activ e and idle states, the tran sitions may lag behind the idle state
Datasheet 19
Low Power Features
entry resulting in the processor either executing for a longer time at the lowest
operating point or running idle at a high operating point. Observations and analyses
show this behavior should not significantly impact total power savings or performance
score while providing power benefits in most other cases.
2.4 FSB Low Power Enhancements
The processor incorporates FSB low power enhancements:
• Dynamic FSB Power Down
• BPRI# control for address and control input buffers
• Dynamic Bus Parking
• Dynamic On Die Termination disabling
• Low VCCP (I/O termination voltage)
The Intel Core Duo processor and Intel Core Solo processor incorporate the DPWR#
signal that controls the data bus input buffers on the processor. The DPWR# signal
disables the buffers when not used and activates them only when data bus activity
occurs, resulting in significant power savings with no performance impact. BPRI#
control also allows the processor address and control input buffers to be turned off
when the BPRI# signal is inactive. Dynamic Bus Parking allows a reciprocal power
reduction in chipset address and control input buffers when the processor deasserts its
BR0# pin. The On Die Termination on the processor FSB buffers is disabled when the
signals are driven low, resulting in additional power savings. The low I/O termination
voltage is on a dedicated voltage plane independent of the core voltage, enabling low
I/O switching power at all times.
2.5 Processor Power Status Indicator (PSI#) Signal
The Intel Core Duo processor and Intel Core Solo processor incorporate the PSI# signal
that is asserted when the processor is in a reduced power consumption state. PSI# can
be used to improve intermediate and light l oad efficiency of the voltage regulator,
resulting in platform power savings and improved battery life. The algorithm that the
Intel Core Duo processor and Intel Core Solo processor use for determining when to
assert PSI# is different from the algorithm used in previous Intel® Pentium® M
processors.
§
Low Power Features
20 Datasheet
Datasheet 21
Electrical Specifications
3 Electrical Specifications
3.1 Power and Ground Pins
For clean, on-chip power distribution, the processor will have a large number of VCC
(power) and VSS (ground) inputs. All power pins must be connected to VCC power
planes while all VSS pins must be connected to system ground planes. Use of multiple
power and ground planes is recommended to reduce I*R drop. Please contact your
Intel representative for more details. The processor VCC pins must be supplied the
voltage determined by the VID (Voltage ID) pins.
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the
processor. As in previous generation processors, the Intel Core Duo processor and Intel
Core Solo processors’ core frequency is a multiple of the BCLK[1:0] frequency. The
processor uses a differential clocking implementation.
3.3 Voltage Identification
The processor uses seven voltage identification pins, VID[6:0], to support automatic
selection of power supply voltages. The VID pins for the processor are CMOS outputs
driven by the processor VID circuitry. Table 2 specifies the voltage level corresponding
to the state of VID[6:0]. A 1 in this refers to a high-voltage level and a 0 refers to low-
voltage level.
Table 2. Voltage Identification Definition (Sheet 1 of 4)
VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)
00000001.5000
00000011.4875
00000101.4750
00000111.4625
00001001.4500
00001011.4375
00001101.4250
00001111.4125
00010001.4000
00010011.3875
00010101.3750
00010111.3625
00011001.3500
00011011.3375
00011101.3250
00011111.3125
Electrical Specifications
22 Datasheet
00100001.3000
00100011.2875
00100101.2750
00100111.2625
00101001.2500
00101011.2375
00101101.2250
00101111.2125
00110001.2000
00110011.1875
00110101.1750
00110111.1625
00111001.1500
00111011.1375
00111101.1250
00111111.1125
01000001.1000
01000011.0875
01000101.0750
01000111.0625
01001001.0500
01001011.0375
01001101.0250
01001111.0125
01010001.0000
01010010.9875
01010100.9750
01010110.9625
01011000.9500
01011010.9375
01011100.9250
01011110.9125
01100000.9000
01100010.8875
01100100.8750
01100110.8625
01101000.8500
01101010.8375
Table 2. Voltage Identification Definition (Sheet 2 of 4)
VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)
Datasheet 23
Electrical Specifications
01101100.8250
01101110.8125
01110000.8000
01110010.7875
01110100.7750
01110110.7625
01111000.7500
01111010.7375
01111100.7250
01111110.7125
10000000.7000
10000010.6875
10000100.6750
10000110.6625
10001000.6500
10001010.6375
10001100.6250
10001110.6125
10010000.6000
10010010.5875
10010100.5750
10010110.5625
10011000.5500
10011010.5375
10011100.5250
10011110.5125
10100000.5000
10100010.4875
10100100.4750
10100110.4625
10101000.4500
10101010.4375
10101100.4250
10101110.4125
10110000.4000
10110010.3875
10110100.3750
10110110.3625
Table 2. Voltage Identification Definition (Sheet 3 of 4)
VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)
Electrical Specifications
24 Datasheet
3.4 Catastrophic Thermal Protection
The processor supports the THERMTRIP# signal for catastrophic thermal protection. An
external thermal sensor should also be used to protect the processor and the system
against excessive temperatures. Even with the activation of THERMTRIP#, which halts
all processor internal clocks and activity, leakage current can be high enough such that
the processor cannot be protected in all conditions without the removal of power to the
processor. If the external thermal sensor detects a catastrophic processor temperature
of 125°C (maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the
processor must be turned off within 500 ms to prevent permanent silicon damage due
to thermal runaway of the processor.
10111000.3500
10111010.3375
10111100.3250
10111110.3125
11000000.3000
11000010.2875
11000100.2750
11000110.2625
11001000.2500
11001010.2375
11001100.2250
11001110.2125
11010000.2000
11010010.1875
11010100.1750
11010110.1625
11011000.1500
11011010.1375
11011100.1250
11011110.1125
11100000.1000
11100010.0875
11100100.0750
11100110.0625
11101000.0500
11101010.0375
11101100.0250
11101110.0125
Table 2. Voltage Identification Definition (Sheet 4 of 4)
VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)
Datasheet 25
Electrical Specifications
3.5 Signal Terminations and Unused Pins
All RSVD (RESERVED) pins must remain unconnected. Connection of these pin s to VCC,
VSS, or to any other signal (including each other) can result in component malfunction
or incompatibility with future processors. See Section 4.2 for a pin listing of the
processor and the location of all RSVD pins.
For reliable operation, always connect unused inputs or bidirectional signals to an
appropriate signal level. Unused active low AGTL+ inputs may be left as no connects if
AGTL+ termination is provided on the processor silicon. Unused active high inputs
should be connected through a resistor to ground (VSS). Unused outputs can be left
unconnected.
The TEST1 pin must have a stuffing option conn ection to VSS. The TEST2 pin must have
a 51 Ω ±5%, pull-down resistor to VSS.
3.6 FSB Frequency Select Signals (BSEL[2:0])
The BSEL[2:0] signals are used to select the frequency of the processor input clock
(BCLK[1:0]). These signals should be connected to the clock chip and the Mobile Intel
945 Express Chipset family on the platform. The BSEL encoding for BCLK[1:0] is shown
in Table 3:
3.7 FSB Signal Groups
In order to simplify the following discussion, the FSB signals have been combined into
groups by buffer type. AGTL+ input signals have differential input buffers, which use
GTLREF as a reference level. In this document, the term “AGTL+ Input” refers to the
AGTL+ input group as well as the AGTL+ I/O group when receiving. Similarly, “AGTL+
Output” refers to the AGTL+ output group as well as the AGTL+ I/O group when
driving.
With the implementation of a source synchronous data bus comes the need to specify
two sets of timing parameters. One set is for common clock signals which are
dependant upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second
set is for the source synchronous signals which are relative to their respective strobe
lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are
still present (A20M#, IGNNE#, etc.) and can become active at any time during the
clock cycle. Table 4 identifies which signals are common clock, source synchronous,
and asynchronous.
Table 3. BSEL[2:0] Encoding for BCLK Frequency
BSEL[2] BSEL[1] BSEL[0] BCLK
Frequency
L L L RESERVED
L L H 133 MHz
L H L RESERVED
L H H 166 MHz
Electrical Specifications
26 Datasheet
NOTES:
1. Refer to Table 17 for signal descriptions and termination requirements.
2. In processor systems wh ere there is no debug port implemented on the system board, these signals are
used to support a debug port interposer. In systems with the debug port implemented on the system
board, these signals are no connects.
3. BPM[2:1]# and PRDY# are AGTL+ output only signals.
4. PROCHOT# signal type is open drain output and CMOS input.
Table 4. FSB Pin Groups
Signal Group Type Signals1
AGTL+ Common Clock Input Synchronous to
BCLK[1:0] BPRI#, DEFER#, DPWR#, PREQ#, RESET#, RS[2:0]#,
TRDY#
AGTL+ Common Clock I/O Synchronous to
BCLK[1:0] ADS#, BNR#, BPM[3:0]#3, BR0#, DBSY#, DRDY#, HIT#,
HITM#, LOCK#, PRDY#3
AGTL+ Source Synchronous I/O Synchronous to
Assoc. Strobe
AGTL+ Strobes Synchronous to
BCLK[1:0] ADSTB[1:0] #, DSTBP[3:0]#, DSTBN[3:0]#
CMOS Input Asynchronous A20M#, DPRSTP#, DPSLP#, IGNNE#, INIT#, LINT0/INTR,
LINT1/NMI, PWRGOOD, SMI#, SLP#, STPCLK#
Open Drain Output Asynchronous FERR#, IERR#, THERMTRIP#
Open Drain I/O Asynchronous PROCHOT#4
CMOS Output Asynchronous PSI#, VID[6:0], BSEL[2: 0]
CMOS Input Synchronous to
TCK TCK, TDI, TMS, TRST#
Open Drain Output Synchronous to
TCK TDO
FSB Clock Clock BCLK[1:0]
Power/Other COMP[3:0], DBR#2, GTLREF, RSVD, TEST2, TEST1,
THERMDA, THERMDC, VCC, VCCA, VCCP, VCCSENSE, VSS,
VSSSENSE
Signals Associated Strobe
REQ[4:0]#, A[16:3]# ADSTB[0]#
A[31:17]# ADSTB[1]#
D[15:0]#, DINV 0# DSTBP0#, DSTBN0#
D[31:16]#, DINV1# DSTBP1#, DSTBN1#
D[47:32]#, DINV2# DSTBP2#, DSTBN2#
D[63:48]#, DINV3# DSTBP3#, DSTBN3#
Datasheet 27
Electrical Specifications
3.8 CMOS Signals
CMOS input signals are shown in Table 4. Legacy output FERR#, IERR# and other non-
AGTL+ signals (THERMTRIP# and PROCHOT#) utilize Open Drain output buffers. These
signals do not have setup or hold time specifications in relation to BCLK[1:0]. However,
all of the CMOS signals are required to be asserted for at least three BCLKs in order for
the processor to reco gnize them. See Section 3.10 for the DC specifications for the
CMOS signal groups.
3.9 Maximum Ratings
Table 5 specifies absolute maximum and minimum ratings. Only within specified
operation limits, can functionality and long-term reliability be expected.
At condition outside functional operation condition limits, but within absolute maximum
and minimum ratin gs, neither functionality nor long term reliability can be expected. If
a device is returned to conditions within functional operation limits after having been
subjected to conditions outside these limits, but within the absolute maximum and
minimum ratings, the device may be functional, but with its lifetime degraded on
exposure to conditions exceeding the functional operation condition limits.
At conditions exceeding absolute max imum and minimum r atings, neither functionality
nor long term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from electro static
discharge, precautions should always be taken to avoid high static voltages or electric
fields.
NOTES:
1. This rating applies to any processor pin.
2. Contact Intel for storage requirements in excess of one year.
Table 5. Processor DC Absolute Maximum Ratings
Symbol Parameter Min Max Unit Notes
TSTORAGE Processor Storage Temperature -40 85 °C 2
VCC Any Processor Supply Voltage with Respect to VSS -0.3 1.6 V 1
VinAGTL+ AGTL+ Buffer DC Input Voltage with Respect to VSS -0.3 1.6 V 1, 2
VinAsynch_CMOS CMOS Buffer DC iNput Voltage with Respect to VSS -0.3 1.6 V 1, 2
Electrical Specifications
28 Datasheet
3.10 Processor DC Specificatio ns
The processor DC specifications in this section are defined at the processor
core (pads) unless noted otherwise. See Table 4 for the pin signal definitions and
signal pin assignments. Most of the signals on the FSB are in the AGTL+ signal group.
The DC specifications for these signals are listed in Table 12. DC specifications for the
CMOS group are listed in Table 13.
Table 6 through Table 14 list the DC specifications for the processor and are valid only
while meeting specifications for junction temperature, clock frequency, and input
voltages. The Highest Frequency Mode (HFM) and Lowest Frequency Mode (LFM) refer
to the highest and lowest core operating frequencies supported on the processor. Active
mode load line specifications apply in all states except in the Deep Sleep and Deeper
Sleep states. VCC,BOOT is the default voltage driven by the voltage regulator at power
up in order to set the VID values. Unless specified otherwise, all specifications for the
processor are at Tjunction = 100°C. Care should be taken to read all notes associated
with each parameter.
Table 6. Voltage and Current Specifications for Intel Core Duo Processor SV (Standard
Voltage) (Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit Notes
VCCHFM VCC at Highest Frequency Mode (HFM) 1.1625 1.3 V 1, 2
VCCLFM VCC at Lowest Frequency Mode (LFM) 0.7625 1.0 V 1, 2
VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2, 8
VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2
VCCA PLL Supply Voltage 1.425 1.5 1.575 V
VCCDPRSLP VCC at Deeper Sleep Voltage 0.55 0.85 V 1, 2, 12
VCCDC4 VCC at Intel Enhanced Deeper Sleep
Voltage 0.50 0.80 V 1, 2
ICCDES ICC for Intel® Core™ Duo Processor SV
Recommended Design Target 36 A 5
ICC
ICC for Intel Core Duo Processor SV
Processor
Number Core Frequency/Voltage
T2700
T2600
T2500
T2400
T2300
T2300E
N/A
2.33 GHz and HFM VCC
2.16 GHz and HFM VCC
2.00 GHz and HFM VCC
1.83 GHz and HFM VCC
1.66 GHz and HFM VCC
1.66 GHz and HFM VCC
1 GHz and LFM VCC
34
34
34
34
34
34
15.5
A3,12,13
IAH,
ISGNT
ICC Auto-Halt & Stop-Grant
LFM
HFM 12.5
23.3 A3,4
ISLP
ICC Sleep
LFM
HFM 12.4
23.2 A3,4
Datasheet 29
Electrical Specifications
NOTES:
1. Each process o r is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Intel Thermal
Monitor 2, Enhanced Intel SpeedStep Technology, or C1E).
2. The voltage specifications are assumed to be measured across VCCSENSE and VSSSENSE pins at socket with a
100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not couple d in the scope pr obe.
3. Specified at 100°C Tj .
4. Specified at the VID voltage.
5. The ICCDES(max) specification of 36 A comprehends only Intel Core Duo processor SV HFM frequencies.
Platforms should be designed to 44 A to be compatible with next generation processor.
6. Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal VCC. Not 100% tested.
7. Measured at the bulk capacitors on the motherboard.
8. VCC, boot tolerance is shown in Figure 3.
9. This is a stea dy-state ICCP current spec ification, which i s applicable when both VCCP and VCC core are high.
10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC core is low.
11. Specified at the nominal VCC.
12. If a give n Operating Systems C-State model is not based on the use of MWAIT or I/O Redirection, the
processor Deeper Sleep VID will be same as LFM VID.
13. T2300E does not support Intel Virtualization Technology.
IDSLP
ICC Deep Sleep
LFM
HFM 11.8
20.9 A3, 4
IDPRSLP ICC Deeper Sleep 7.6 A 3, 4
IDC4 ICC Intel Enhanced Deeper Sleep 6.7 A 4
dICC/DT VCC Power Supply Current Slew Rate at
CPU Package Pin 600 A/µs 6, 7
ICCA ICC for VCCA Supply 120 mA
ICCP ICC for VCCP Supply before VCC Stable
ICC for VCCP Supply after VCC Stable 6.0
2.5 A
A10
9
Table 6. Voltage and Current Specifications for Intel Core Duo Processor SV (Standard
Voltage) (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit Notes
Electrical Specifications
30 Datasheet
NOTES:
1. Each processor is programmed with a maximum valid voltage identificat ion value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibr ated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Intel Thermal
Monitor 2, Enhanced Intel SpeedStep Technology, or C1E).
2. The voltage specifications are assumed to be measured across VCCSENSE and VSSSENSE pins at socket with a
100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1 -MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not coupled in the scope probe.
