© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 7 1Publication Order Number:
MC100EP14/D
MC100EP14
3.3V / 5V 1:5 Differential
ECL/PECL/HSTL Clock Driver
Description
The MC100EP14 is a low skew 1−to−5 differential driver , designed with
clock distribution in mind, accepting two clock sources into an input
multiplexer. The ECL/PECL input signals can be either differential or
single−ended (if the V BB output is used). HSTL inputs can be used when
the LVEP14 is operating under PECL conditions.
The EP14 specifically guarantees low output−to−output skew. Optimal
design, layout, and processing minimize skew within a device and from
device to device.
To ensure that the tight skew specification is realized, both sides of
any differential output need to be terminated even if only one output is
being used. If an output pair is unused, both outputs may be left open
(unterminated) without affecting skew.
The common enable (EN) is synchronous, outputs are enabled/
disabled in the LOW state. This avoids a runt clock pulse when the
device is enabled/disabled as can happen with an asynchronous
control. The internal flip flop is clocked on the falling edge of the input
clock, therefore all associated specification limits a re r ef er en ce d to th e
negative edge of the clock input.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single−ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
Features
400 ps Typical Propagation Delay
100 ps Device−to−Device Skew
25 ps Within Device Skew
Maximum Frequency > 2 GHz Typical
The 100 Series Contains Temperature Compensation
PECL and HSTL Mode:
VCC = 3.0 V to 5.5 V with VEE = 0 V
NECL Mode:
VCC = 0 V with VEE = −3.0 V to −5.5 V
Open Input Default State
These are Pb−Free Devices
TSSOP−20
DT SUFFIX
CASE 948E
MARKING DIAGRAM*
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= Pb−Free Package
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100
EP14
ALYWG
G
1
20
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
(Note: Microdot may be in either location)
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2
Figure 1. TSSOP−20 (Top View) and Logic Diagram
W ARNING: All V CC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Q2Q1 Q3Q1
1718 16 15 14 13 12
43 56789
11
10
CLK1 CLK0 CLK0
Q0
1920
21
EN
Q2Q0 Q3 Q4Q4
CLK1
10
DQ
VCC VCC VBB VEE
CLK_SEL
Table 1. PIN DESCRIPTION
Pin Function
CLK0*, CLK0** ECL/PECL/HSTL CLK Input
CLK1*, CLK1** ECL/PECL/HSTL CLK Input
Q0:4, Q0:4 ECL/PECL Outputs
CLK_SEL* ECL/PECL Active Clock Select Input
EN* ECL Sync Enable
VBB Reference Voltage Output
VCC Positive Supply
VEE Negative Supply
* Pins will default low when left open.
** Pins will default to VCC/2 when left open.
Table 2. FUNCTION TABLE
CLK0 CLK1 CLK_SEL EN Q
L
H
X
X
X
X
X
L
H
X
L
L
H
H
X
L
L
L
L
H
L
H
L
H
L*
* On next negative transition of CLK0 or CLK1
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Table 3. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 kW
Internal Input Pullup Resistor 37.5 kW
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg
TSSOP−8 Level 1 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 357 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 6 V
VEE NECL Mode Power Supply VCC = 0 V −6 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage VEE = 0 V
VCC = 0 V VI VCC
VI VEE
6
−6 V
V
Iout Output Current Continuous
Surge 50
100 mA
mA
IBB VBB Sink/Source ± 0.5 mA
TAOperating Temperature Range −40 to +85 °C
Tstg Storage Temperature Range −65 to +150 °C
qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm TSSOP−20
TSSOP−20 140
100
°C/W
°C/W
qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−20 23 to 41 °C/W
Tsol Wave Solder <2 to 3 sec @ 248°C 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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Table 5. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
Symbol Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 45 55 65 48 58 68 52 62 72 mA
VOH Output HIGH Voltage (Note 3) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
