LZ4-40A100 - LED Engin - Datasheet.Global

LZ4-00A100 (5.3-01/16/13

)

High Luminous Efficacy

Amber LED Emitter

LZ4-00A100

Key Features

 High Luminous Efficacy 10W Amber LED

 Ultra-small foot print – 7.0mm x 7.0mm

 Surface mount ceramic package with integrated glass lens

 Very low Thermal Resistance (1.1°C/W)

 Individually addressable die

 Very high Luminous Flux density

 JEDEC Level 1 for Moisture Sensitivity Level

 Autoclave compliant (JEDEC JESD22-A102-C)

 Lead (Pb) free and RoHS compliant

 Reflow solderable (up to 6 cycles)

 Emitter available on Serially Connected MCPCB (optional)

Typical Applications

 Emergency vehicle lighting

 Strobe and warning lights

 Marine and buoy lighting

 Aviation and obstruction lighting

 Roadway beacons and traffic signaling

 Architectural lighting

 Automotive signal and marker lights

Description

The LZ4-00A100 Amber LED emitter provides 10W power in an extremely small package. With a 7.0mm x 7.0mm

ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s LZ4-00A100 LED offers

ultimate design flexibility with individually addressable die. The patent-pending design has unparalleled thermal

and optical performance. The high quality materials used in the package are chosen to optimize light output and

minimize stresses which results in monumental reliability and lumen maintenance. The robust product design

thrives in outdoor applications with high ambient temperatures and high humidity.

LZ4-00A100 (5.3-01/16/13)

Part number options

Base part number

Part number Description

LZ4-00A100-xxxx LZ4 emitter

LZ4-40A100-xxxx LZ4 emitter on Standard Star 1 channel MCPCB

Notes:

1. See “Part Number Nomenclature” for full overview on LED Engin part number nomenclature.

Bin kit option codes

A1, Amber (590nm)

Kit number

suffix

Min

flux

Bin

Color Bin Range Description

0000 Q A3 – A6 full distribution flux; full distribution

wavelength

0A45 Q A4 – A5 full distribution flux; wavelength A4 and

A5 bins

Notes:

1. Default bin kit option is -0000

LZ4-00A100 (5.3-01/16/13)

Luminous Flux Bins

Table 1:

Bin Code

Minimum

Luminous Flux (ΦV)

@ IF = 700mA

[1,2]

(lm)

Maximum

Luminous Flux (ΦV)

@ IF = 700mA

[1,2]

(lm)

Q 228 285

R 285 356

Notes for Table 1:

1. Luminous flux performance guaranteed within published operating conditions.

2. LED Engin maintains a tolerance of ± 10% on flux measurements.

3. Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information.

Dominant Wavelength Bins

Table 2:

Bin Code

Minimum

Dominant Wavelength (λD)

@ IF = 700mA

[1,2]

(nm)

Maximum

Dominant Wavelength (λD)

@ IF = 700mA

[1,2]

(nm)

A3 587.5 590

A4 590 592.5

A5 592.5 595

A6 595 597.5

Notes for Table 2:

1. Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue.

2. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.

Forward Voltage Bins

Table 3:

Bin Code

Minimum

Forward Voltage (VF)

@ IF = 700mA

[1,2]

(V)

Maximum

Forward Voltage (VF)

@ IF = 700mA

[1,2]

(V)

0 8.96 11.60

Notes for Table 3:

1. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.

2. Forward Voltage is binned with all four LED dice connected in series.

LZ4-00A100 (5.3-01/16/13)

Absolute Maximum Ratings

Table 4:

Parameter Symbol Value Unit

DC Forward Current at Tjmax=100°C [1] IF 1200 mA

DC Forward Current at Tjmax=125°C [1] IF 1000 mA

Peak Pulsed Forward Current

[2] IFP 1500 mA

Reverse Voltage VR See Note 3 V

Storage Temperature Tstg -40 ~ +125 °C

Junction Temperature TJ 125 °C

Soldering Temperature

[4] Tsol 260 °C

Allowable Reflow Cycles 6

Autoclave Conditions

[5] 121°C at 2 ATM,

100% RH for 168 hours

ESD Sensitivity

[6] > 8,000 V HBM

Class 3B JESD22-A114-D

Notes for Table 4:

1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.

Follow the curves in Figure 10 for current derating.

2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.

3. LEDs are not designed to be reverse biased.

4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.

5. Autoclave Conditions per JEDEC JESD22-A102-C.

6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00A100

in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.

Optical Characteristics @ TC = 25°C

Table 5:

Parameter Symbol Typical Unit

Luminous Flux (@ IF = 700mA)

[1] ΦV 325 lm

Luminous Flux (@ IF = 1000mA)

[1] ΦV 420 lm

Dominant Wavelength

[2] λD 590 nm

Viewing Angle

[3] 2Θ1/2 95 Degrees

Total Included Angle

[4] Θ0.9V 110 Degrees

Notes for Table 5:

1. Luminous flux typical value is for all four LED dice operating concurrently at rated current.

2. Amber LEDs have a significant shift in wavelength over temperature; please refer to Figure 6 for details. Caution must be exercised if designing to meet a

regulated color space due to this behavior as product may shift out of legal color space under elevated temperatures.

3. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.