3. Specified at 100°C Tj.
4. Specified at the VID voltag e.
5. The ICCDES(max) specification of 36 A comprehe nds only Intel Core Solo processor SV HFM frequencies.
Table 7. Voltage and Current Specifications for Intel Core Solo Processor SV (Standard
Voltage)
Symbol Parameter Min Typ Max Unit Notes
VCCHFM VCC at Highest Frequency Mode (HFM) 1.1625 1.3 V 1, 2
VCCLFM VCC at Lowest Frequency Mode (LFM) 0.7625 1.0 V 1, 2
VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2, 8
VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2
VCCA PLL Supply Voltage 1.425 1.5 1.575 V
VCCDPRSLP VCC at Deeper Sleep Voltage 0.55 0.85 V 1, 2, 1 2
VCCDC4 VCC at Intel Enhanced Deeper Sleep Voltage 0.50 0 .80 V 1, 2
ICCDES ICC for Intel® Core™ Solo Processor SV 36 A 5
ICC
ICC for Intel Core Solo Processor SV
Processor
Number Core Frequency/Voltage
T1400
T1300
N/A
1.83 GHz and HFM VCC
1.66 GHz and HFM VCC
1 GHz and LFM VCC
34
15.5 A 3,11
IAH,
ISGNT
ICC Auto-Halt & Stop-Grant
LFM
HFM 12.5
23.3 A3,4
ISLP
ICC Sleep
LFM
HFM 12.4
23.2 A3,4
IDSLP
ICC Deep Sleep
LFM
HFM 11.8
20.9 A3,4
IDPRSLP ICC Deeper Sleep 7.6 A 3,4
IDC4 ICC Intel Enhanced Deeper Sleep 6.7 A 4
dICC/DT VCC Power Supply Current Slew Rate at CPU
Package Pin 600 A/µs 6, 7
ICCA ICC for VCCA Supply 120 mA
ICCP ICC for VCCP Supply before Vcc Stable
ICC for VCCP Supply after Vcc Stable 6.0
2.5 A
A10
9
Datasheet 31
Electrical Specifications
6. Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal VCC. Not 100% tested.
7. Measured at the bulk capacitors on the motherboard.
8. VCC, boot tolerance is shown in Figure 3.
9. This is a steady-state Iccp current specification, which is applicable when both VCCP and Vcc core are high.
10. This is a power-up peak current specification, which is applicable when VCCP is high and Vcc core is low.
11. Specified at the nominal VCC.
12. If a given Operating System C-State model is not based on the use of MWAIT or I/O Redirection, the
processor Deeper Sleep VID will be same as LFM VID.
Table 8. Voltage and Current Specifications for Intel Core Duo Processor LV (Low
Voltage)
Symbol Parameter Min Typ Max Unit Notes
VCCHFM VCC at Highest Frequency Mode (HFM) 1.0000 1.2125 V 1, 2, 3
VCCLFM VCC at Lowest Frequency Mode (LFM) 0.7625 1.0000 V 1, 2, 3
VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2, 8
VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2
VCCA PLL Supply Voltage 1.425 1.5 1.575 V
VCCDPRSLP VCC at Deeper Sleep Voltage 0.55 0.85 V 1, 2, 12
VCCDC4 VCC at Intel® Enhanced Deeper Sleep
Voltage 0.50 0.80 V 1, 2
ICCDES ICC for Intel® Core™ Duo Processor LV 19 A 5
ICC
Icc for Intel Core Duo Processor LV
Processor
Number Core Frequency/Voltage
L2500
L2400
L2300
N/A
1.83 GHz and HFM VCC
1.66 GHz and HFM VCC
1.50 GHz and HFM VCC
1 GHz and LFM VCC
19
19
19
15.5
A3,11
IAH,
ISGNT
ICC Auto-Halt & Stop-Grant
LFM
HFM 12.5
13.5 A3,4
ISLP
ICC Sleep
LFM
HFM 12.4
13.3 A3,4
IDSLP
ICC Deep Sleep
LFM
HFM 11.8
12.0 A3,4
IDPRSLP ICC Deeper Sleep 7.6 A 3,4
IDC4 ICC Intel Enhanced Deeper Sleep 6.7 A 4
dICC/DT VCC Power Supply Current Slew Rate at
CPU Package Pin 600 A/µs 6, 7
ICCA ICC for VCCA Supply 120 mA
ICCP ICC for VCCP Supply before VCC Stable
ICC for VCCP Supply after VCC Stable 6.0
2.5 A
A10
9
Electrical Specifications
32 Datasheet
NOTES:
1. Each processor is programmed with a maximum valid voltage identificat ion value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibr ated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Intel Thermal
Monitor 2, Enhanced Intel SpeedStep Technology, or C1E).
2. The voltage specifications are assumed to be measured across VCCSENSE and VSSSENSE pins at socket with a
100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1 -MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not coupled in the scope probe.
3. Specified at 100°C Tj.
4. Specified at the VID voltag e.
5. The ICCDES(max) specification of 19 A comprehe nds only Intel Core Duo processor LV HFM frequencies.
6. Based on simulati ons and averaged over the duration of any change in current. Specified by design/
characterization at nominal VCC. Not 100% tested.
7. Measured at the bulk capacitors on the motherboard.
8. VCC, boot tolerance is shown in Figure 3.
9. This is a steady-state Iccp current specification, which is applicable when both VCCP and VCC core are high.
10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC core is low.
11. Specified at the nominal VCC.
12. If a given Operating System C-State model is not based on the use of MWA IT or I/O Redirection, the
processor Deeper Sleep VID will be same as LFM VID.
Table 9. Voltage and Current Specifications Intel Core Duo Processor Ultra Low Voltage
(ULV) (Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit Notes
VCCHFM VCC at Highest Frequency Mode (HFM) 0.85 1.1 V 1, 2
VCCLFM VCCat Lowest Frequency Mode (LFM) 0.8 1.0 V 1, 2
VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2, 7, 9
VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2
VCCA PLL Supply Voltage 1.425 1.5 1.575 V
VCCDPRSLP VCC at Deeper Sl eep voltage 0.55 0.85 V 1, 2, 13
VCCDC4 VCC at Intel® Enhanced Deeper Sleep Voltage 0.5 0.8 V
ICCDES ICC for Intel® Core™ Duo Processor ULV 14 A 5
ICC
Icc for Intel Core Duo Processor ULV
Processor
Number Core Frequency/Voltage
U2500
U2400
N/A
1.20 GHz and HFM VCC
1.06 GHz and HFM VCC
800 MHz and LFM VCC
13.9
13.9
10.5 A3, 12
IAH,
ISGNT
ICC Auto-Ha lt & Stop-Grant
LFM
HFM 5.4
6.4 A3,4
ISLP
ICC Sleep
LFM
HFM 5.3
6.3 A3,4
IDSLP
ICC Deep Sleep
LFM
HFM 4.8
5.4 A3,4
IDPRSLP ICC Deeper Sleep 3.6 A 4
Datasheet 33
Electrical Specifications
NOTES:
1. Each process o r is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and can not be altered. Individual maximum VID values are calibrated during
manufacturing such that two processors at the same frequency may have different settings within the VID
range. Note that this differs from the VID employed by the proc essor during a power management event
(Thermal Monitor 2, Enhanced Intel SpeedStep technology, or C1E).
2. The voltage specifications are assumed to be measured across VCCSENSE and VSSSENSE pins at socket with a
100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not couple d in the scope pr obe.
3. Specified at 100°C Tj .
4. Specified at the VID voltage.
5. The ICCDES(max) specification of 14 A comprehends Intel Core Duo processor ultra low voltage HFM
frequencies.
6. Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal VCC. Not 100% tested.
7. Reserved.
8. Measured at the bulk capacitors on the motherboard.
9. VCC, boot tolerance is shown in Figure 3.
10. This is a steady-state Iccp current specification, which is applicable when both VCCP and VCC_CORE are high.
11. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low.
12. Specified at the nominal VCC.
13. If a given Operating System C-State model is not based on the use of MWAIT or I/O Redirection, the
processor Deeper Sleep VID will be same as LFM VID.
IDC4 ICCC Intel Enhanced Deeper Sleep 3.3 A 4
dICC/DT VCC Power Supply Current Slew Rate at CPU
Package Pin 600 A/µs 6, 8
ICCA ICC for VCCA Supply 120 mA
ICCP ICC for VCCP Supply before VCC Stable
ICC for VCCP supply after VCC Stable 6.0
2.5 A
A11
10
Table 10. Voltage and Current Specifications for Intel Core Solo Processor ULV (Ultra
Low Voltage) (Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit Notes
VCCHFM VCC at Highest Frequency Mode (HFM) 0.85 1.1 V 1, 2
VCCLFM VCC at Lowest Frequency Mode (LFM) 0.8 1.0 V 1, 2
VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2 , 8
VCCP AGTL+ Termination Voltage 0.997 1.05 1.102 V 2
VCCA PLL Supply Voltage 1.425 1.5 1.575 V
VCCDPRSLP VCC at Deeper Sleep Voltage 0.55 0.85 V 1, 2, 12
VCCDC4 VCC at Intel Enhanced Deeper Sleep
Voltage 0.50 0.80 V 1, 2
ICCDES ICC for Intel® Core™ Solo Processor ULV 8 A 5
Table 9. Voltage and Current Specifications Intel Core Duo Processor Ultra Low Voltage
(ULV) (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit Notes
Electrical Specifications
34 Datasheet
NOTES:
1. Each processor is programmed with a maximum valid voltage identificat ion value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibr ated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Intel Thermal
Monitor 2, Enhanced Intel SpeedStep Technology, or C1E).
2. The voltage specifications are assumed to be measured across VCCSENSE and VSSSENSE pins at socket with a
100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1 -MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not coupled in the scope probe.
3. Specified at 100°C Tj.
4. Specified at the VID voltag e.
5. This specification comprehends Intel Core Duo processor ULV processor HFM frequencies.
6. Based on simulati ons and averaged over the duration of any change in current. Specified by design/
characterization at nominal VCC. Not 100% tested.
7. Measured at the bulk capacitors on the motherboard.
8. Vcc, boot tolerance is shown in Figure 5.
9. This is a steady - state I CCP current specification, which is applicable when both VCCP and VCC_CORE are high.
10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low.
11. Specified at the nominal VCC.
12. If a given Operating System C-State model is not based on the use of MWA IT or I/O Redirection, the
processor Deeper Sleep VID will be same as LFM VID.
ICC
ICC for Intel Core Solo Processor ULV
Processor
Number Core Frequency/Voltage
U1500
U1400
U1300
N/A
1.33 GHz and HFM VCC
1.20 GHz and HFM VCC
1.06 GHz and HFM VCC
800 MHz and LFM VCC
8
8
8
6.4
A3,11
IAH,
ISGNT
ICC Auto-Halt & Stop-Grant
LFM
HFM 3.9
4.6 A3,4
ISLP
ICC Sleep
LFM
HFM 3.8
4.5 A3,4
IDSLP
ICC Deep Sleep
LFM
HFM 3.3
3.6 A3,4
IDPRSLP ICC Deeper Sleep 2.4 A 3,4
IDC4 ICC Intel Enhanced Deeper Sleep 2.3 A 4
dICC/DT VCC Power Supply Current Slew Rate at
CPU Package Pin 600 A/µs 6, 7
ICCA ICC for VCCA Supply 120 mA
ICCP ICC for VCCP Supply before VCC Stable
ICC for VCCP Supply after VCC Stable 6.0
2.5 A
A10
9
Table 10. Voltage and Current Specifications for Intel Core Solo Processor ULV (Ultra
Low Voltage) (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit Notes
Datasheet 35
Electrical Specifications
Figure 3. Active VCC and ICC Loadline for Intel Core Duo Processor (SV, LV & ULV) and
Intel Core Solo Processor SV
ICC m ax {HFM|LFM}
VCC [V]
VCC nom {HFM|LFM}
+/-VCC nom * 1.5%
= VR St. Pt. Error 1/
VCC, DC min {HFM|LFM}
VCC, DC max {HFM|LFM}
VCC max {HFM|LFM}
VCC min {HFM|LFM}
10m V= RIPPLE
ICC [A ]
0
Slope = -2.1 mV/A at package
VccSense, VssSense pins.
Differential Remote Sense required.
Note 1/ VCC Set Point Error Tolerance is per below:
Tolerance VCC Act ive Mode VI D Code Range
--------------- --------------------------------------------------------
+/-1.5% VCC > 0.75 00 V (VID 0111100).
+/-11.5mV VCC < 0.7 5 00 V (V ID 0111100)
Electrical Specifications
36 Datasheet
NOTE: For low voltage, if PSI# is not asserted, then the 13-mV ripple allowance becomes 10 mV.
Figure 4. Deeper Sleep VCC and ICC Loadline for Intel Core Duo Processor (SV, LV & U LV)
and Intel Core Solo Processor SV
ICC-CORE max
{Deeper Sleep}
VCC-CORE [V]
VCC-CORE nom
{Deeper Sleep}
+/-VCC-CORE Tolerance
= VR St. Pt. Error 1/
VCC-CORE, DC min
{Deeper Sleep}
VCC-CORE, DC max
{Deeper Sleep}
VCC-CORE max {Deeper Sleep}
VCC-CORE min {Deeper Sleep}
13mV= RIPPLE
for PSI# Ass e rted
ICC-CORE
[A]
0
Slope = -2.1 mV/A at package
VccSense, VssSense pins.
Differential Remote Sense required.
Note 1/ Deeper Sleep VCC-CORE Set Point Error Tolerance is per below:
Tolerance - PSI# Ripple VCC-CORE VID Voltage Range
------------------------------ --------------------------------------------------------
+/-[(VID*1.5%) - 3 mV] VCC-CORE > 0.7500V
+/-(11.5 mV - 3 mV) 0.7500V < VCC-CORE <0.5000V
+/- (25 mV - 3 mV) 0.5000V < VCC-CORE <0.4125V
Datasheet 37
Electrical Specifications
Figure 5. Active VCC and ICC Loadline for Intel Core Solo Processor ULV
ICC-CORE max
{HFM|LFM}
VCC-CORE [V]
VCC-CORE nom {HFM |LFM}
+/-VCC-CORE Tolerance
= VR St. Pt. Error 1/
VCC-CORE, DC min {HFM|LFM}
VCC-CORE, DC max {HFM|LFM}
VCC-CORE max {HFM|LFM}
VCC-CORE min {HFM|LFM}
10m V= R IPPLE
0
Slope = -5.1 mV /A at package
VccS ense, VssSense pins.
D iffere n tia l Remo te Sen s e r e q u ired.
Not e 1 / VCC-CORE Set Poi nt Er r or Tol er ance i s per bel ow :
Tolerance VCC-CORE VID Volt age Range
--------------- --------------------------------------------------------
+/ -1 .5 % VCC-CORE > 0. 7500V
+/ -1 1.5 mV 0. 75000V < VCC-CORE <0.5000V
Electrical Specifications
38 Datasheet
Figure 6. Deeper Sleep VCC and ICC Loadline for Intel Core Solo Processor ULV
ICC-CORE max
{Deeper Sleep}
VCC-CORE [V]
VCC-CORE nom
{Deeper Sleep}
+/-VCC-CORE Tolerance
= V R S t. P t. E rro r 1 /
VCC-CORE, DC min
{Deeper Sleep}
VCC-CORE, DC max
{Deeper Sleep}
VCC-CORE m ax {Deeper Sleep}
VCC-CORE m in {Deeper Sleep}
10 m V= RIPPLE
ICC-CORE
[A]
0
Slope = -5.1 m V/A at package
VccSense, VssSense pins.
D ifferential Rem ote Sense required.
Note 1/ Deeper Sleep VCC-CORE Set Point Er ror Tolerance is per below:
Tolerance VCC-CORE VID Voltage Range
------------------------------ --------------------------------------------------------
+/- (VID*1.5%) VCC-CORE > 0.7500V
+/- 11.5 mV 0.7500V < VCC-CORE <0.5000V
+/- 25 mV 0.5000V < VCC-CORE <0.4125V
Datasheet 39
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the falling edge of
BCLK1.
3. Threshold Region is defined as a region entered about the crossing voltage in which the differential receiver
switches. It includes input threshold hysteresis.
4. For Vin between 0 V and VIH.
5. Cpad includes die capacitance only. No package parasitics are included.
6. ΔVCROSS is defined as the total variation of all crossing voltages as defined in note 2.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low
value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the
signal quality specifications.
5. This is the pull-down driver r esistance.
6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider. Tolerance of resistor divider
decides the tolerance of GTLREF. The VCCP referred to in these specifications is the instantaneous VCCP.
7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver.
