data sheet CERAMIC / HERMETIC CSSOP Ceramic Shrink Small Outline Package (CSSOP) This is a ceramic version of the Plastic SSOP package. The CSSOP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. This package has leads extending from two sides of the package (dual). The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400 - 460 Centigrade. Features: The CSSOP offers a variety of features: * 20 & 24 lead counts (Others available when tooled) * 150 mil body size (Others available when tooled) * Hermetic package * High thermal conductive ceramic * Matte Tin Plate lead finish * JEDEC and EIAJ package outline standard compliant * Wide selection of cavity sizes to meet most die size needs * Commercial or full Military flows Applications: These packages enable end products (pagers, portable audio / video, disc drives, radio, RF devices / components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs technologies are well addressed by Amkor's CSSOP product family. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS808 Rev Date: 08'02