MC74HC30DR2 - Motorola / Freescale Semiconductor



SEMICONDUCTOR TECHNICAL DATA

1REV 6

 Motorola, Inc. 1995

10/95

  

High–Performance Silicon–Gate CMOS

The MC74HC30 is identical in pinout to the LS30. The device inputs are

compatible with standard CMOS outputs; with pullup resistors, they are

compatible with LSTTL outputs.

•Output Drive Capability: 10 LSTTL Loads

•Outputs Directly Interface to CMOS, NMOS, and TTL

•Operating Voltage Range: 2 to 6 V

•Low Input Current: 1 µA

•High Noise Immunity Characteristic of CMOS Devices

•In Compliance with the Requirements Defined by JEDEC Standard

No. 7A

•Chip Complexity: 32 FETs or 8 Equivalent Gates

LOGIC DIAGRAM

8Y = ABCDEFGH

PIN 14 = VCC

PIN 7 = GND

PINS 9, 10, 13 = NO CONNECTION



FUNCTION TABLE

PIN ASSIGNMENT

Inputs A through H

105

VCC

GND

NC = NO CONNECTION

Output

All inputs H

One or more inputs L

D SUFFIX

SOIC PACKAGE

CASE 751A–03

N SUFFIX

PLASTIC PACKAGE

CASE 646–06

ORDERING INFORMATION

MC74HCXXN

MC74HCXXD Plastic

SOIC

MC74HC30

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS*

ÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎ

Value

ÎÎÎ

Unit

ÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to + 7.0

ÎÎÎ

Vin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 1.5 to VCC + 1.5

ÎÎÎ

Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to VCC + 0.5

ÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Current, per Pin

ÎÎÎÎÎÎ

± 20

ÎÎÎ

Iout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per Pin

ÎÎÎÎÎÎ

± 25

ÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND Pins

ÎÎÎÎÎÎ

± 50

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

ÎÎÎÎÎÎ

750

500

ÎÎÎ

Tstg

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature

ÎÎÎÎÎÎ

– 65 to + 150

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP or SOIC Package)

ÎÎÎÎÎÎ

260

ÎÎÎ

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/

C from 65

to 125

SOIC Package: – 7 mW/

C from 65

to 125

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎ

2.0

ÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage, Output Voltage (Referenced to GND)

ÎÎÎ

VCC

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature, All Package Types

ÎÎÎ

– 55

ÎÎÎ

+ 125

ÎÎÎ

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time VCC = 2.0 V

(Figure 1) VCC = 4.5 V

VCC = 6.0 V

ÎÎÎ

1000

500

400

ÎÎÎ

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎ

– 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

VIH

ÎÎÎÎÎÎÎÎÎ

Minimum High–Level Input

Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC – 0.1 V

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

1.5

3.15

4.2

ÎÎÎÎ

1.5

3.15

4.2

ÎÎÎÎ

1.5

3.15

4.2

ÎÎÎ

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎ

Maximum Low–Level Input

Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC – 0.1 V

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

0.3

0.9

1.2

ÎÎÎÎ

0.3

0.9

1.2

ÎÎÎÎ

0.3

0.9

1.2

ÎÎÎ

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎ

Minimum High–Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

1.9

4.4

5.9

ÎÎÎÎ

1.9

4.4

5.9

ÎÎÎÎ

1.9

4.4

5.9

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL |Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5

6.0

ÎÎÎ

3.98

5.48

ÎÎÎÎ

3.84

5.34

ÎÎÎÎ

3.70

5.20

ÎÎÎ

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎ

Maximum Low–Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL |Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5

6.0

ÎÎÎ

0.26

ÎÎÎÎ

0.33

ÎÎÎÎ

0.40

ÎÎÎ

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎ

Maximum Input Leakage Current

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

ÎÎÎÎ

6.0

ÎÎÎ

± 0.1

ÎÎÎÎ

± 1.0

ÎÎÎÎ

± 1.0

ÎÎÎ

µA

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎ

Maximum Quiescent Supply

Current (per Package)

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

Iout = 0 µA

ÎÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

ÎÎÎ

µA

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high–impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND

(Vin or V out)

VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

MC74HC30

High–Speed CMOS Logic Data

DL129 — Rev 6 3 MOTOROLA

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎ

– 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

tPLH,

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Any Input to Output Y

(Figures 1 and 2)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

175

ÎÎÎÎ

220

ÎÎÎÎ

265

ÎÎÎ

ÎÎÎÎ

tTLH,

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Output Transition Time, Any Output

(Figures 1 and 2)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

ÎÎÎÎ

110

ÎÎÎ

ÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input Capacitance

ÎÎÎÎ

—

ÎÎÎ

ÎÎÎÎ

ÎÎÎ

NOTES:

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

CPD

Power Dissipation Capacitance (Per Gate)*

Typical @ 25°C, VCC = 5.0 V

CPD Power Dissipation Capacitance (Per Gate)*

*Used to determine the no–load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola High–Speed CMOS Data Book (DL129/D).

Figure 1. Switching Waveforms

trVCC

GND

90%

50%

10%

90%

50%

10%

ANY INPUT

OUTPUT Y

tPHL tPLH

tTHL tTLH

*Includes all probe and jig capacitance

Figure 2. Test Circuit

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

EXPANDED LOGIC DIAGRAM

MC74HC30

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC DIP PACKAGE

CASE 646–06

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

1 7

14 8

H G D K

SEATING

PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.715 0.770 18.16 19.56

B0.240 0.260 6.10 6.60

C0.145 0.185 3.69 4.69

D0.015 0.021 0.38 0.53

F0.040 0.070 1.02 1.78

G0.100 BSC 2.54 BSC

H0.052 0.095 1.32 2.41

J0.008 0.015 0.20 0.38

K0.115 0.135 2.92 3.43

L0.300 BSC 7.62 BSC

M0 10 0 10

N0.015 0.039 0.39 1.01

_ _ _ _

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751A–03

ISSUE F

MIN MINMAX MAX

MILLIMETERS INCHES

DIM

8.55

3.80

1.35

0.35

0.40

0.19

0.10

5.80

0.25

8.75

4.00

1.75

0.49

1.25

0.25

6.20

0.50

0.337

0.150

0.054

0.014

0.016

0.008

0.004

0.228

0.010

0.344

0.157

0.068

0.019

0.049

0.009

0.244

0.019

1.27 BSC 0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

–A–

–B– P 7 PL

SEATING

PLANE

D 14 PL MJ

R X 45°

814

0.25 (0.010) T B A

MS S

B0.25 (0.010) M M

MC74HC30

High–Speed CMOS Logic Data

DL129 — Rev 6 5 MOTOROLA

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MC74HC30/D

*MC74HC30/D*

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