8. Specified with on die RTT and RON are turned off.
9. Cpad includes die capacitance only. No package parasitics are included.
10. This spec applies to all AGTL+ signals except for PREQ#. RTT for PREQ# is between 1.5 kΩ to 6.0 kΩ.
Table 11. FSB Differ ential BCL K Specifi c ations
Symbol Parameter Min Typ Max Unit Notes1
VIL Input Low V oltage 0 V
VIH Input High Voltage 0.660 0.710 0.85 V
VCROSS Crossing Voltage 0.25 0.35 0.55 V 2
ΔVCROSS Range of Crossing Points 0.14 V 6
VTH Threshold Region VCROSS -0.100 VCROSS+0.100 V 3
ILI Input Leakage Current ± 100 µA 4
Cpad Pad Capacitance 0.95 1.2 1.45 pF 5
Table 12. AGTL+ Signal Group DC Specifications
Symbol Parameter Min Typ Max Unit Notes1
VCCP I/O Voltage 0.997 1.05 1.102 V
GTLREF Reference Voltage 2/3 VCCP V6
VIH Input High Voltage GTLREF+0.1 VCCP+0.1 V 3,6
VIL Input Low Voltage -0.1 0 GTLREF-0.1 V 2,4
VOH Output H igh Voltage VCCP 6
RTT Termination Re sistance 50 55 61 Ω 7,10
RON Buffer on Resistance 22.3 25.5 28.7 Ω5
ILI Input Leakage Current ± 100 µA 8
Cpad Pad Capacitance 1.8 2.3 2.75 pF 9
Electrical Specifications
40 Datasheet
.
NOTES:
1. Unless ot herwise noted, all specificat ions in this ta ble apply to all proc essor frequenc ies.
2. The VCCP referred to in these specifications refers to instantaneous VCCP.
3. Reserved.
4. Measured at 0.1*VCCP.
5. Measured at 0.9*VCCP.
6. For Vin between 0 V and VCCP. Measured when the driver is tristated.
7. Cpad1 includes die capacitance only for DPRSTP#, DPSLP#,PWRGOOD. No package parasitics are included.
8. Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics are included.
NOTES:
1. Unless ot herwise noted, all specificat ions in this ta ble apply to all proc essor frequenc ies.
2. Measured at 0.2*VCCP.
3. VOH is determined by value of the external pullup resistor to VCCP. Please contact y our Intel repres entat iv e
for details.
4. For Vin between 0 V and VOH.
5. Cpad includes die capacitance only. No package parasitics are included.
§
Table 13. CMOS Signal Group DC Specifications
Symbol Parameter Min Typ Max Unit Notes1
VCCP I/O Voltage 1.0 1.05 1.10 V
VIL Input Low Voltage CMOS -0.1 0.0 0.33 V 2, 3
VIH Input High Voltage 0.7 1.05 1.20 V 2
VOL Output Low Voltage -0.1 0 0.11 V 2
VOH Output High Voltage 0.9 VCCP 1.20 V 2
IOL Output Low Curren t 1.3 4.1 mA 4
IOH Output High Current 1.3 4.1 mA 5
ILI Input Leakage Current ±100 µA 6
Cpad1 Pad Capacitance 1.8 2.3 2.75 pF 7
Cpad2 Pad Capacitance for CMOS Input 0.95 1.2 1.45 pF 8
Table 14. Open Drai n Signa l Group DC Specifications
Symbol Parameter Min Typ Max Unit Notes1
VOH Output High Voltage 1.0 1.05 1.10 V 3
VOL Output Low Voltage 0 0.20 V
IOL Output Low Current 11.40 50 mA 2
ILeak Output Leakage Current ±200 µA 4
Cpad Pad Capacitance 1.8 2.3 2.75 pF 5
Datasheet 41
Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin
Information
4.1 Package Mechanical Specifications
The Intel Core Duo processor and Intel Core Solo processor are available in 478-pin
Micro-FCPGA and 479-ball Micro-FCBGA packages. The package mechanical dimensions
are shown in Figure 7 through Figure 10. Table 15 (two sheets) shows a top-view of
package pin-out with their functionalities.
Warning: The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors
are electrically conductive, care should be tak en to avoid contacting the capacitors with
other electrically conductive materials on the motherboard. Doing so may short the
capacitors, and possibly damage the device or render it inactive.
4.1.1 Package Mechanical Drawings
Different views showing all pertinent dimensions of the Micro-FCPGA package are
shown in Figure 7 and continued in Figure 8. Views and pertinent dimensions for Micro-
FCBGA package are shown in Figure 9 and continued in Figure 10.
Package Mechanical Specifications and Pin Information
42 Datasheet
Figure 7. Micro-FCPGA Processor Package Drawing (Sheet 1 of 2)
Datasheet 43
Package Mechanical Specifications and Pin Information
Figure 8. Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)
Package Mechanical Specifications and Pin Information
44 Datasheet
Figure 9. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)
Datasheet 45
Package Mechanical Specifications and Pin Information
Figure 10. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)
Package Mechanical Specifications and Pin Information
46 Datasheet
4.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted in the keep-
out areas. The location and quantity of the capacitors may change, but will remain
within the component keep-in. See Figure 7 and Figure 9 for keep-out zones.
4.1.3 Package Loading Specifications
Maximum mechanical package loading specifications are given in Figure 7 and Figure 9.
These specifications are static compressive loading in the direction normal to the
processor. This maximum load limit should not be exceeded during shipping conditions,
standard use condition, or by thermal solution. In addition, there are additional load
limitations against transient bend, shock, and tensile loading. These limitations are
more platform specific, and should be obtained by contacting your field support.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for thermal and mechanical solution.
4.1.4 Processor Mass Specifications
The typical mass of the processor is given in Figure 7 and Figure 9. This mass includes
all the components that are included in the package.
Datasheet 47
Package Mechanical Specifications and Pin Information
4.2 Processor Pinout and Pin List
Table 15 shows the top view pinout of the processor. The pin list arranged in two
different formats is shown in the following pages.
Table 15. The Coordinates of the Processor Pins as Viewed from the Top of the Package
(Sheet 1 of 2)
1 2345678910111213
ASMI# VSS FERR# A20M# VCC VSS VCC VCC VSS VCC VCC A
BRESET# RSVD INIT# LINT1 DPSLP# VSS VCC VSS VCC VCC VSS VCC VSS B
CRSVD VSS RSVD IGNNE
#VSS LINT0 THERM
TRIP# VSS VCC VCC VSS VCC VCC C
DVSS RSVD RSVD VSS STPCLK
#PWRGO
OD SLP# VSS VCC VCC VSS VCC VSS D
EDBSY# BNR# VSS HITM# DPRSTP
#VSS VCC VSS VCC VCC VSS VCC VCC E
FBR0# VSS RS[0]# RS[1]# VSS RSVD VCC VSS VCC VCC VSS VCC VSS F
GVSS TRDY# RS[2]# VSS BPRI# HIT# G
HADS# REQ[1]
#VSS LOCK# DEFER# VSS H
JA[9]# VSS REQ[3]
#A[3]# VSS VCCP J
KVSS REQ[2]
#REQ[0]
#VSS A[6]# VCCP K
LA[13]# ADSTB[
0]# VSS A[4]# REQ[4]
#VSS L
MA[7]# VSS A[5]# RSVD VSS VCCP M
NVSS A[8]# A[10]# VSS RSVD VCCP N
PA[15]# A[12]# VSS A[14]# A[11]# VSS P
RA[16]# VSS A[19]# A[24]# VSS VCCP R
TVSS RSVD A[26]# VSS A[25]# VCCP T
UCOMP[2] A[23]# VSS A[21]# A[18]# VSS U
VCOMP[3] VSS RSVD ADSTB
[1]# VSS VCCP V
WVSS A[30]# A[27]# VSS A[28]# A[20]# W
YA[31]# A[17]# VSS A[29]# A[22]# VSS Y
AA RSVD VSS RSVD RSVD VSS TDI VCC VSS VCC VCC VSS VCC VCC AA
AB VSS RSVD TDO VSS TMS TRST# VCC VSS VCC VCC VSS VCC VSS AB
AC PREQ# PRDY# VSS BPM[3]
#TCK VSS VCC VSS VCC VCC VSS VCC VCC AC
AD BPM[2]# VSS BPM[1]
#BPM[0]
#VSS VID[0] VCC VSS VCC VCC VSS VCC VSS AD
AE VSS VID[6] VID[4] VSS VID[2] PSI# VSS
SENSE VSS VCC VCC VSS VCC VCC AE
AF RSVD VID[5] VSS VID[3] VID[1] VSS VCC
SENSE VSS VCC VCC VSS VCC VSS AF
1 2345678910111213
Package Mechanical Specifications and Pin Information
48 Datasheet
Table 16. The Coordinates of the Processor Pins as Viewed from the Top of the Package
(Sheet 2 of 2)
14 15 16 17 18 19 20 21 22 23 24 25 26
AVSS VCC VSS VCC VCC VSS VCC BCLK[1] BCLK[0] VSS THRMDA THRMDC VSS A
BVCC VCC VSS VCC VCC VSS VCC VSS BSEL[0] BSEL[1] VSS RSVD VCCA B
CVSS VCC VSS VCC VCC VSS DBR# BSEL[2] VSS RSVD RSVD VSS TEST1 C
DVCC VCC VSS VCC VCC VSS IERR# PROC
HOT# RSVD VSS DPWR# TEST2 VSS D
EVSS VCC VSS VCC VCC VSS VCC VSS D[0]# D[7]# VSS D[6]# D[2]# E
FVCC VCC VSS VCC VCC VSS VCC DRDY# VSS D[4]# D[1]# VSS D[13]# F
GVCCP DSTBP[0]# VSS D[9]# D[5]# VSS G
HVSS D[3]# DSTBN[0]# VSS D[15]# D[12]# H
JVCCP VSS D[11]# D[10]# VSS DINV[0
]# J
KVCCP D[14]# VSS D[8]# D[17]# VSS K
LVSS D[21]# D[22]# VSS D[20]# D[29]# L
MVCCP VSS D[23]# DSTBN[1]# VSS DINV[1
]# M
NVCCP D[16]# VSS D[31]# DSTBP[1]# VSS N
PVSS D[25]# D[26]# VSS D[24]# D[18]# P
RVCCP VSS D[19]# D[28]# VSS COMP
[0] R
TVCCP RSVD VSS D[27]# D[30]# VSS T
UVSS D[39]# D[37]# VSS D[38]# COMP
[1] U
VVCCP VSS DINV[2]# D[34]# VSS D[35]# V
WVCCP D[41]# VSS DSTBN[2]# D[36]# VSS W
YVSS D[45]# D[42]# VSS DSTBP[2]# D[44]# Y
AA VSS VCC VSS VCC VCC VSS VCC D[51]# VSS D[32]# D[47]# VSS D[43]# A
A
AB VCC VCC VSS VCC VCC VSS VCC D[52]# D[50]# VSS D[33]# D[40]# VSS A
B
AC VSS VCC VSS VCC VCC VSS DINV[3
]# VSS D[48]# D[49]# VSS D[53]# D[46]# AC
A
DVCC VCC VSS VCC VCC VSS D[54]# D[59]# VSS DSTBN[3]# D[57]# VSS GTLREF A
D
AE VSS VCC VSS VCC VCC VSS VCC D[58]# D[55]# VSS DSTBP[3]# D[60]# VSS AE
AF VCC VCC VSS VCC VCC VSS VCC VSS D[62]# D[56]# VSS D[61]# D[63]# AF
14 15 16 17 18 19 20 21 22 23 24 25 26
Datasheet 49
Package Mechanical Specifications and Pin Information
4.3 Alphabetical Signals Reference
Table 17. Signal Description (Sheet 1 of 9)
Name Type Description
A[31:3]# Input/
Output
A[31:3]# (Address) define a 232-byte physical memory address
space. In sub-phase 1 of the address phase, these pin s transmit the
address of a transaction. In sub-phase 2, these pins transmit
transaction type information. These signals must connect the
appropriate pins of both agents on the Intel® Core™ Duo processor
and the Intel® Core™ Solo processor FSB. A[31:3]# are source
synchronous signa ls and are latched into the receiving buffers by
ADSTB[1:0]#. Address signals are used as straps which are
sampled before RESET# is deasserted.
A20M# Input
If A20M# (Address-20 Mask) is asserted, the processor ma sks
physical address bit 20 (A20#) before looking up a line in any
internal cache and before driving a read/write transaction on the
bus. Asserting A20M# emulates the 8086 processor's address
wrap-around at the 1-Mbyte boundary. Assertion of A20M# is only
supported in real mode.
A20M# is an asynchronous signal. However, to ensure recognition
of this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
ADS# Input/
Output
ADS# (Address Strobe) is asserted to indicate the validity of the
transaction address on the A[31:3]# and REQ[4:0]# pins. All bus
agents observe the ADS# activation to begin parity checking,
protocol checking, address decode, internal snoop, or deferred
reply ID match operations associated with the new transaction.
ADSTB[1:0]# Input/
Output
Address strobes are used to latch A[31:3]# and REQ[4:0]# on their
rising and falling edges. Strobes are associated with signals as
shown below.
BCLK[1:0] Input
The differential pair BCLK (Bus Clock) determines the FSB
frequency. All FSB agents must receive these signals to drive their
outputs and latch their inputs.
All external timing parameters are specified with respect to the
rising edge of BCLK0 crossing VCROSS.
BNR# Input/
Output
BNR# (Block Next R e quest) is used to assert a bus stall by any bus
agent who is unable to accept new bus transactions. During a bus
stall, the current bus owner cannot issue any new transactions.
Signals Associated
Strobe
REQ[4:0]#, A[16:3]# ADSTB[0]#
A[31:17]# ADSTB[1]#
Package Mechanical Specifications and Pin Information
50 Datasheet
BPM[2:1]#
BPM[3,0]#
Output
Input/
Output
BPM[3:0]# (Breakpoint Monitor) are breakpoint and performance
monitor signals. They are outputs from the processor which indicate
the status of breakpoints and programmable counters used for
monitoring processor performance. BPM[3:0]# should connect the
appropriate pins of all processor FSB agents.This includes debug or
performance monitoring tools.
Please contact your Intel representative for more detailed
information.
BPRI# Input
BPRI# (Bus Priority Request) is used to arbitrate for ownership of
the FSB. It must connect the appropriate pins of both FSB agents.
Observing BPRI# active (as asserted by the priority agent) causes
the other agent to stop issuing new requests, unless such requests
are part of an ongoing locked operation. The priority agent keeps
BPRI# asserted until all of its requests are completed, then releases
the bus by deasserting BPRI#.
BR0# Input/
Output
BR0# is used by the processor to request the bus. The arbitration is
done between the processor (Symmetric Agent) and the Mobile
Intel® 945 Express Chipset family (High Priority Agent).
BSEL[2:0] Output
BSEL[2:0] (Bus Select) are used to select the processor input clock
frequency. Table 3 defines the possible combinations of the signals
and the frequency associated with each combination. The required
frequency is determined by the processor, chipset and clock
synthesizer. All agents mus t operate at the same frequency. The
processor operates at 667-MHz or 533-MHz system bus frequency
(166-MHz or 133-MHz BCLK[1:0] frequency, respectively).
COMP[3:0] Analog COMP[3:0] must be terminated on the system board using
precision (1% tolerance) resistors. Please contact your Intel
representative for more implementation details.
Table 17. Signal Description (Sheet 2 of 9)
Name Type Description
Datasheet 51
Package Mechanical Specifications and Pin Information
D[63:0]# Input/
Output
D[63:0]# (Data) are the data signals. These signals provide a 64-
bit data path between the FSB agents, and must connect the
appropriate pins on both agents. The data driver asserts DRDY# to
indicate a valid data transfer.
D[63:0]# are quad-pumped signals and will thus be driven four
times in a common clock period. D[63:0]# are latched off the
falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of
16 data signals correspond to a pair of one DSTBP# and one
DSTBN#. The following table shows the grouping of data signals to
data strobes and DINV#.
Furthermore, the DINV# pins determine the polarity of the data
signals. Each group of 16 data signals corresponds to one DINV#
signal. When the DINV# signal is active, the corresponding data
group is inverted and therefore sampled active high.
DBR# Output
DBR# (Data Bus Reset) is used only in processor systems where no
debug port is implemented on the system board. DBR# is used by a
debug port interposer so that an in-target probe can drive system
reset. If a debug port is implemented in the system, DBR# is a no
connect in the system. DBR# is not a processor signal.
DBSY# Input/
Output
DBSY# (Data Bus Busy) is asserted by the agent responsible for
driving data on the FSB to indicate that the data bus is in use. The
data bus is released after DBSY# is deasserted. This signal must
connect the appropriate pins on both FSB agents.