VOL Output LOW Voltage (Note 3) 1305 1480 1605 1305 1480 1605 1305 1480 1605 mV
VIH Input HIGH Voltage (Single−Ended) 2075 2420 2075 2420 2075 2420 mV
VIL Input LOW Voltage (Single−Ended) 1305 1675 1305 1675 1305 1675 mV
VBB Output Voltage Reference 1775 1875 1975 1775 1875 1975 1775 1875 1975 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 4)
1.2 3.3 1.2 3.3 1.2 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D0.5
−150 0.5
−150 0.5
−150 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
3. All loading with 50 W to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 6. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5)
Symbol Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 45 55 65 48 58 68 52 62 72 mA
VOH Output HIGH Voltage (Note 6) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV
VOL Output LOW Voltage (Note 6) 3005 3180 3305 3005 3180 3305 3005 3180 3305 mV
VIH Input HIGH Voltage (Single−Ended) 3775 4120 3775 4120 3775 4120 mV
VIL Input LOW Voltage (Single−Ended) 3005 3375 3005 3375 3005 3375 mV
VBB Output Voltage Reference 3475 3575 3675 3475 3575 3675 3475 3575 3675 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 7)
1.2 5.0 1.2 5.0 1.2 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D0.5
−150 0.5
−150 0.5
−150 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
6. All loading with 50 W to VCC − 2.0 V.
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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Table 7. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 8)
Symbo
l
Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 45 55 65 48 58 68 52 62 72 mA
VOH Output HIGH Voltage (Note 9) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV
VOL Output LOW Voltage (Note 9) −1995 −1820 −1695 −1995 −1820 −1695 −1995 −1820 −1695 mV
VIH Input HIGH Voltage (Single−Ended) −1225 −880 −1225 −880 −1225 −880 mV
VIL Input LOW Voltage (Single−Ended) −1995 −1625 −1995 −1625 −1995 −1625 mV
VBB Output Reference Voltage −1525 −1425 −1325 −1525 −1425 −1325 −1525 −1425 −1325 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 10)
VEE+1.2 0.0 VEE+1.2 0.0 VEE+1.2 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current CLK
CLK 0.5
−150 0.5
−150 0.5
−150 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC.
9. All loading with 50 W to VCC − 2.0 V.
10.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 11)
Symbo
l
Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
VOPP Output Voltage Amplitude @ 2 GHz
(Figure 2) 440 540 420 520 380 480 GHz
tPLH
tPHL Propagation Delay to
Output Differential 275 330 400 275 375 450 280 380 480 ps
tskew Within−Device Skew
Device−to−Device Skew
(Note 12)
25
100 35
125 30
150 45
175 40
175 50
200 ps
ts
thSetup Time to CLK EN to CLK
Hold Time EN to CLK 100
200 50
140 100
200 50
140 100
200 50
140 ps
tJITTER Cycle−to−Cycle Jitter (Figure 2) 0.2 < 1 0.2 < 1 0.2 < 1 ps
VPP Minimum Input Swing 150 800 1200 150 800 1200 150 800 1200 mV
tr/tfOutput Rise/Fall Time (20%−80%) 105 155 205 145 200 270 150 225 300 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
12.Skew is measured between outputs under identical transitions.
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400
450
500
550
600
650
700
750
800
850
900
0.0 0.5 1.0 1.5 2.0 2.5
1
2
3
4
5
6
7
8
9
Figure 2. Fmax/Jitter
FREQUENCY (MHz)
(JITTER)
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
VOUTpp (mV)
JITTEROUT ps (RMS)
ÉÉ
ÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
3.3 V
5.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC − 2.0 V
ORDERING INFORMATION
Device Package Shipping
MC100EP14DTG TSSOP−20
(Pb−Free) 75 Units / Rail
MC100EP14DTR2G TSSOP−20
(Pb−Free) 2500 / Tape & Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
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PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B4.30 4.50 0.169 0.177
C1.20 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
DGH
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
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