High Luminous Efficacy Amber LED Emitter LZ4-00A100 Key Features High Luminous Efficacy 10W Amber LED Ultra-small foot print - 7.0mm x 7.0mm Surface mount ceramic package with integrated glass lens Very low Thermal Resistance (1.1C/W) Individually addressable die Very high Luminous Flux density JEDEC Level 1 for Moisture Sensitivity Level Autoclave compliant (JEDEC JESD22-A102-C) Lead (Pb) free and RoHS compliant Reflow solderable (up to 6 cycles) Emitter available on Serially Connected MCPCB (optional) Typical Applications Emergency vehicle lighting Strobe and warning lights Marine and buoy lighting Aviation and obstruction lighting Roadway beacons and traffic signaling Architectural lighting Automotive signal and marker lights Description The LZ4-00A100 Amber LED emitter provides 10W power in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin's LZ4-00A100 LED offers ultimate design flexibility with individually addressable die. The patent-pending design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. LZ4-00A100 (5.3-01/16/13) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part number options Base part number Part number Description LZ4-00A100-xxxx LZ4 emitter LZ4-40A100-xxxx LZ4 emitter on Standard Star 1 channel MCPCB Notes: 1. See "Part Number Nomenclature" for full overview on LED Engin part number nomenclature. Bin kit option codes A1, Amber (590nm) Kit number suffix Min flux Bin Color Bin Range 0000 Q A3 - A6 0A45 Q A4 - A5 Description full distribution flux; full distribution wavelength full distribution flux; wavelength A4 and A5 bins Notes: 1. Default bin kit option is -0000 LZ4-00A100 (5.3-01/16/13) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Luminous Flux Bins Table 1: Bin Code Minimum Luminous Flux (V) @ IF = 700mA [1,2] (lm) Maximum Luminous Flux (V) @ IF = 700mA [1,2] (lm) Q 228 285 R 285 356 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. 2. LED Engin maintains a tolerance of 10% on flux measurements. 3. Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information. Dominant Wavelength Bins Table 2: Bin Code Minimum Dominant Wavelength (D) @ IF = 700mA [1,2] (nm) Maximum Dominant Wavelength (D) @ IF = 700mA [1,2] (nm) A3 587.5 590 A4 590 592.5 A5 592.5 595 A6 595 597.5 Notes for Table 2: 1. Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue. 2. LED Engin maintains a tolerance of 1.0nm on dominant wavelength measurements. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 8.96 11.60 Notes for Table 3: 1. LED Engin maintains a tolerance of 0.04V for forward voltage measurements. 2. Forward Voltage is binned with all four LED dice connected in series. LZ4-00A100 (5.3-01/16/13) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IF IFP VR Tstg TJ Tsol 1200 1000 1500 See Note 3 -40 ~ +125 125 260 6 mA mA [1] DC Forward Current at Tjmax=100C DC Forward Current at Tjmax=125C [1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles mA V C C C Autoclave Conditions [5] 121C at 2 ATM, 100% RH for 168 hours ESD Sensitivity [6] > 8,000 V HBM Class 3B JESD22-A114-D Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2: Pulse forward current conditions: Pulse Width 10msec and Duty Cycle 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. Autoclave Conditions per JEDEC JESD22-A102-C. 6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00A100 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25C Table 5: Parameter Symbol Typical Unit Luminous Flux (@ IF = 700mA) [1] Luminous Flux (@ IF = 1000mA) [1] Dominant Wavelength [2] Viewing Angle [3] Total Included Angle [4] V V D 21/2 0.9V 325 420 590 95 110 lm lm nm Degrees Degrees Notes for Table 5: 1. Luminous flux typical value is for all four LED dice operating concurrently at rated current. 2. Amber LEDs have a significant shift in wavelength over temperature; please refer to Figure 6 for details. Caution must be exercised if designing to meet a regulated color space due to this behavior as product may shift out of legal color space under elevated temperatures. 3. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is 1/2 of the peak value. 4. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ TC = 25C Table 6: Parameter Symbol Typical Unit Forward Voltage (@ IF = 700mA) Forward Voltage (@ IF = 1000mA) [1] VF VF 9.0 9.8 V V Temperature Coefficient of Forward Voltage [1] VF/TJ -11.2 mV/C Thermal Resistance (Junction to Case) RJ-C 1.1 C/W [1] Notes for Table 6: 1. Forward Voltage typical value is for all four LED dice connected in series. LZ4-00A100 (5.3-01/16/13) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited 30C/ 85% RH 168 +5/-0 85C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer's exposure time (MET) between bake and bag and the floor life of maximum time allowed out of the bag at the end user of distributor's facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on constant current operation with junction temperature maintained at or below 110C. LZ4-00A100 (5.3-01/16/13) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mechanical Dimensions (mm) Pin Out 1 Pad Die 1 A Anode 2 A Cathode 3 B Anode 4 B Cathode 5 C Anode 6 C Cathode 7 D Anode 8 D Cathode 9 [2] n/a Thermal 2 Function 3 8 Figure 1: Package outline drawing. 4 7 6 5 Notes for Figure 1: 1. Unless otherwise noted, the tolerance = 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutral. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = 0.20 mm. 2. This pad layout is "patent pending". LZ4-00A100 (5.3-01/16/13) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2b: 1. Unless otherwise noted, the tolerance = 0.20 mm. Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. LZ4-00A100 (5.3-01/16/13) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. Typical Relative Spectral Power Distribution 1 0.9 Relative Spectral Power 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ TC = 25C. LZ4-00A100 (5.3-01/16/13) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Dominant Wavelength Shift over Temperature Dominant Wavelength Shift (nm) 8 7 6 5 4 3 2 1 0 0 20 40 60 80 100 800 1000 Case Temperature (C) Figure 6: Typical dominant wavelength shift vs. case temperature. Typical Relative Light Output 140 Relative Light Output (%) 120 100 80 60 40 20 0 0 200 400 600 IF - Forward Current (mA) Figure 7: Typical relative light output vs. forward current @ TC = 25C. LZ4-00A100 (5.3-01/16/13) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Light Output over Temperature 160 Relative Light Output (%) 140 120 100 80 60 40 20 0 0 20 40 60 80 100 Case Temperature (C) Figure 8: Typical relative light output vs. case temperature. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 VF - Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ TC = 25C. Note for Figure 9: 1. Forward Voltage curve assumes that all four LED dice are connected in series. LZ4-00A100 (5.3-01/16/13) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 RJ-A = 4.0C/W RJ-A = 5.0C/W RJ-A = 6.0C/W 400 200 0 0 25 50 75 100 125 Maximum Ambient Temperature (C) Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125C. Notes for Figure 10: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RJ-C [Junction to Case Thermal Resistance] for the LZ4-00A100 is typically 1.1C/W. 3. RJ-A [Junction to Ambient Thermal Resistance] = RJ-C + RC-A [Case to Ambient Thermal Resistance]. LZ4-00A100 (5.3-01/16/13) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Emitter Tape and Reel Specifications (mm) Figure 11: Emitter carrier tape specifications (mm). Figure 12: Emitter Reel specifications (mm). LZ4-00A100 (5.3-01/16/13) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part-number Nomenclature The LZ Series base part number designation is defined as follows: LZA-BCDEFG-HIJK A - designates the number of LED die in the package 1 for single die emitter package 4 for 4-die emitter package 9 for 9-die emitter package C for 12-die emitter package P for 25-die emitter package B - designates the package level 0 for Emitter only Other letters indicate the addition of a MCPCB. See appendix "MCPCB options" for details C - designates the radiation pattern 0 for Clear domed lens (Lambertian radiation pattern) 1 for Flat-top 3 for Frosted domed lens D and E - designates the color U6 Ultra Violet (365nm) UA Violet (400nm) DB Dental Blue (460nm) B2 Blue (465nm) G1 Green (525nm) A1 Amber (590nm) R1 Red (623nm) R2 Deep Red (660nm) R3 Far Red (740nm) R4 Infrared (850nm) WW Warm White (2700K-3500K) W9 Warm White CRI 90 Minimum (2700K-3500K) NW Neutral White (4000K) CW Cool White (5500K-6500K) W2 Warm & Cool White mixed dies MC RGB MA RGBA MD RGBW (6500K) F and G - designates the package options if applicable See "Base part number" on page 2 for details. Default is "00" H, I, J, K - designates kit options See "Bin kit options" on page 2 for details. Default is "0000" Ordering information: For ordering LED Engin products, please reference the base part number above. The base part number represents our standard full distribution flux and wavelength range. Other standard bin combinations can be found on page 2. For ordering products with custom bin selections, please contact a LED Engin sales representative or authorized distributor. LZ4-00A100 (5.3-01/16/13) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) LZ4-4xxxxx 1-channel 19.9 Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) 1.1 + 1.1 = 2.2 9.0 700 Mechanical Mounting of MCPCB o Mechanical stress on the emitter that could be caused by bending the MCPCB should be avoided. The stress can cause the substrate to crack and as a result might lead to cracks in the dies. o Therefore special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. Maximum torque should not exceed 1 Nm (8.9 lbf/in). o Care must be taken when securing the board to the heatsink to eliminate bending of the MCPCB. This can be done by tightening the three M3 screws (or #4-40) in steps and not all at once. This is analogous to tightening a wheel of an automobile o It is recommended to always use plastic washers in combination with three screws. Two screws could more easily lead to bending of the board. o If non taped holes are used with self-tapping screws it is advised to back out the screws slightly after tighten (with controlled torque) and retighten the screws again. Thermal interface material o To properly transfer the heat from the LED to the heatsink a thermally conductive material is required when mounting the MCPCB to the heatsink o There are several materials which can be used as thermal interface material, such as thermal paste, thermal pads, phase change materials and thermal epoxies. Each has pro's and con's depending on the application. For our emitter it is critical to verify that the thermal resistance is sufficient for the selected emitter and its environment. o To properly transfer the heat from the MCPCB to the heatsink also special attention should be paid to the flatness of the heatsink. Wire soldering o For easy soldering of wires to the MCPCB it is advised to preheat the MCPCB on a hot plate to a maximum of 150. Subsequently apply the solder and additional heat from the solder iron to initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. We advise to use lead free, no-clean solder. For example SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) LZ4-00A100 (5.3-01/16/13) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZ4-4xxxxx 1 channel, Standard Star MCPCB (1x4) Dimensions (mm) Notes: * Unless otherwise noted, the tolerance = 0.2 mm. * Slots in MCPCB are for M3 or #4-40 mounting screws. * LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces. * Electrical connection pads on MCPCB are labeled "+" for Anode and "-" for Cathode * LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink * The thermal resistance of the MCPCB is: RC-B 1.1C/W Components used MCPCB: ESD chips: HT04503 BZX585-C30 (Bergquist) (NPX, for 4 LED dies in series) Pad layout Ch. 1 MCPCB Pad + String/die Function 1/ABCD Cathode Anode + LZ4-00A100 (5.3-01/16/13) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Company Information LED Engin, Inc., based in California's Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient lighting experiences. The LuxiGenTM Platform -- an emitter and lens combination or integrated module solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin's packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient solid state lighting solutions. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LED Engin reserves the right to make changes to improve performance without notice. Please contact sales@ledengin.com or (408) 922-7200 for more information. LZ4-00A100 (5.3-01/16/13) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: LED Engin: LZ4-00A100 LZ4-40A100 LZ4-20A100