DEFER# Input
DEFER# is asserted by an agent to indicate that a transaction
cannot be guaranteed in-order completion. Assertion of DEFER# is
normally the responsibility of the addressed memory or Input/
Output agent. This signal must connect the appropriate pins of both
FSB agents.
Table 17. Signal Description (Sheet 3 of 9)
Name Type Description
Quad-Pumped Signal Groups
Data
Group DSTBN#/
DSTBP# DINV#
D[15:0]# 0 0
D[31:16]# 1 1
D[47:32]# 2 2
D[63:48]# 3 3
Package Mechanical Specifications and Pin Information
52 Datasheet
DINV[3:0]# Input/
Output
DINV[3:0]# (Data Bu s Inversion) are source synchronous and
indicate the polarity of the D[63:0]# signals. The DINV[3:0]#
signals are activated when the data on the data bus is inverted. The
bus agent will invert the data bus signals if more than half the bits,
within the covered group, would change level in the nex t cycle.
DPRSTP# Input
DPRSTP# when asserted on the platform causes the processor to
transition from the Deep Sleep State to the Deeper Sleep s tate. In
order to return to the Deep Sleep State, DPRSTP# must be
deasserted. DPRSTP# is driven by the I ntel® ICH7M chip set.
DPSLP# Input
DPSLP# when asserted on the platform causes the processor to
transition from the Sleep State to the Deep Sleep state. In order to
return to the Sleep State, DPSLP# must be deasserted. DPSLP# is
driven by the ICH7M chipset.
DPWR# Input DPWR# is a control signal from the Mobile Intel 945 Express
Chipset family used to reduce power on the processor data bus
input buffers.
DRDY# Input/
Output
DRDY# (Data Ready) is asserted by the data driver on each data
transfer, indicating valid data on the data bus. In a multi-common
clock data transfer, DRDY# may be deasserted to insert idle clocks.
This signal must conn ect the appropriate pins of both FSB agents.
DSTBN[3:0]# Input/
Output
Data strobe used to latch in D[63:0]#.
DSTBP[3:0]# Input/
Output
Data strobe used to latch in D[63:0]#.
Table 17. Signal Description (Sheet 4 of 9)
Name Type Description
DINV[3:0]# Assignment to Data Bus
Bus Signal Data Bus
Signals
DINV[3]# D[63:48]#
DINV[2]# D[47:32]#
DINV[1]# D[31:16]#
DINV[0]# D[15:0]#
Signals Associated
Strobe
D[15:0]#, DINV[0]# DSTBN[0]#
D[31:16]#, DINV[1]# DSTBN[1]#
D[47:32]#, DINV[2]# DSTBN[2]#
D[63:48]#, DINV[3]# DSTBN[3]#
Signals Associated
Strobe
D[15:0]#, DINV[0]# DSTBP[0]#
D[31:16]#, DINV[1]# DSTBP[1]#
D[47:32]#, DINV[2]# DSTBP[2]#
D[63:48]#, DINV[3]# DSTBP[3]#
Datasheet 53
Package Mechanical Specifications and Pin Information
FERR#/PBE# Output
FERR# (Floating-point Error)PBE#(Pending Break Event) is a
multiplexed signal and its meaning is qualified with STPCLK#. When
STPCLK# is not asserted, FERR#/PBE# indicates a floating point
when the processor detects an unmasked floating-point error.
FERR# is similar to the ERROR# signal on the Intel 387
coprocessor, and is included for compatibility with systems using
MS-DOS*-type floating-point error reporting. When STPCLK# is
asserted, an asserti on of FERR#/P B E# i ndi cat es that the processor
has a pending break event waiting for service. The assertion of
FERR#/PBE# indicates that the processor should be returned to the
Normal state. When FERR#/PBE# is asserted, indicating a break
event, it will remain asserted until STPCLK# is deasserted.
Assertion of PREQ# when STPCLK# is active will also cause an
FERR# break event.
For additional information on the pending break ev ent fu nctionalit y,
including identification of support of the feature and enable/disable
information, refer to Volume 3 of the Intel ® Architecture Software
Developer’s Manual and AP-485, Intel ® Processor Identification and
CPUID Instruction Application Note.
For termination requirements please contact your Intel
representative.
GTLREF Input
GTLREF det ermines the signal reference level for AGTL+ input pins.
GTLREF should be set at 2/3 VCCP. GTLREF is used by the AGTL+
receivers to determine if a signal is a logical 0 or logical 1. Please
contact your Intel representative for more information regarding
GTLREF implementation.
HIT#
HITM#
Input/
Output
Input/
Output
HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction
snoop operation results. Either FSB agent may assert both HIT#
and HITM# together to indicate that it requires a snoop stall, which
can be continued by reasserting HIT# and HITM# together.
IERR# Output
IERR# (Internal Error) is asserted by a processor as the result of an
internal error. Assertion of IERR# is usuall y accompanied by a
SHUTDOWN transaction on the FSB. This tr ansaction may optionally
be converted to an external error signal (e.g., NMI) by system core
logic. The processor will keep IERR# asserted until the assertion of
RESET#, BINIT#, or INIT#.
For termination requirements please contact your Intel
representative.
IGNNE# Input
IGNNE# (Ignore Numeric Error) is asserted to force the processor
to ignore a numeric error and continue to execute noncontrol
floating-point instructions. If IGNNE# is deasserted, the processor
generates an exception on a noncontrol floating-point instruction if
a previous floating-point instruction caused an error. IGNNE# has
no effect when the NE bit in control register 0 (CR0) is set.
IGNNE# is an asynchronous signal. However, to ensure recognition
of this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
Table 17. Signal Description (Sheet 5 of 9)
Name Type Description
Package Mechanical Specifications and Pin Information
54 Datasheet
INIT# Input
INIT# (Initialization), when asserted, resets integer registers inside
the processor without affecting its internal caches or floating-point
registers. The processor then begins execution at the power-on
Reset vector configured during power-on configuration. The
processor continues t o h a ndle snoop requests during INIT#
assertion. INIT# is an asynchronous signal. However, to ensure
recognition of this signal following an Input/Output Write
instruction, it must be valid along with the TRDY# assertion of the
corresponding Inpu t/Output Write bus transaction. INIT# must
connect the appropriate pins of both FSB agents.
If INIT# is sampled active on the active to inactive transition of
RESET#, then the processor executes its Built-in Self-Test (BIST).
For termination requirements please contact your Intel
representative.
LINT[1:0] Input
LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins
of all APIC Bus agents. When the APIC is disabled, the LINT0 signal
becomes INTR, a maskable interrupt request signal, and LINT1
becomes NMI, a nonmaskable interrupt. INTR and NMI are
backward compatible with the signals of those names on the
Pentium processor. Both signals are asynchronous.
Both of these signals must be software configured via BIOS
programming of the APIC register space to be used either as NMI/
INTR or LINT[1:0]. Because the APIC is enabled by default after
Reset, operation of these pins as LINT[1:0] is the default
configuration.
LOCK# Input/
Output
LOCK# indicates to the system that a transaction mu st occur
atomically. This signal must connect the appropriate pins of both
FSB agents. For a locked sequence of transactions, LOCK# is
asserted from the beginning of the first transaction to the end of
the last transaction.
When the priori ty agent assert s BPRI# to arbi trate for ownership of
the FSB, it will wait until it observes LOCK# deasserted. This
enables symmetric agents to retain ownership of the FSB
throughout the bus locked ope ration and ensure the atomicity of
lock.
PRDY# Output
Probe Ready signal used by debug tools to determine processor
debug readiness.
Please contact your Intel representative for more implementation
details.
PREQ# Input
Probe Request signal used by debug tools to request debug
operation of the processor.
Please contact your Intel representative for more implementation
details.
Table 17. Signal Description (Sheet 6 of 9)
Name Type Description
Datasheet 55
Package Mechanical Specifications and Pin Information
PROCHOT# Input/
Output
As an output, PROCHOT# (Processor Hot) will go active when the
processor temperature monitoring sensor detects that the
processor has reached it s maximum safe operating temperature.
This indicates that t he proce s sor Thermal Control Circuit (TCC) has
been activated, if enabled. As an input, assertion of PROCHOT# by
the system will activate the TCC, if enabled. The TCC will remain
active until the system deasserts PROCHOT#.
By default PROCHOT# is configured as an output only. Bidirectional
PROCHOT# must be enabled via the BIOS.
For termination requirements please contact your Intel
representative.
This signal may require voltage translation on the motherboard.
Please contact your Intel representative for more details.
PSI# Output
Processor Power Status Indicator signal. This signal is asserted
when the processor is in a normal state (HFM and LFM) and lower
state (Deep Sleep and Deeper Sleep).
Please contact your Intel representative for more details on the
PSI# signal.
PWRGOOD Input
PWRGOOD (Power Good) is a processor input. The processor
requires this signal to be a clean indication that the clocks and
power supplies are stable and within their sp ecifications. ‘Clean’
implies that t he signal will rema in low (capable of sinking leakage
current), without glitches, from the time that the p ower supplies
are turned on until they come within specificat ion. The signal must
then transition monotonically to a high state.
The PWRGOOD signal must be supplied to the processor; it is used
to protect internal circuits against voltage sequenc ing issues. It
should be driven high throughout boundary scan operation.
For termination requirements please contact your Intel
representative.
REQ[4:0]# Input/
Output
REQ[4:0]# (R equest Command) mu st connect the appr opriate pins
of both FSB agents. They are asserted by the current bus owner to
define the currently active transaction type. These signals are
source synchronous to AD STB[0]#.
RESET# Input
Asserting the RESET# si gnal resets the processor to a known state
and invalidates its internal caches without writing back any of their
contents. For a power-on Reset, RESET# must stay active for at
least two milliseconds after VCC and BCLK have reached their
proper specifications. On observing active RESET#, both FSB
agents will deassert their outputs within two clocks. All processor
straps must be v alid within the specified setup time before RESET#
is deasserted.
For termination requirements please contact your Intel
representative and implementation details. There i s a 55 Ω
(nominal) on die pull-up resistor on this signal.
RS[2:0]# Input RS[2:0]# (Response Status) are driven by the response agent (the
agent responsible for completion of the current transaction), and
must connect the appropriate pins of both FSB agents.
RSVD Reserved
/No
Connect
These pins are RESERVED and must be left unconnected on the
board. However, it is recommended that routing channels to these
pins on the board be kept open for possible future use. Please
contact your Intel representative for more details.
Table 17. Signal Description (Sheet 7 of 9)
Name Type Description
Package Mechanical Specifications and Pin Information
56 Datasheet
SLP# Input
SLP# (Sleep), when asserted in Stop-Grant state, causes the
processor to enter th e Sleep state. During Sleep state, the
processor stops providing internal clock signals to all units, leaving
only the Pha se-Locked Loop (P LL) still operating. Processors in this
state will not recognize snoops or interrupts. The processor will
recognize only assertion of the RESET# signal, deassertion of SLP#,
and removal of the BCLK input while in Sleep state. If SLP# is
deasserted, the processor exits Sleep state and returns to Stop-
Grant state, restarting its internal clock signals to the bus and
processor core units. If DPSLP# is asserted while in the Sleep state,
the processor will exit th e Sleep state and transition to the Deep
Sleep state.
SMI# Input
SMI# (System Management Interrupt) is asserted asynchronously
by system logic. On accepting a System Management Interrupt, the
processor saves the current state and enter System Management
Mode (SMM). An SMI Acknowledge transaction is issued, and the
processor begins program execution from the SMM handler.
If SMI# is asserted during the deassertion of RESET# the processor
will tristate its outputs.
STPCLK# Input
STPCLK# (Stop Clock), when asserted, causes the processor to
enter a low power Stop-Grant state. The processor issues a Stop-
Grant Acknowledge transaction, and stops providing internal clock
signals to all processor core units except the FSB and APIC units.
The processor continues to snoop bus transactions and service
interrupts while in Stop-Grant state. When STPCLK# is deasserted,
the processor restarts its internal clock to all units and resumes
execution. The assertion of STPCLK# has no effe ct on the bus
clock; STPCLK# is an asynchronous input.
TCK Input
TCK (Test Clock) provides the clock input for the processor Test Bus
(also known as the Test Access Port).
Please contact your Intel representative for termination
requirements and implementation details.
TDI Input
TDI (Test Data In) transfers se rial test data into the processor. TDI
provides the serial in put needed for JTAG specification support.
Please contact your Intel representative for termination
requirements and implementation details.
TDO Output
TDO (Test Data Out) transfers serial test data out of the processor.
TDO provides the serial output needed for JTAG specification
support.
Please contact your Intel representative for termination
requirements and implementation details.
TEST1 Input
TEST1 must have a stuffing option of separate pull -down resistor to
VSS.
Please contact you r Intel representative for more detailed
information.
TEST2 Input TEST2 must have a 51 Ω ±5% pull-down resistor to VSS. Please
contact your Intel representative for more details.
THERMDA Other Thermal Diode Anode .
THERMDC Other Thermal Diode Cathode.
Table 17. Signal Description (Sheet 8 of 9)
Name Type Description
Datasheet 57
Package Mechanical Specifications and Pin Information
§
THERMTRIP# Output
The processor protects itself from ca tastrophic overheating by use
of an internal thermal sensor. This sensor is set well above the
normal operating temperature to ensure that there are no false
trips. The processor will stop all execution when the junction
temperature exceeds approximately 125°C. This is signalled to the
system by the THERMTRIP# (Thermal Trip) pin.
For termination requirements please contact your Intel
representative.
TMS Input
TMS (Test Mode Select) is a JTAG specification support signal used
by debug tools.
Please contact your Intel representative for termination
requirements and implementation det a ils.
TRDY# Input
TRDY# (Target Ready) is asserted b y the target to in dicate that it is
ready to receive a write or implicit writeback data transfer. TRDY#
must connect the appropriate pins of both FSB agents.
Please contact your Intel representative for termination
requirements and implementation det a ils.
TRST# Input
TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST#
must be driven low during power on Reset.
Please contact your Intel representative for termination
requirements and implementation det a ils.
VCC Input Processor core power supply.
VCCA Input VCCA provides isolated power for the internal processor core PLL’s.
Please contact your Intel representative for complete
implementation details.
VCCP Input Processor I/O Power Supply.
VCCSENSE Output
VCCSENSE together with VSSSENSE are voltage feedback signals to
IMVP6 that control the 2.1-mΩ loadline at the processor die. It
should be used to sense voltage near the silicon with little noise.
Please contact your Intel Representative for more information
regarding termination and routing recommendations.
VID[6:0] Output
VID[6:0] (Voltage ID) pins are u sed to support automatic selection
of power supply voltages (VCC). Unlike some previous generations
of processors, thes e are CMOS signals th at are driven by the Intel
Core Duo processor and Intel Core Solo processor. The voltage
supply for these pins must be valid before the VR can supply VCC to
the processor. Conv ersely, the VR output must be disabled until the
voltage supply for the VID pins becomes valid. The VID pins are
needed to support the processor voltage specification variations.
See Table 2 for definitions of these pins. The VR must su pply the
voltage that is requested by the pins, or disable itself.
VSSSENSE Output
VSSSENSE together with VCCSENSE are voltage feedback signals to
Intel® MVP6 that control the 2.1-mΩ loadline at the processor die.
It should be used to sense ground near the silicon with little noise.
Please contact your Intel Representative for more information
regarding termination and routing recommendations.
Table 17. Signal Description (Sheet 9 of 9)
Name Type Description
Package Mechanical Specifications and Pin Information
58 Datasheet
Datasheet 59
Package Mechanical Specifications and Pin Information
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
A[3]# J4 Source
Synch Input/
Output
A[4]# L4 Source
Synch Input/
Output
A[5]# M3 Source
Synch Input/
Output
A[6]# K5 Source
Synch Input/
Output
A[7]# M1 Source
Synch Input/
Output
A[8]# N2 Source
Synch Input/
Output
A[9]# J1 Source
Synch Input/
Output
A[10]# N3 Source
Synch Input/
Output
A[11]# P5 Source
Synch Input/
Output
A[12]# P2 Source
Synch Input/
Output
A[13]# L1 Source
Synch Input/
Output
A[14]# P4 Source
Synch Input/
Output
A[15]# P1 Source
Synch Input/
Output
A[16]# R1 Source
Synch Input/
Output
A[17]# Y2 Source
Synch Input/
Output
A[18]# U5 Source
Synch Input/
Output
A[19]# R3 Source
Synch Input/
Output
A[20]# W6 Source
Synch Input/
Output
A[21]# U4 Source
Synch Input/
Output
A[22]# Y5 Source
Synch Input/
Output
A[23]# U2 Source
Synch Input/
Output
A[24]# R4 Source
Synch Input/
Output
A[25]# T5 Source
Synch Input/
Output
A[26]# T3 Source
Synch Input/
Output
A[27]# W3 Source
Synch Input/
Output
A[28]# W5 Source
Synch Input/
Output
A[29]# Y4 Source
Synch Input/
Output
A[30]# W2 Source
Synch Input/
Output
A[31]# Y1 Source
Synch Input/
Output
A20M# A6 CMOS Input
ADS# H1 Common
Clock Input/
Output
ADSTB[0]
#L2 Source
Synch Input/
Output
ADSTB[1]
#V4 Source
Synch Input/
Output
BCLK[0] A22 Bus Clock In p ut
BCLK[1] A21 Bus Clock In p ut
BNR# E2 Common
Clock Input/
Output
BPM[0]# AD4 Common
Clock Input/
Output
BPM[1]# AD3 Common
Clock Output
BPM[2]# AD1 Common
Clock Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
60 Datasheet
BPM[3]# AC4 Common
Clock Input/
Output
BPRI# G5 Common
Clock Input
BR0# F1 Common
Clock Input/
Output
BSEL[0] B22 CMOS Output
BSEL[1] B23 CMOS Output
BSEL[2] C21 CMOS Output
COMP[0] R26 Power/Other Input/
Output
COMP[1] U26 Power/Other Input/
Output
COMP[2] U1 Power/Other Input/
Output
COMP[3] V1 Power/Other Input/
Output
D[0]# E22 Source
Synch Input/
Output
D[1]# F24 Source
Synch Input/
Output
D[2]# E26 Source
Synch Input/
Output
D[3]# H22 Source
Synch Input/
Output
D[4]# F23 Source
Synch Input/
Output
D[5]# G25 Source
Synch Input/
Output
D[6]# E25 Source
Synch Input/
Output
D[7]# E23 Source
Synch Input/
Output
D[8]# K24 Source
Synch Input/
Output
D[9]# G24 Source
Synch Input/
Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
D[10]# J24 Source
Synch Input/
Output
D[11]# J23 Source
Synch Input/
Output
D[12]# H26 Source
Synch Input/
Output
D[13]# F26 Source
Synch Input/
Output
D[14]# K22 Source
Synch Input/
Output
D[15]# H25 Source
Synch Input/
Output
D[16]# N22 Source
Synch Input/
Output
D[17]# K25 Source
Synch Input/
Output
D[18]# P26 Source
Synch Input/
Output
D[19]# R23 Source
Synch Input/
Output
D[20]# L25 Source
Synch Input/
Output
D[21]# L22 Source
Synch Input/
Output
D[22]# L23 Source
Synch Input/
Output
D[23]# M23 Source
Synch Input/
Output
D[24]# P25 Source
Synch Input/
Output
D[25]# P22 Source
Synch Input/
Output
D[26]# P23 Source
Synch Input/
Output
D[27]# T24 Source
Synch Input/
Output
D[28]# R24 Source
Synch Input/
Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Datasheet 61
Package Mechanical Specifications and Pin Information
D[29]# L26 Source
Synch Input/
Output
D[30]# T25 Source
Synch Input/
Output
D[31]# N24 Source
Synch Input/
Output
D[32]# AA23 Source
Synch Input/
Output
D[33]# AB24 Source
Synch Input/
Output
D[34]# V24 Source
Synch Input/
Output
D[35]# V26 Source
Synch Input/
Output
D[36]# W25 Source
Synch Input/
Output
D[37]# U23 Source
Synch Input/
Output
D[38]# U25 Source
Synch Input/
Output
D[39]# U22 Source
Synch Input/
Output
D[40]# AB25 Source
Synch Input/
Output
D[41]# W22 Source
Synch Input/
Output
D[42]# Y23 Source
Synch Input/
Output
D[43]# AA26 Source
Synch Input/
Output
D[44]# Y26 Source
Synch Input/
Output
D[45]# Y22 Source
Synch Input/
Output
D[46]# AC26 Source
Synch Input/
Output
D[47]# AA24 Source
Synch Input/
Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
D[48]# AC22 Source
Synch Input/
Output
D[49]# AC23 Source
Synch Input/
Output
D[50]# AB22 Source
Synch Input/
Output
D[51]# AA21 Source
Synch Input/
Output
D[52]# AB21 Source
Synch Input/
Output
D[53]# AC25 Source
Synch Input/
Output
D[54]# AD20 Source
Synch Input/
Output
D[55]# AE22 Source
Synch Input/
Output
D[56]# AF23 Source
Synch Input/
Output
D[57]# AD24 Source
Synch Input/
Output
D[58]# AE21 Source
Synch Input/
Output
D[59]# AD21 Source
Synch Input/
Output
D[60]# AE25 Source
Synch Input/
Output
D[61]# AF25 Source
Synch Input/
Output
D[62]# AF22 Source
Synch Input/
Output
D[63]# AF26 Source
Synch Input/
Output
DBR# C20 CMOS Output
DBSY# E1 Common
Clock Input/
Output
DEFER# H5 Common
Clock Input
DINV[0]# J26 Source
Synch Input/
Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
62 Datasheet
DINV[1]# M26 Source
Synch Input/
Output
DINV[2]# V23 Source
Synch Input/
Output
DINV[3]# AC20 Source
Synch Input/
Output
DPRSTP# E5 CMOS Input
DPSLP# B5 CMOS Input
DPWR# D24 Common
Clock Input
DRDY# F21 Common
Clock Input/
Output
DSTBN[0]
#H23 Source
Synch Input/
Output
DSTBN[1]
#M24 Source
Synch Input/
Output
DSTBN[2]
#W24 Source
Synch Input/
Output
DSTBN[3]
#AD23 Source
Synch Input/
Output
DSTBP[0]
#G22 Source
Synch Input/
Output
DSTBP[1]
#N25 Source
Synch Input/
Output
DSTBP[2]
#Y25 Source
Synch Input/
Output
DSTBP[3]
#AE24 Source
Synch Input/
Output
FERR# A5 Open Drain Output
GTLREF AD26 Power/Other Input
HIT# G6 Common
Clock Input/
Output
HITM# E4 Common
Clock Input/
Output
IERR# D20 Open Drain Output
IGNNE# C4 CMOS Input
INIT# B3 CMOS Input
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
LINT0 C6 CMOS Input
LINT1 B4 CMOS Input
LOCK# H4 Common
Clock Input/
Output
PRDY# AC2 Common
Clock Output
PREQ# AC1 Common
Clock Input
PROCHOT
#D21 Open Drain Input/
Output
PSI# AE6 CMOS Output
PWRGOOD D6 CMOS Input
REQ[0]# K3 Source
Synch Input/
Output
REQ[1]# H2 Source
Synch Input/
Output
REQ[2]# K2 Source
Synch Input/
Output
REQ[3]# J3 Source
Synch Input/
Output
REQ[4]# L5 Source
Synch Input/
Output
RESET# B1 Common
Clock Input
RS[0]# F3 Common
Clock Input
RS[1]# F4 Common
Clock Input
RS[2]# G3 Common
Clock Input
RSVD D2 Reserved
RSVD F6 Reserved
RSVD D3 Reserved
RSVD C1 Reserved
RSVD AF1 Reserved
RSVD D22 Reserved
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Datasheet 63
Package Mechanical Specifications and Pin Information
RSVD C23 Reserved
RSVD C24 Reserved
RSVD AA1 Reserved
RSVD AA4 Reserved
RSVD AB2 Reserved
RSVD AA3 Reserved
RSVD M4 Reserved
RSVD N5 Reserved
RSVD T2 Reserved
RSVD V3 Reserved
RSVD B2 Reserved
RSVD C3 Reserved
RSVD T22 Reserved
RSVD B25 Reserved
SLP# D7 CMOS Input
SMI# A3 CMOS Input
STPCLK# D5 CMOS Input
TCK AC5 CMOS Input
TDI AA6 CMOS Input
TDO AB3 Open Drain Output
TEST1 C26 Test
TEST2 D25 Test
THERMDA A24 Power/Other
THERMDC A25 Power/Other
THERMTRI
P# C7 Open Drain Output
TMS AB5 CMOS Input
TRDY# G2 Common
Clock Input
TRST# AB6 CMOS Input
VCC AB20 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
VCC AA20 Power/Other
VCC AF20 Power/Other
VCC AE20 Power/Other
VCC AB18 Power/Other
VCC AB17 Power/Other
VCC AA18 Power/Other
VCC AA17 Power/Other
VCC AD18 Power/Other
VCC AD17 Power/Other
VCC AC18 Power/Other
VCC AC17 Power/Other
VCC AF18 Power/Other
VCC AF17 Power/Other
VCC AE18 Power/Other
VCC AE17 Power/Other
VCC AB15 Power/Other
VCC AA15 Power/Other
VCC AD15 Power/Other
VCC AC15 Power/Other
VCC AF15 Power/Other
VCC AE15 Power/Other
VCC AB14 Power/Other
VCC AA13 Power/Other
VCC AD14 Power/Other
VCC AC13 Power/Other
VCC AF14 Power/Other
VCC AE13 Power/Other
VCC AB12 Power/Other
VCC AA12 Power/Other
VCC AD12 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
64 Datasheet
VCC AC12 Power/Other
VCC AF12 Power/Other
VCC AE12 Power/Other
VCC AB10 Power/Other
VCC AB9 Power/Other
VCC AA10 Power/Other
VCC AA9 Power/Other
VCC AD10 Power/Other
VCC AD9 Power/Other
VCC AC10 Power/Other
VCC AC9 Power/Other
VCC AF10 Power/Other
VCC AF9 Power/Other
VCC AE10 Power/Other
VCC AE9 Power/Other
VCC AB7 Power/Other
VCC AA7 Power/Other
VCC AD7 Power/Other
VCC AC7 Power/Other
VCC B20 Power/Other
VCC A20 Power/Other
VCC F20 Power/Other
VCC E20 Power/Other
VCC B18 Power/Other
VCC B17 Power/Other
VCC A18 Power/Other
VCC A17 Power/Other
VCC D18 Power/Other
VCC D17 Power/Other
VCC C18 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
VCC C17 Power/Other
VCC F18 Power/Other
VCC F17 Power/Other
VCC E18 Power/Other
VCC E17 Power/Other
VCC B15 Power/Other
VCC A15 Power/Other
VCC D15 Power/Other
VCC C15 Power/Other
VCC F15 Power/Other
VCC E15 Power/Other
VCC B14 Power/Other
VCC A13 Power/Other
VCC D14 Power/Other
VCC C13 Power/Other
VCC F14 Power/Other
VCC E13 Power/Other
VCC B12 Power/Other
VCC A12 Power/Other
VCC D12 Power/Other
VCC C12 Power/Other
VCC F12 Power/Other
VCC E12 Power/Other
VCC B10 Power/Other
VCC B9 Power/Other
VCC A10 Power/Other
VCC A9 Power/Other
VCC D10 Power/Other
VCC D9 Power/Other
VCC C10 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Datasheet 65
Package Mechanical Specifications and Pin Information
VCC C9 Power/Other
VCC F10 Power/Other
VCC F9 Power/Other
VCC E10 Power/Other
VCC E9 Power/Other
VCC B7 Power/Other
VCC A7 Power/Other
VCC F7 Power/Other
VCC E7 Power/Other
VCCA B26 Power/Other
VCCP K6 Power/Other
VCCP J6 Power/Other
VCCP M6 Power/Other
VCCP N6 Power/Other
VCCP T6 Power/Other
VCCP R6 Power/Other
VCCP K21 Power/Other
VCCP J21 Power/Other
VCCP M21 Power/Other
VCCP N21 Power/Other
VCCP T21 Power/Other
VCCP R21 Power/Other
VCCP V21 Power/Other
VCCP W21 Power/Other
VCCP V6 Power/Other
VCCP G21 Power/Other
VCCSENSE AF7 Power/Other
VID[0] AD6 CMOS Output
VID[1] AF5 CMOS Output
VID[2] AE5 CMOS Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
VID[3] AF4 CMOS Output
VID[4] AE3 CMOS Output
VID[5] AF2 CMOS Output
VID[6] AE2 CMOS Output
VSS AB26 Power/Other
VSS AA25 Power/Other
VSS AD25 Power/Other
VSS AE26 Power/Other
VSS AB23 Power/Other
VSS AC24 Power/Other
VSS AF24 Power/Other
VSS AE23 Power/Other
VSS AA22 Power/Other
VSS AD22 Power/Other
VSS AC21 Power/Other
VSS AF21 Power/Other
VSS AB19 Power/Other
VSS AA19 Power/Other
VSS AD19 Power/Other
VSS AC19 Power/Other
VSS AF19 Power/Other
VSS AE19 Power/Other
VSS AB16 Power/Other
VSS AA16 Power/Other
VSS AD16 Power/Other
VSS AC16 Power/Other
VSS AF16 Power/Other
VSS AE16 Power/Other
VSS AB13 Power/Other
VSS AA14 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
66 Datasheet
VSS AD13 Power/Other
VSS AC14 Power/Other
VSS AF13 Power/Other
VSS AE14 Power/Other
VSS AB11 Power/Other
VSS AA11 Power/Other
VSS AD11 Power/Other
VSS AC11 Power/Other
VSS AF11 Power/Other
VSS AE11 Power/Other
VSS AB8 Power/Other
VSS AA8 Power/Other
VSS AD8 Power/Other
VSS AC8 Power/Other
VSS AF8 Power/Other
VSS AE8 Power/Other
VSS AA5 Power/Other
VSS AD5 Power/Other
VSS AC6 Power/Other
VSS AF6 Power/Other
VSS AB4 Power/Other
VSS AC3 Power/Other
VSS AF3 Power/Other
VSS AE4 Power/Other
VSS AB1 Power/Other
VSS AA2 Power/Other
VSS AD2 Power/Other
VSS AE1 Power/Other
VSS B6 Power/Other
VSS C5 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
VSS F5 Power/Other
VSS E6 Power/Other
VSS H6 Power/Other
VSS J5 Power/Other
VSS M5 Power/Other
VSS L6 Power/Other
VSS P6 Power/Other
VSS R5 Power/Other
VSS V5 Power/Other
VSS U6 Power/Other
VSS Y6 Power/Other
VSS A4 Power/Other
VSS D4 Power/Other
VSS E3 Power/Other
VSS H3 Power/Other
VSS G4 Power/Other
VSS K4 Power/Other
VSS L3 Power/Other
VSS P3 Power/Other
VSS N4 Power/Other
VSS T4 Power/Other
VSS U3 Power/Other
VSS Y3 Power/Other
VSS W4 Power/Other
VSS D1 Power/Other
VSS C2 Power/Other
VSS F2 Power/Other
VSS G1 Power/Other
VSS K1 Power/Other
VSS J2 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Datasheet 67
Package Mechanical Specifications and Pin Information
VSS M2 Power/Other
VSS N1 Power/Other
VSS T1 Power/Other
VSS R2 Power/Other
VSS V2 Power/Other
VSS W1 Power/Other
VSS A26 Power/Other
VSS D26 Power/Other
VSS C25 Power/Other
VSS F25 Power/Other
VSS B24 Power/Other
VSS A23 Power/Other
VSS D23 Power/Other
VSS E24 Power/Other
VSS B21 Power/Other
VSS C22 Power/Other
VSS F22 Power/Other
VSS E21 Power/Other
VSS B19 Power/Other
VSS A19 Power/Other
VSS D19 Power/Other
VSS C19 Power/Other
VSS F19 Power/Other
VSS E19 Power/Other
VSS B16 Power/Other
VSS A16 Power/Other
VSS D16 Power/Other
VSS C16 Power/Other
VSS F16 Power/Other
VSS E16 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
VSS B13 Power/Other
VSS A14 Power/Other
VSS D13 Power/Other
VSS C14 Power/Other
VSS F13 Power/Other
VSS E14 Power/Other
VSS B11 Power/Other
VSS A11 Power/Other
VSS D11 Power/Other
VSS C11 Power/Other
VSS F11 Power/Other
VSS E11 Power/Other
VSS B8 Power/Other
VSS A8 Power/Other
VSS D8 Power/Other
VSS C8 Power/Other
VSS F8 Power/Other
VSS E8 Power/Other
VSS G26 Power/Other
VSS K26 Power/Other
VSS J25 Power/Other
VSS M25 Power/Other
VSS N26 Power/Other
VSS T26 Power/Other
VSS R25 Power/Other
VSS V25 Power/Other
VSS W26 Power/Other
VSS H24 Power/Other
VSS G23 Power/Other
VSS K23 Power/Other
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
68 Datasheet
VSS L24 Power/Other
VSS P24 Power/Other
VSS N23 Power/Other
VSS T23 Power/Other
VSS U24 Power/Other
VSS Y24 Power/Other
VSS W23 Power/Other
VSS H21 Power/Other
VSS J22 Power/Other
VSS M22 Power/Other
VSS L21 Power/Other
VSS P21 Power/Other
VSS R22 Power/Other
VSS V22 Power/Other
VSS U21 Power/Other
VSS Y21 Power/Other
VSSSENSE AE7 Power/Other Output
Table 18. Pin Listing by Pin Name
Pin Name Pin
Number Signal
Buffer Type Direction
Datasheet 69
Package Mechanical Specifications and Pin Information
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
A3 SMI# CMOS Input
A4 VSS Power/Other
A5 FERR# Open Drain Output
A6 A20M# CMOS Input
A7 VCC Power/Other
A8 VSS Power/Other
A9 VCC Power/Other
A10 VCC Power/Other
A11 VSS Power/Other
A12 VCC Power/Other
A13 VCC Power/Other
A14 VSS Power/Other
A15 VCC Power/Other
A16 VSS Power/Other
A17 VCC Power/Other
A18 VCC Power/Other
A19 VSS Power/Other
A20 VCC Power/Other
A21 BCLK[1] Bus Clock Input
A22 BCLK[0] Bus Clock Input
A23 VSS Power/Other
A24 THERMDA Power/Other
A25 THERMDC Power/Other
A26 VSS Power/Other
AA1 RSVD Reserved
AA2 VSS Power/Other
AA3 RSVD Reserved
AA4 RSVD Reserved
AA5 VSS Power/Other
AA6 TDI CMOS Input
AA7 VCC Power/Other
AA8 VSS Power/other
AA9 VCC Power/Other
AA10 VCC Power/Other
AA11 VSS Power/Other
AA12 VCC Power/Other
AA13 VCC Power/Other
AA14 VSS Power/Other
AA15 VCC Power/Other
AA16 VSS Power/Other
AA17 VCC Power/Other
AA18 VCC Power/Other
AA19 VSS Power/Other
AA20 VCC Power/Other
AA21 D[51]# Source
Synch Input/
Output
AA22 VSS Power/Other
AA23 D[32]# Source
Synch Input/
Output
AA24 D[47]# Source
Synch Input/
Output
AA25 VSS Power/Other
AA26 D[43]# Source
Synch Input/
Output
AB1 VSS Power/Other
AB2 RSVD Reserved
AB3 TDO Open Drain Output
AB4 VSS Power/Other
AB5 TMS CMOS Input
AB6 TRST# CMOS Input
AB7 VCC Power/Other
AB8 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pi n Nam e Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
70 Datasheet
AB9 VCC Power/Other
AB10 VCC Power/Other
AB11 VSS Power/Other
AB12 VCC Power/Other
AB13 VSS Power/Other
AB14 VCC Power/Other
AB15 VCC Power/Other
AB16 VSS Power/Other
AB17 VCC Power/Other
AB18 VCC Power/Other
AB19 VSS Power/Other
AB20 VCC Power/Other
AB21 D[52]# Source
Synch Input/
Output
AB22 D[50]# Source
Synch Input/
Output
AB23 VSS Power/Other
AB24 D[33]# Source
Synch Input/
Output
AB25 D[40]# Source
Synch Input/
Output
AB26 VSS Power/Other
AC1 PREQ# Common
Clock Input
AC2 PRDY# Common
Clock Output
AC3 VSS Power/Other
AC4 BPM[3]# Common
Clock Input/
Output
AC5 TCK CMOS Input
AC6 VSS Power/Other
AC7 VCC Power/Other
AC8 VSS Power/Other
AC9 VCC Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
AC10 VCC Power/Other
AC11 VSS Power/Other
AC12 VCC Power/Other
AC13 VCC Power/Other
AC14 VSS Power/Other
AC15 VCC Power/Other
AC16 VSS Power/Other
AC17 VCC Power/Other
AC18 VCC Power/Other
AC19 VSS Power/Other
AC20 DINV[3]# Source
Synch Input/
Output
AC21 VSS Power/Other
AC22 D[48]# Source
Synch Input/
Output
AC23 D[49]# Source
Synch Input/
Output
AC24 VSS Power/Other
AC25 D[53]# Source
Synch Input/
Output
AC26 D[46]# Source
Synch Input/
Output
AD1 BPM[2]# Common
Clock Output
AD2 VSS Power/Other
AD3 BPM[1]# Common
Clock Output
AD4 BPM[0]# Common
Clock Input/
Output
AD5 VSS Power/Other
AD6 VID[0] CMOS Output
AD7 VCC Power/Other
AD8 VSS Power/Other
AD9 VCC Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
Datasheet 71
Package Mechanical Specifications and Pin Information
AD10 VCC Power/Other
AD11 VSS Power/Other
AD12 VCC Power/Other
AD13 VSS Power/Other
AD14 VCC Power/Other
AD15 VCC Power/Other
AD16 VSS Power/Other
AD17 VCC Power/Other
AD18 VCC Power/Other
AD19 VSS Power/Other
AD20 D[54]# Source
Synch Input/
Output
AD21 D[59]# Source
Synch Input/
Output
AD22 VSS Power/Other
AD23 DSTBN[3]
#Source
Synch Input/
Output
AD24 D[57]# Source
Synch Input/
Output
AD25 VSS Power/Other
AD26 GTLREF Power/Other Input
AE1 VSS Power/Other
AE2 VID[6] CMOS Output
AE3 VID[4] CMOS Output
AE4 VSS Power/Other
AE5 VID[2] CMOS Output
AE6 PSI# CMOS Output
AE7 VSSSENSE Power/Other Output
AE8 VSS Power/Other
AE9 VCC Power/Other
AE10 VCC Power/Other
AE11 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
AE12 VCC Power/Other
AE13 VCC Power/Other
AE14 VSS Power/Other
AE15 VCC Power/Other
AE16 VSS Power/Other
AE17 VCC Power/Other
AE18 VCC Power/Other
AE19 VSS Power/Other
AE20 VCC Power/Other
AE21 D[58]# Source
Synch Input/
Output
AE22 D[55]# Source
Synch Input/
Output
AE23 VSS Power/Other
AE24 DSTBP[3]
#Source
Synch Input/
Output
AE25 D[60]# Source
Synch Input/
Output
AE26 VSS Power/Other
AF1 RSVD Reserved
AF2 VID[5] CMOS Output
AF3 VSS Power/Other
AF4 VID[3] CMOS Output
AF5 VID[1] CMOS Output
AF6 VSS Power/Other
AF7 VCCSENSE Power/Other
AF8 VSS Power/Other
AF9 VCC Power/Other
AF10 VCC Power/Other
AF11 VSS Power/Other
AF12 VCC Power/Other
AF13 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pi n Nam e Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
72 Datasheet
AF14 VCC Power/Other
AF15 VCC Power/Other
AF16 VSS Power/Other
AF17 VCC Power/Other
AF18 VCC Power/Other
AF19 VSS Power/Other
AF20 VCC Power/Other
AF21 VSS Power/Other
AF22 D[62]# Source
Synch Input/
Output
AF23 D[56]# Source
Synch Input/
Output
AF24 VSS Power/Other
AF25 D[61]# Source
Synch Input/
Output
AF26 D[63]# Source
Synch Input/
Output
B1 RESET# Common
Clock Input
B2 RSVD Reserved
B3 INIT# CMOS Input
B4 LINT1 CMOS Input
B5 DPSLP# CMOS Input
B6 VSS Power/Other
B7 VCC Power/Other
B8 VSS Power/Other
B9 VCC Power/Other
B10 VCC Power/Other
B11 VSS Power/Other
B12 VCC Power/Other
B13 VSS Power/Other
B14 VCC Power/Other
B15 VCC Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
B16 VSS Power/Other
B17 VCC Power/Other
B18 VCC Power/Other
B19 VSS Power/Other
B20 VCC Power/Other
B21 VSS Power/Other
B22 BSEL[0] CMOS Output
B23 BSEL[1] CMOS Output
B24 VSS Power/Other
B25 RSVD Reserved
B26 VCCA Power/Other
C1 RSVD Reserved
C2 VSS Power/Other
C3 RSVD Reserved
C4 IGNNE# CMOS Input
C5 VSS Power/Other
C6 LINT0 CMOS Input
C7 THERMTRI
P# Open Drain Output
C8 VSS Power/Other
C9 VCC Power/Other
C10 VCC Power/Other
C11 VSS Power/Other
C12 VCC Power/Other
C13 VCC Power/Other
C14 VSS Power/Other
C15 VCC Power/Other
C16 VSS Power/Other
C17 VCC Power/Other
C18 VCC Power/Other
C19 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
Datasheet 73
Package Mechanical Specifications and Pin Information
C20 DBR# CMOS Output
C21 BSEL[2] CMOS Output
C22 VSS Power/Other
C23 RSVD Reserved
C24 RSVD Reserved
C25 VSS Power/Other
C26 TEST1 Test
D1 VSS Power/Other
D2 RSVD Reserved
D3 RSVD Reserved
D4 VSS Power/Other
D5 STPCLK# CMOS Input
D6 PWRGOOD CMOS Input
D7 SLP# CMOS Input
D8 VSS Power/Other
D9 VCC Power/Other
D10 VCC Power/Other
D11 VSS Power/Other
D12 VCC Power/Other
D13 VSS Power/Other
D14 VCC Power/Other
D15 VCC Power/Other
D16 VSS Power/Other
D17 VCC Power/Other
D18 VCC Power/Other
D19 VSS Power/Other
D20 IERR# Open Drain Output
D21 PROCHOT
#Open Drain Input/
Output
D22 RSVD Reserved
D23 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
D24 DPWR# Common
Clock Input
D25 TEST2 Test
D26 VSS Power/Other
E1 DBSY# Common
Clock Input/
Output
E2 BNR# Common
Clock Input/
Output
E3 VSS Power/Other
E4 HITM# Common
Clock Input/
Output
E5 DPRSTP# CMOS Input
E6 VSS Power/Other
E7 VCC Power/Other
E8 VSS Power/Other
E9 VCC Power/Other
E10 VCC Power/Other
E11 VSS Power/Other
E12 VCC Power/Other
E13 VCC Power/Other
E14 VSS Power/Other
E15 VCC Power/Other
E16 VSS Power/Other
E17 VCC Power/Other
E18 VCC Power/Other
E19 VSS Power/Other
E20 VCC Power/Other
E21 VSS Power/Other
E22 D[0]# Source
Synch Input/
Output
E23 D[7]# Source
Synch Input/
Output
E24 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pi n Nam e Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
74 Datasheet
E25 D[6]# Source
Synch Input/
Output
E26 D[2]# Source
Synch Input/
Output
F1 BR0# Common
Clock Input/
Output
F2 VSS Power/Other
F3 RS[0]# Common
Clock Input
F4 RS[1]# Common
Clock Input
F5 VSS Power/Other
F6 RSVD Reserved
F7 VCC Power/Other
F8 VSS Power/Other
F9 VCC Power/Other
F10 VCC Power/Other
F11 VSS Power/Other
F12 VCC Power/Other
F13 VSS Power/Other
F14 VCC Power/Other
F15 VCC Power/Other
F16 VSS Power/Other
F17 VCC Power/Other
F18 VCC Power/Other
F19 VSS Power/Other
F20 VCC Power/Other
F21 DRDY# Common
Clock Input/
Output
F22 VSS Power/Other
F23 D[4]# Source
Synch Input/
Output
F24 D[1]# Source
Synch Input/
Output
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
F25 VSS Power/Other
F26 D[13]# Source
Synch Input/
Output
G1 VSS Power/Other
G2 TRDY# Common
Clock Input
G3 RS[2]# Common
Clock Input
G4 VSS Power/Other
G5 BPRI# Common
Clock Input
G6 HIT# Common
Clock Input/
Output
G21 VCCP Power/Other
G22 DSTBP[0]
#Source
Synch Input/
Output
G23 VSS Power/Other
G24 D[9]# Source
Synch Input/
Output
G25 D[5]# Source
Synch Input/
Output
G26 VSS Power/Other
H1 ADS# Common
Clock Input/
Output
H2 REQ[1]# Source
Synch Input/
Output
H3 VSS Power/Other
H4 LOCK# Common
Clock Input/
Output
H5 DEFER# Common
Clock Input
H6 VSS Power/Other
H21 VSS Power/Other
H22 D[3]# Source
Synch Input/
Output
H23 DSTBN[0]
#Source
Synch Input/
Output
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
Datasheet 75
Package Mechanical Specifications and Pin Information
H24 VSS Power/Other
H25 D[15]# Source
Synch Input/
Output
H26 D[12]# Source
Synch Input/
Output
J1 A[9]# Source
Synch Input/
Output
J2 VSS Power/Other
J3 REQ[3]# Source
Synch Input/
Output
J4 A[3]# Source
Synch Input/
Output
J5 VSS Power/Other
J6 VCCP Power/Other
J21 VCCP Power/Other
J22 VSS Power/Other
J23 D[11]# Source
Synch Input/
Output
J24 D[10]# Source
Synch Input/
Output
J25 VSS Power/Other
J26 DINV[0]# Source
Synch Input/
Output
K1 VSS Power/Other
K2 REQ[2]# Source
Synch Input/
Output
K3 REQ[0]# Source
Synch Input/
Output
K4 VSS Power/Other
K5 A[6]# Source
Synch Input/
Output
K6 VCCP Power/Other
K21 VCCP Power/Other
K22 D[14]# Source
Synch Input/
Output
K23 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
K24 D[8]# Source
Synch Input/
Output
K25 D[17]# Source
Synch Input/
Output
K26 VSS Power/Other
L1 A[13]# Source
Synch Input/
Output
L2 ADSTB[0]
#Source
Synch Input/
Output
L3 VSS Power/Other
L4 A[4]# Source
Synch Input/
Output
L5 REQ[4]# Source
Synch Input/
Output
L6 VSS Power/Other
L21 VSS Power/Other
L22 D[21]# Source
Synch Input/
Output
L23 D[22]# Source
Synch Input/
Output
L24 VSS Power/Other
L25 D[20]# Source
Synch Input/
Output
L26 D[29]# Source
Synch Input/
Output
M1 A[7]# Source
Synch Input/
Output
M2 VSS Power/Other
M3 A[5]# Source
Synch Input/
Output
M4 RSVD Reserved
M5 VSS Power/Other
M6 VCCP Power/Other
M21 VCCP Power/Other
M22 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pi n Nam e Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
76 Datasheet
M23 D[23]# Source
Synch Input/
Output
M24 DSTBN[1]
#Source
Synch Input/
Output
M25 VSS Power/Other
M26 DINV[1]# Source
Synch Input/
Output
N1 VSS Power/Other
N2 A[8]# Source
Synch Input/
Output
N3 A[10]# Source
Synch Input/
Output
N4 VSS Power/Other
N5 RSVD Reserved
N6 VCCP Power/Other
N21 VCCP Power/Other
N22 D[16]# Source
Synch Input/
Output
N23 VSS Power/Other
N24 D[31]# Source
Synch Input/
Output
N25 DSTBP[1]
#Source
Synch Input/
Output
N26 VSS Power/Other
P1 A[15]# Source
Synch Input/
Output
P2 A[12]# Source
Synch Input/
Output
P3 VSS Power/Other
P4 A[14]# Source
Synch Input/
Output
P5 A[11]# Source
Synch Input/
Output
P6 VSS Power/Other
P21 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
P22 D[25]# Source
Synch Input/
Output
P23 D[26]# Source
Synch Input/
Output
P24 VSS Power/Other
P25 D[24]# Source
Synch Input/
Output
P26 D[18]# Source
Synch Input/
Output
R1 A[16]# Source
Synch Input/
Output
R2 VSS Power/Other
R3 A[19]# Source
Synch Input/
Output
R4 A[24]# Source
Synch Input/
Output
R5 VSS Power/Other
R6 VCCP Power/Other
R21 VCCP Power/Other
R22 VSS Power/Other
R23 D[19]# Source
Synch Input/
Output
R24 D[28]# Source
Synch Input/
Output
R25 VSS Power/Other
R26 COMP[0] Power/Other Input/
Output
T1 VSS Power/Other
T2 RSVD Reserved
T3 A[26]# Source
Synch Input/
Output
T4 VSS Power/Other
T5 A[25]# Source
Synch Input/
Output
T6 VCCP Power/Other
T21 VCCP Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
Datasheet 77
Package Mechanical Specifications and Pin Information
T22 RSVD Reserved
T23 VSS Power/Other
T24 D[27]# Source
Synch Input/
Output
T25 D[30]# Source
Synch Input/
Output
T26 VSS Power/Other
U1 COMP[2] Power/Other Input/
Output
U2 A[23]# Source
Synch Input/
Output
U3 VSS Power/Other
U4 A[21]# Source
Synch Input/
Output
U5 A[18]# Source
Synch Input/
Output
U6 VSS Power/Other
U21 VSS Power/Other
U22 D[39]# Source
Synch Input/
Output
U23 D[37]# Source
Synch Input/
Output
U24 VSS Power/Other
U25 D[38]# Source
Synch Input/
Output
U26 COMP[1] Power/Other Input/
Output
V1 COMP[3] Power/Other Input/
Output
V2 VSS Power/Other
V3 RSVD Reserved
V4 ADSTB[1]
#Source
Synch Input/
Output
V5 VSS Power/Other
V6 VCCP Power/Other
V21 VCCP Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
V22 VSS Power/Other
V23 DINV[2]# Source
Synch Input/
Output
V24 D[34]# Source
Synch Input/
Output
V25 VSS Power/Other
V26 D[35]# Source
Synch Input/
Output
W1 VSS Power/Other
W2 A[30]# Source
Synch Input/
Output
W3 A[27]# Source
Synch Input/
Output
W4 VSS Power/Other
W5 A[28]# Source
Synch Input/
Output
W6 A[20]# Source
Synch Input/
Output
W21 VCCP Power/Other
W22 D[41]# Source
Synch Input/
Output
W23 VSS Power/Other
W24 DSTBN[2]
#Source
Synch Input/
Output
W25 D[36]# Source
Synch Input/
Output
W26 VSS Power/Other
Y1 A[31]# Source
Synch Input/
Output
Y2 A[17]# Source
Synch Input/
Output
Y3 VSS Power/Other
Y4 A[29]# Source
Synch Input/
Output
Y5 A[22]# Source
Synch Input/
Output
Y6 VSS Power/Other
Table 19. Pin Listing by Pin Number
Pin
Number Pi n Nam e Signal
Buffer Type Direction
Package Mechanical Specifications and Pin Information
78 Datasheet
Y21 VSS Power/Other
Y22 D[45]# Source
Synch Input/
Output
Y23 D[42]# Source
Synch Input/
Output
Y24 VSS Power/Other
Y25 DSTBP[2]
#Source
Synch Input/
Output
Y26 D[44]# Source
Synch Input/
Output
Table 19. Pin Listing by Pin Number
Pin
Number Pin Name Signal
Buffer Type Direction
Datasheet 79
Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
The processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Section 5.1. Any attempt to operate that processor outside these
operating limits may result in permanent damage to the processor and potentially other
components in the system. As processor technology changes, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper
thermal environment is key to reliable, long-term system operation. A complete
thermal solution includes both component and system level thermal management
features. Component level thermal solutions include active or passive heatsinks or heat
exchangers attached to the processor exposed die. The solution should make firm
contact to the die while maintaining processor mechanical specifications such as
pressure. A typical system level thermal solution may consist of a processor fan ducted
to a heat exchanger that is thermally coupled to the processor via a heat pipe or direct
die attachment. A secondary fan or air from the processor fan may also be used to cool
other platform components or to lower the internal ambient temperature within the
system.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum junction temperature (Tj)
specifications at the corresponding thermal design power (TDP) value listed in Table 20
to Table 22. Thermal solutions not designed to provide this level of thermal capability
may affect the long-term reliability of the processor and system.
The maximum junction temperature is defined by an activation of the processor Intel
Thermal Monitor. Refer to Section 5.1.3 for more details. Analysis indicates that real
applications are unlikely to cause the processor to consume the theoretical maximum
power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the TDP indicated in Table 20 to Table 22. The Intel Thermal
Monitor feature is designed to help protect the processor in the unlikely event that an
application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.1.3. In all cases, the Intel
Thermal Monitor feature must be enabled for the processor to remain within
specification.
Thermal Specifications and Design Considerations
80 Datasheet
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2. Not 100% tested. These power specificat ions are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indica ted.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automa tic mode must be enabled for the processor to operate
within specification.
5. T2300E does not support Intel Virtualization Technology.
Table 20. Power Specifications for the Intel Core Duo Processor SV (Standard Voltage)
Symbol Processor
Number Core Frequency
& Voltage Thermal Design
Power Unit Notes
TDP
T2700
T2600
T2500
T2400
T2300
T2300E
N/A
2.33 GHz & HFM VCC
2.16 GHz & HFM VCC
2.00 GHz & HFM VCC
1.83 GHz & HFM VCC
1.66 GHz & HFM VCC
1.66 GHz & HFM VCC
1.00 GHz & LFM VCC
31
31
31
31
31
31
13.1
WAt 100°C
Notes 1, 4,
5
Symbol Parameter Min Typ Max Unit Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
15.8
4.8 WAt 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
15.5
4.7 WAt 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
10.5
3.4 WAt 35°C
Note 2
PDPRSLP Deeper Sleep Power 2.2 W At 35°C
Note 2
PDC4 Intel® Enhanced Deep er Sleep Power 1.8 W At 35°C
Note 2
TJJunction Temperature 0 100 °CNotes 3, 4
Datasheet 81
Thermal Specifications and Design Considerations
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximu m theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3. As measured by th e activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the m aximum TJ has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specification.
Table 21. Power Specifications for th e Intel Co re Solo Proc essor SV (Standard Voltage)
Symbol Processor
Number Core Frequency
& Voltage Thermal Design
Power Unit Notes
TDP T1400
T1300
N/A
1.83 GHz & HFM VCC
1.66 GHz & HFM VCC
1.00 GHz & LFM VCC
27
27
13.1 WAt 100°C
Notes 1, 4
Symbol Parameter Min Typ Max Unit Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
15.8
4.8 WAt 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
15.5
4.7 WAt 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
10.5
3.4 WAt 35°C
Note 2
PDPRSLP Deeper Sleep Power 2.2 W At 35°C
Note 2
PDC4 Intel® Enhanced Deep er Sleep Power 1.8 W At 35°C
Note 2
TJJunction Temperature 0 100 °CNotes 3, 4
Thermal Specifications and Design Considerations
82 Datasheet
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2. Not 100% tested. These power specificat ions are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indica ted.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automa tic mode must be enabled for the processor to operate
within specification.
Table 22. Power Specifications for the Intel Core Duo Processor LV (Low Voltage)
Symbol Processor
Number Core Frequency
& Voltage Thermal Design
Power Unit Notes
TDP
L2500
L2400
L2300
N/A
1.83 GHz & HFM VCC
1.66 GHz & HFM VCC
1.50 GHz & HFM VCC
1.00 GHz & LFM VCC
15
15
15
13.1
WAt 100°C
Notes 1, 4
Symbol Parameter Min Typ Max Unit Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
6.0
4.8 WAt 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
5.8
4.7 WAt 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
5.7
3.4 WAt 35°C
Note 2
PDPRSLP Deeper Sleep Power 2.2 W At 35°C
Note 2
PDC4 Intel® Enhanced Deeper Sleep Power 1.8 W At 35°C
Note 2
TJJunction Temperature 0 100 °CNotes 3, 4
Datasheet 83
Thermal Specifications and Design Considerations
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximu m theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3. As measured by th e activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the m aximum TJ has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specification.
Table 23. Power Specifications for the Intel Core Duo Processor, Ultra Low Voltage
(ULV)
Symbol Processor
Number Core Frequency
& Voltage Thermal Design
Power Unit Notes
TDP U2500
U2400
N/A
1.20 GHz & HF M VCC
1.06 GHz & HF M VCC
800 MHz & LFM VCC
9
9
7.5 WAt 100°C
Notes1, 4
Symbol Parameter Min Typ Max Unit Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
3.7
2.6 WAt 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
3.6
2.5 WAt 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
2.2
1.8 WAt 35°C
Note 2
PDPRSLP Deeper Sleep Power 1.3 W At 35°C
Note 2
PDC4 Intel® Enhanced Deeper Sleep Power 1.1 W At 35°C
Note 2
TJJunction Temperature 0 100 °CNotes 3, 4
Thermal Specifications and Design Considerations
84 Datasheet
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2. Not 100% tested. These power specificat ions are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indica ted.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automa tic mode must be enabled for the processor to operate
within specification.
Table 24. Power Specifications for the Intel Core Solo Processor ULV (Ultra Low
Voltage)
Symbol Processor
Number Core Frequency
& Voltage Thermal Design
Power Unit Notes
TDP
U1500
U1400
U1300
1.33 GHz and HFM VCC
1.20 GHz and HFM
VCC1.06 GHz and LFM
VCC
800 MHz and LFM VCC
5.5
5.5
5.5
5
WAt 100°C
Notes 1, 4
Symbol Parameter Min Typ Max Unit Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
3.0
2.2 WAt 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
2.9
2.1 WAt 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
1.5
1.2 WAt 35°C
Note 2
PDPRSLP Deeper Sleep Power 0.7 W At 35°C
Note 2
PDC4 Intel® Enhanced Deeper Sleep Power 0.6 W At 35°C
Note 2
TJJunction Temperature 0 100 °CNotes 3, 4
Datasheet 85
Thermal Specifications and Design Considerations
5.1 Thermal Specifications
The processor incorporates three methods of monitoring die temperature, the digital
thermal sensor (DTS), Intel Thermal Monitor and the thermal diode. The Intel Thermal
Monitor (detailed in Section 5.1.3) must be used to determine when the maximum
specified processor junction temperature has been reached.
5.1.1 Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is
used as a thermal diode, with its collector shorted to Ground. The thermal diode, can
be read by an off-die analog/digital converter (a thermal sensor) located on the
motherboard, or a stand-alone measurement kit. The thermal diode may be used to
monitor the die temperature of the processor for thermal management or
instrumentation purposes but is not a reliable indication that the maximum operating
temperature of the processor has been reached. When using the thermal diode, a
temperature offset value must be read from a processor Model Specific Register (MSR)
and applied. See Section 5.1.2 for more details. Please see Section 5.1.3 for thermal
diode usage recommendation when the PROCHOT# signal is not asserted.
Note: The reading of the external thermal sensor (on the motherboard) connected to the
processor thermal diode signals, will not necessarily reflect the temperature of the
hottest location on the die. This is due to inaccuracies in the external thermal sensor,
on-die temperature gr adients between the location of the thermal diode and the hottest
location on the die, and time based variations in the die temperature measurement.
Time based variations can occur when the sampling rate of the thermal diode (by the
thermal sensor) is slower than the rate at which the TJ temperature can change.
Offset between the thermal diode-based temp erature reading and the Intel Thermal
Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic
mode activation of thermal control circuit. This temperature offset must be taken into
account when using the processor thermal diode to implement power management
events. This offset is different than the diode Toffset value programmed into the
processor Model Specific Register (MSR).
Table 25, Table 26, Table 27, and Table 28 provide the diode interface and
specifications. Two different sets of diode parameters are listed in Table 26 and
Table 27. The Diode Model parameters (Table 26) apply to traditional thermal sensors
that use the Diode Equation to determine the processor temperature. Transistor Model
parameters (Table 27) have been added to support thermal sensors that use the
transistor equation method. The Transistor Model may provide more accurate
temperature measurements when the diode ideality factor is closer to the maximum or
minimum limits. Please contact your external thermal sensor supplier for their
recommendation. This thermal diode is separate from the Intel Thermal Monitor's
thermal sensor and cannot be used to predict the behavior of the Intel Thermal Monitor.
Table 25. Thermal Diode Interface
Signal Name Pin/Ball Number Signal Description
THERMDA A24 Thermal diode anode
THERMDC A25 Thermal diode cathode
Thermal Specifications and Design Considerations
86 Datasheet
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
Intel does not support or recommend operation of the thermal diode when the processor
power supplies are not within their specified tolerance range.
2. Characterized across a temperature range of 50 - 100°C.
3. Not 100% tested. Specified by design characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by
the diode equation:
IFW = IS * (e qVD/nkT –1)
where IS = saturation current, q = electronic charge, VD = voltage across the diode, k =
Boltzmann Constant, and T = absolute temperature (Kelvin).
5. The series resistance, RT, is provided to allow for a more accurate measu rement of the
junction temperature. RT, as defined, includes the lands of the processor but does not
include any socket resistance or board trace resistance between the socket and th e
external remote diode thermal sensor. RT can be used by remote diode thermal sensors
with automat ic series resistance cancellation to calibrate out this error te rm. Another
application is that a temperature offset can be m a nually calculated and programmed into
an offset register in the remote diode thermal sensors as exemplified by the equation:
Terror = [RT * (N-1) * IFWmin] / [nk/q * ln N]
where Terror = sensor temperature error, N = sensor current ratio, k = Boltzmann
Constant, q = electronic charge.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Same as IFW in Table 25.
3. Characterized across a temperature range of 50 - 100°C.
4. Not 100% tested. Specified by design characterization.
5. The ideality factor, nQ, represents the deviation from ideal transistor model behavior as
exemplified by the equation for the collector current:
IC = IS * (e qVBE/nQkT –1)
Where IS = saturation current, q = electronic charge, VBE = voltage across the transistor
base emitter junction (s ame node s as VD), k = Boltzmann Constant, and T = absolute
temperature (Kelvin).
6. The series resistance, RT, provided in the Diode Model Table (Table 26) can be used for
more accurate readings as needed.
Table 26. Thermal Diode Parameters using Diode Mode
Symbol Parameter Min Typ Max Unit Notes
IFW Forward Bias Current 5 - 200 µA 1
n Diode Ideality Factor 1.000 1.009 1.050 - 2, 3, 4
RTSeries Resistance 2.79 4.52 6.24 Ω2, 3, 5
Table 27. Thermal Diode Parameters using Transistor Mode
Symbol Parameter Min Typ Max Unit Notes
IFW Forward Bias Current 5 - 200 µA 1, 2
IEEmitter Current 5 200 µA
nQTransistor Ideality 0.997 1.001 1.005 - 3, 4, 5
Beta 0.3 0.760 3, 4
RTSeries Resistance 2.79 4.52 6.24 Ω3, 6
Datasheet 87
Thermal Specifications and Design Considerations
When calculating a temperature based on thermal diode measurements, a number of
parameters must be either measured or assumed. Most devices measure the diode
ideality and assume a series resistance and ideality trim value, although some are
capable of also measuring the series resistance. Calculating the temperature is then
accomplished using the equations listed under Table 25. In most temperature sensing
devices, an expected value for the diode ideality is designed-in to the temperature
calculation equation. If the designer of the temperature sensing device assumes a
perfect diode the ideality value (also called n trim) will be 1.000. Given that most diodes
are not perfect, the designers usually select an ntrim value that more closely matches
the behavior of the diodes in the processor. If the processors diode ideality deviates
from that of ntrim, each calculated temperature will be offset by a fixed amount. This
temperature offset can be calculated with the equation:
Terror(nf) = Tmeasured X (1 - nactual/ntrim)
Where Terror(nf) is the offset in degrees C, Tmeasured is in Kelvin, nactual is the measured
ideality of the diode, and ntrim is the diode ideality assumed by the temperature
sensing device.
5.1.2 Thermal Diode Offset
In order to improve the accuracy of diode based temperature measurements, a
temperature offset value (specified as Toffset) will be programmed into a processor
Model Specific Register (MSR) which will contain thermal diode characterization data.
During manufacturing each processors thermal diode will be evaluated for its behavior
relative to a theoretical diode. Using the equation above, the temperature error created
by the difference between ntrim and the actual ideality of the particular processor will
be calculated.
If the ntrim value used to calculate Toffset differs from the ntrim valu e us ed in a
temperature sensing device, the Terror(nf) may not be accurate. If desired, the Toffset
can be adjusted by calculating nactual and then recalculating the offset using the actual
ntrim as defined in the temperature sensor manufacturers' datasheet.
The ntrim used to calculate the Diode Correction Toffset are listed in the table below
5.1.3 Intel® Thermal Monitor
The Intel Thermal Monitor helps control the processor temperature by activating the
TCC (Thermal Control Circuit) when the processor silicon reaches its maximum
operating temperature. The temperature at which the Intel Thermal Monitor activates
the TCC is not user configur able. Bus traffic is snooped in the normal manner, and
interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
With a properly designed and characterized thermal solution, it is anticipated that the
TCC would only be activated for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
periods of TCC activation is expected to be minor and hence not detectable. An under-
designed thermal solution that is not able to prevent ex cessive activation of the TCC in
the anticipated ambient environment may cause a noticeable performance loss, and
may affect the long-term reliability of the processor. In addition, a thermal solution that
is significantly under designed may not be capable of cooling the processor even when
the TCC is activ e continuously.
Table 28. Thermal Diode ntrim and Diode Correction Toffset
Symbol Parameter Value
ntrim Diode idea lity used to c a lculate Toffset 1.01
Thermal Specifications and Design Considerations
88 Datasheet
The Intel Thermal Monitor controls the processor temperature by modulating (starting
and stopping) the processor core clocks or by initiating an Enhanced Intel SpeedStep
Technology transition when the processor silicon reaches its maximum operating
temperature. The Intel Thermal Monitor uses two modes to activate the TCC:
Automatic mode and on-demand mode. If both modes are activated, Automatic mode
takes precedence.
Note: The Intel Thermal Monitor automatic mode must be enabled through BIOS for the
processor to be operating within specifications.
There are two automatic modes called Intel Thermal Monitor 1 (TM1) and Intel Thermal
Monitor 2 (TM2). These modes are selected by writing values to the Model Specific
Registers (MSRs) of the processor. After Automatic mode is enabled, the TCC will
activate only when the internal die temperature reaches the maximum allowed value
for operation.
Likewise, when Intel Thermal Monitor 2 is enabled, and a high temperature situation
exists, the processor will perform an Enhanced Intel SpeedStep Technology transition
to a lower operating point. When the processor temperature drops b elow the critical
level, the processor will make an Enhanced Intel SpeedStep Technology transition to
the last requested operating point.
TM1 and TM2 can co-exist within the processor. If both TM1 and TM2 bits are enabled in
the auto-throttle MSR, TM2 will take precedence over TM1. However, if TM2 is not
sufficient to cool the processor below the maximum operating temperature then TM1
will also activate to help cool down the processor. Intel recommends Intel Thermal
Monitor 1 and Intel Thermal Monitor 2 be enabled on the Intel Core Duo processor and
Intel Core Solo processor.
If a processor load-based Enhanced Intel SpeedStep Technology transition (through
MSR write) is initiated when an Intel Thermal Monitor 2 period is active, there are two
possible results:
1. If the processor load-based Enhanced Intel SpeedStep Technology transition target
frequency is higher than the Intel Thermal Monitor 2 transition-based target
frequency, the processor load-based transition will be deferred until the Intel
Thermal Monitor 2 event has been completed.
2. If the processor load-based Enhanced Intel SpeedStep Technology transition target
frequency is lower than the Intel Thermal Monitor 2 transition-based target
frequency, the processor will transition to the processor load-based Enhanced Intel
SpeedStep Technology target frequency point.
When Intel Thermal Monitor 1 is enabled while a high temperature situation exists, the
clocks will be modulated by alternately turning the clocks off and on at a 50% duty
cycle. Cycle times are processor speed dependent and will decrease linearly as
processor core frequencies increase. Once the temperature has returned to a non-
critical level, modulation ceases and TCC goes inactive. A small amount of hysteresis
has been included to prevent rapid active/inactive transitions of the TCC when the
processor temperature is near the trip point. The duty cycle is factory configured and
cannot be modified. Also, automatic mode does not require any additional hardware,
software drivers, or interrupt handling routines. Processor performance will be
decreased by the same amount as the duty cycle when the TCC is active.
The TCC m ay also be activ ated via on-demand mode. If bit 4 of the ACPI Intel Thermal
Monitor control register is written to a 1, the TCC will be activated immediately,
independent of the proc e ss or temp erature. When using on-demand mode to activate
the TCC, the duty cycle of the clock modulation is programmable via bits 3:1 of the
same ACPI Intel Thermal Monitor control register. In automatic mode, th e du ty cy cle is
fixed at 50% on, 50% off, however in on-demand mode, the duty cycle can be
programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments.
On-demand mode may be used at the same time automatic mode is enabled, ho wever,
Datasheet 89
Thermal Specifications and Design Considerations
if the system tries to enable the T C C via on -demand mode at the same time autom atic
mode is enabled and a high temperature condition exists, automatic mode will take
precedence.
An external signal, PROCHOT# (processor hot) is asserted when the processor detects
that its temperature is above the thermal trip point. Bus snooping and interrupt
latching are also active while the TCC is active.
Besides the thermal sensor and thermal control circuit, the Intel Thermal Monitor also
includes one ACPI register, one performance counter register, three model specific
registers (MSR), and one I/O pin (PROCHOT#). All are a v ailable to monitor and control
the state of the Intel Thermal Monitor feature. The Intel Thermal Monitor can be
configured to generate an interrupt upon the assertion or deassertion of PROCHOT#.
Note: PROCHOT# will not be asserted when the processor is in the Stop Grant, Sleep, Deep
Sleep, and Deeper Sleep low power states (internal clocks stopped), hence the thermal
diode reading must be used as a safeguard to maintain the processor junction
temperature within maximum specification. If the platform thermal solution is not able
to maintain the processor junction temperature within the maximum specification, the
system must initiate an orderly shutdown to prevent damage. If the processor enters
one of the above low power states with PROCHOT# already asserted, PROCHOT# will
remain asserted until the processor exits the low power state and the processor
junction temperature drops below the thermal trip point.
If Intel Thermal Monitor automatic mode is disabled, the processor will be operating out
of specification. Regardless of enabling the automatic or on-demand modes, in the
event of a catastrophic cooling failure, the processor will automatically shut down when
the silicon has reached a temperature of approximately 125°C. At this point the
THERMTRIP# signal will go active. THERMTRIP# activation is independent of processor
activity and does not generate any bus cycles. When THERMTRIP# is asserted, the
processor core voltage must be shut down within the time specified in Chapter 3.
5.1.4 Digital Thermal Sensor (DTS)
The processor also contains an on-die DTS that can be read via a MSR (no I/O
interface). In a dual core implementation of the Intel Core Duo processor, each core will
have a unique D T S whose temper ature is accessible via processor MSR. The DTS is the
preferred method of reading the processor die temperature since it can be located
much closer to the hottest portions of the die and can thus more accurately track the
die temperature and potential activation of processor core clock modulation via the
Intel Thermal Monitor. The DTS is only valid while the processor is in the normal
operating state (C0 state).
Unlike traditional thermal devices, the DTS will output a temperature relative to the
maximum supported operating temperature of the processor (TJ,max). It is the
responsibility of software to convert the relative temperature to an absolute
temperature. The temperature returned by the DTS will always be at or below TJ,max.
Over temperature conditions are detectable via an Out Of Spec status bit. This bit is
also part of the digital thermal sensor MSR. When this bit is set, the processor is
operating out of specification and immediate shutdown of the system should occur. The
processor operation and code execution is not guar anteed once the activ ation of the
Out of Spec status bit is set.
The DTS relative temperature readout corresponds to the Intel Thermal Monitor (TM1/
TM2) trigger point. When the DTS indicates maximum processor core temperature has
been reached the TM1 or TM2 hardware thermal control mechanism will activate. The
D TS and TM1/TM2 temperature may not correspond to the thermal diode reading since
the thermal diode is located in a separate portion of the die and thermal gradient
between the individual core DTS. Additionally, the thermal gradient from DTS to
thermal diode can vary substantially due to changes in processor power, mechanical
Thermal Specifications and Design Considerations
90 Datasheet
and thermal attach and software application. The system designer is required to use
the DTS to guarantee proper operation of the processor within its temperature
operating specifications
Changes to the temperature can be detected via two progr amm able thresholds located
in the processor MSRs. These thresholds have the capability of generating interrupts
via the core's local APIC.
5.1.5 Out of Specification Detection
Overheat detection is performed by monitoring the processor temperature and
temperature gradient. This feature is intended for graceful shut down before the
THERMTRIP# is activated. If the processor’s TM1 or TM2 are triggered and the
temperature remains high, an “Out Of Spec” status and sticky bit are latched in the
status MSR register and generates thermal interrupt.
5.1.6 PROCHOT# Signal Pin
An external signal, PROCHOT# (processor hot), is asserted when the processor die
temperature has reached its maximum operating temp erature. If the Intel Thermal
Monitor 1 or Intel Thermal Monitor 2 is enabled (note that the Intel Thermal Monitor 1
or Intel Thermal Monitor 2 must be enabled for the processor to be operating within
specification), the TCC will be active when PROCHOT# is asserted. The processor can
be configured to generate an interrupt upon the assertion or deassertion of
PROCHOT#.
The processor implements a bi-directional PROCHOT# capability to allow system
designs to protect various components from over-temperature situations. The
PROCHOT# signal is bi-directional in that it can either signal when the processor has
reached its maximum operating temperature or be driven from an external source to
activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means
for thermal protection of system components.
In a dual core implementation, only a single PROCHOT# pin exists at a package level.
When either core's thermal sensor trips, PROCHOT# signal will be driven by the
processor package. If only TM1 is enabled, PROCHOT# will be asserted and only the
core that is above TCC temperature trip point will have its core clocks modulated. If
TM2 is enabled, then regardless of which core(s) are above TCC temperature trip point,
both cores will enter the lowest programmed TM2 performance state.
Note: It is important to note that Intel recommends both TM1 and TM2 be enabled.
When PROCHOT# is driven by an external agent, if only TM1 is enabled on both cores,
then both processor cores will have their core clocks modulated. If TM2 is enabled on
both cores, then both processor core will enter the lowest programmed TM2
performance state.
One application is the thermal protection of voltage regulators (VR). System designers
can create a circuit to monitor the VR temperature and activate the TCC when the
temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and
activating the TCC, the VR can cool down as a result of reduced processor power
consumption. Bi-directional PROCHOT# can allow VR thermal designs to target
maximum sustained current instead of maximum current. Systems should still provide
proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in
case of system cooling failure. The system thermal design should allow the power
delivery circuitry to operate within its temperature specification even while the
processor is operating at its TDP. With a properly designed and characterized thermal
solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very
Datasheet 91
Thermal Specifications and Design Considerations
short periods of time when running the most power intensive applications. An under-
designed thermal solution that is not able to prevent excessiv e assertion of PROCHOT#
in the anticipated ambient environment may cause a noticeable performance loss.
§
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Processors Intel
®
Core™ Duo Processo
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Core™ Duo Processor T2000 Series
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Intel® Core™ Duo Processor T2050
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dditional Information
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Specifications
Essentials
Memory Specifications
Package Specifications
Advanced Technologies
Ordering / sSpecs / Steppings
Retired and Discontinued
Compatible Products
Chipsets
Block Diagrams
Specifications
Essentials
Status Launched
Processor Number T2050
# of Cores 2
# of Threads 2
Clock Speed 1.6 GHz
L2 Cache 2 MB
Bus/Core Ratio 12
FSB Speed 533 MHz
FSB Parity No
Instruction Set 32-bit
Embedded Options Available No
Supplemental SKU No
Lithography 65 nm
Max TDP 31 W
VID Voltage Range 0.7625-1.3V
Memory Specifications
Physical Address Extensions 32-bit
ECC Memory Supported No
Package Specifications
T
JUNCTION 100°C
Package Size 35mm x 35mm
Processing Die Size 90 mm2
# of Processing Die Transistors 151 million
Sockets Supported PPGA478
Low Halogen Options Available No
Advanced Technologies
Page 1 of 4Intel® Core™ Duo Processor T2050 (2M Cache, 1.60 GHz, 533 MHz FSB)
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Intel® Turbo Boost Technology No
Intel® Hyper-Threading Technology No
Intel® Virtualization Technology (VT-x) No
Intel® Trusted Execution Technology No
Intel® 64 No
Idle States No
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching No
Execute Disable Bit Yes
Orderin
g
and Spec Information
Retired and Discontinued
Intel® Core™ Duo Processor T2050 (2M Cache, 1.60 GHz, 533 MHz FSB) TJ, uFCPGA, Tray
Socket Step Step TDP Ordering Code Spec Code Low Halogen VT-x
PPGA478 31 W LF80539GE0252M SL9BN No No
Compatible Products
Chipsets Mobile Intel® 945GM Express Chipset (Configurations: 2)
Mobile Intel® 945GME Express Chipset (Configurations: 2)
Mobile Intel® 945PM Express Chipset (Configurations: 2)
Mobile Intel® 945GM Express Chipset with
82801GBM I/O Controller Hub (ICH7M)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Mobile Intel® 945GM Express Chipset with
82801GHM I/O Controller Hub 7 (ICH7MDH)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Mobile Intel® 945GME Express Chipset with
82801GBM I/O Controller Hub (ICH7M)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Mobile Intel® 945GME Express Chipset with
82801GHM I/O Controller Hub 7 (ICH7MDH)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Mobile Intel® 945PM Express Chipset with
82801GBM I/O Controller Hub (ICH7M)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Mobile Intel® 945PM Express Chipset with
82801GHM I/O Controller Hub 7 (ICH7MDH)
# of CPUs: 1
Embedded: No
System Price: N/A
System TDP: 41.3W
Block Diagrams
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Disclaimers
“
Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and
applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled
BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
Hyper-Threading Technology (HT Technology) requires a computer system with an Intel® processor supporting HT Technology and an HT
T
echnology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See
www.intel.com/products/ht/hyperthreading_more.htm for more information including details on which processors support HT Technology.
Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and for some
uses, certain platform software, enabled for it. Functionality, performance or other benefit will vary depending on hardware and software
configurations. Intel Virtualization Technology-enabled VMM applications are currently in development.
Note: Prices subject to change without notice. Prices are for direct Intel customers in 1000-unit bulk quantities and, unless specified, represent
the latest technology versions of the products. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment
quantities, and special promotional arrangements may apply.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families. See http://www.intel.com/products/processor_number for details.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
A
ll information provided is subject to change at any time, withou
t
notice. Intel may make changes to manufacturing life cycle, specifications,
and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or
warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the
products listed. Please contact system vendor for more information on specific products or systems.
Low Halogen implies the following:
Bromine and/or chlorine in materials that may be used during processing, but do not remain within the final product are not included in this
definition. The halogens fluorine (F), iodine (I), and astatine (At) are not restricted by this standard.
“
BFR/CFR and PVC-Free” Definition: :
A
ll PCB laminates must meet Br and Cl requirements for low halogen as defined in IPC-4101B
For components other than PCB laminates, all homogeneous materials must contain < 900 ppm (0.09%) of Bromine [if the Bromine (Br) source
is from BFRs] and < 900 ppm (0.09%) of Chlorine [if the Chlorine (Cl) source is from CFRs or PVC. Higher concentrations of Br and Cl are
allowed in homogenous materials of components other than PCB laminates as long as their sources are not BFRs, CFRs, PVC.
A
lthough the elemental analysis for Br and Cl in homogeneous materials can be performed by any analytical method with sufficient sensitivity
and selectivity, the presence or absence of BFRs, CFRs or PVC must be verified by any acceptable analytical techniques that allow for the
unequivocal identification of the specific Br or Cl compounds, or by appropriate material declarations agreed to between customer and supplier.
Max Turbo Frequency refers to the maximum single-core frequency that can be achieved with Intel® Turbo Boost Technology, which requires a
PC with a processor with Intel Turbo Boost Technolo
g
y capability. Intel Turbo Boost Technolo
g
y performance varies dependin
g
on hardware,
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software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.
See www.intel.com/technology/turboboost/ for more information.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-
2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
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Page 1 of 1Intel LF80539GF0282MES L9JE, 478FCPGA6, Core Duo, 2, 1660 MHz - Avnet Express
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Intel
Datasheet
LF80539GF0342M S L8VQ
MPU Core Duo 65nm 1.83GHz 1.05V 478-Pin Micro-FCPGA
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Part Details
IntelLF80539GF0342M S L8VQ
MPU Core Duo 65nm 1.83GHz 1.05V 478-Pin
Micro-FCPGA
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Description Value
Package 478Micro-FCPGA
Family Name Core Duo
Number of CPU Cores 2
Maximum Speed 1830 MHz
I/O Voltage 1.05 V
Operating Temperature 0 to 100 °C
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Page 1 of 1Intel LF80539GF0342M S L8VQ, 478Micro-FCPGA, Core Duo, 2, 1830 MHz - Avnet E...
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LF80539GF0342M S L8VQ
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Your cart is empty. Avnet PartBuilder® - Home Page » Products » Processor » Processors» X LF80539GF0282M S L8VR
Intel
Datasheet
LF80539GF0282M S L8VR
MPU Core Duo 65nm 1.66GHz 1.05V 478-Pin Micro-FCPGA
Product
Specifications Print
Legend: = top seller = non-cancelable non-returnable = obsolete = cut tape = special quantity
= RoHS compliant = RoHS exempt = RoHS non-compliant = excess inventory = EU Sales Only
= only available on-line
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Part Details
IntelLF80539GF0282M S L8VR
MPU Core Duo 65nm 1.66GHz 1.05V 478-Pin
Micro-FCPGA
Parametric Search for Alternate Parts
select required values below
Search
Search within this category only
Search within this manufacturer only
Description Value
Package 478Micro-FCPGA
Family Name Core Duo
Number of CPU Cores 2
Maximum Speed 1660 MHz
I/O Voltage 1.05 V
Operating Temperature 0 to 100 °C
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Page 1 of 1Intel LF80539GF0282M S L8VR, 478Micro-FCPGA, Core Duo, 2, 1660 MHz - Avnet E...
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