4. Total Included Angle is the total angle that includes 90% of the total luminous flux.

Electrical Characteristics @ TC = 25°C

Table 6:

Parameter Symbol Typical Unit

Forward Voltage (@ IF = 700mA)

[1] VF 9.0 V

Forward Voltage (@ IF = 1000mA)

[1] VF 9.8 V

Temperature Coefficient

of Forward Voltage

[1] ΔVF/ΔTJ -11.2 mV/°C

Thermal Resistance

(Junction to Case) RΘJ-C 1.1 °C/W

Notes for Table 6:

1. Forward Voltage typical value is for all four LED dice connected in series.

LZ4-00A100 (5.3-01/16/13)

IPC/JEDEC Moisture Sensitivity Level

Table 7 - IPC/JEDEC J-STD-20D MSL Classification:

Soak Requirements

Floor Life Standard Accelerated

Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions

1 Unlimited ≤ 30°C/

85% RH

168

+5/-0

85°C/

85% RH n/a n/a

Notes for Table 7:

1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag

and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.

Average Lumen Maintenance Projections

Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for

solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original

light output remaining at a defined time period.

Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen

Maintenance at 65,000 hours of operation at a forward current of

700 mA per die. This projection is based on constant current operation with junction temperature maintained at

or below 110°C.

LZ4-00A100 (5.3-01/16/13)

Mechanical Dimensions (mm)

Figure 1: Package outline drawing.

Notes for Figure 1:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. Thermal contact, Pad 9, is electrically neutral.

Recommended Solder Pad Layout (mm)

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.

Note for Figure 2a:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. This pad layout is “patent pending”.

Pin Out

Pad Die Function

1 A Anode

2 A Cathode

3 B Anode

4 B Cathode

5 C Anode

6 C Cathode

7 D Anode

8 D Cathode

[2] n/a Thermal

LZ4-00A100 (5.3-01/16/13)

Recommended Solder Mask Layout (mm)

Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.

Note for Figure 2b:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

LZ4-00A100 (5.3-01/16/13)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

400 450 500 550 600 650 700

Wavelength (nm)

Relative Spectral Power

100

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Angular Displacement (Degrees)

Relative Intensity (%)

Typical Radiation Pattern

Figure 4: Typical representative spatial radiation pattern.

Typical Relative Spectral Power Distribution

Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.

LZ4-00A100 (5.3-01/16/13)

100

120

140

0200 400 600 800 1000

- Forward Current (mA)

Relative Light Output (%)

020 40 60 80 100

Case Temperature (ºC)

Dominant Wavelength Shift (nm)

Typical Dominant Wavelength Shift over Temperature

Figure 6: Typical dominant wavelength shift vs. case temperature.

Typical Relative Light Output

Figure 7: Typical relative light output vs. forward current @ TC = 25°C.

LZ4-00A100 (5.3-01/16/13)

200

400

600

800

1000

1200

77.5 88.5 99.5 10 10.5 11 11.5 12

- Forward Voltage (V)

- Forward Current (mA)

100

120

140

160

020 40 60 80 100

Case Temperature (ºC)

Relative Light Output (%)

Typical Relative Light Output over Temperature

Figure 8: Typical relative light output vs. case temperature.

Typical Forward Current Characteristics

Figure 9: Typical forward current vs. forward voltage @ TC = 25°C.

Note for Figure 9:

1. Forward Voltage curve assumes that all four LED dice are connected in series.

LZ4-00A100 (5.3-01/16/13)

200

400

600

800

1000

1200

025 50 75 100 125

Maximum Ambient Temperature (°C)

- Maximum Current (mA)

RΘ

J-A

= 4.0°C/W

RΘ

J-A

= 5.0°C/W

RΘ

J-A

= 6.0°C/W

700

(Rated)

Current De-rating

Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.

Notes for Figure 10:

1. Maximum current assumes that all four LED dice are operating concurrently at the same current.

2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00A100 is typically 1.1°C/W.

3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].

LZ4-00A100 (5.3-01/16/13)

Emitter Tape and Reel Specifications (mm)

Figure 11: Emitter carrier tape specifications (mm).

Figure 12: Emitter Reel specifications (mm).

LZ4-00A100 (5.3-01/16/13)

Part-number Nomenclature

The LZ Series base part number designation is defined as follows:

L Z A – B C D E F G – H I J K

A – designates the number of LED die in the package

1 for single die emitter package

4 for 4-die emitter package

9 for 9-die emitter package

C for 12-die emitter package

P for 25-die emitter package

B – designates the package level

0 for Emitter only

Other letters indicate the addition of a MCPCB. See appendix “MCPCB options” for details

C – designates the radiation pattern

0 for Clear domed lens (Lambertian radiation pattern)

1 for Flat-top

3 for Frosted domed lens

D and E – designates the color

U6 Ultra Violet (365nm)

UA Violet (400nm)

DB Dental Blue (460nm)

B2 Blue (465nm)

G1 Green (525nm)

A1 Amber (590nm)

R1 Red (623nm)

R2 Deep Red (660nm)

R3 Far Red (740nm)

R4 Infrared (850nm)

WW Warm White (2700K-3500K)

W9 Warm White CRI 90 Minimum (2700K-3500K)

NW Neutral White (4000K)

CW Cool White (5500K-6500K)

W2 Warm & Cool White mixed dies

MC RGB

MA RGBA

MD RGBW (6500K)

F and G – designates the package options if applicable

See “Base part number” on page 2 for details. Default is “00”

H, I, J, K – designates kit options

See “Bin kit options” on page 2 for details. Default is “0000”

Ordering information:

For ordering LED Engin products, please reference the base part number above. The base part number represents

our standard full distribution flux and wavelength range. Other standard bin combinations can be found on page 2.

For ordering products with custom bin selections, please contact a LED Engin sales representative or authorized

distributor.

LZ4-00A100 (5.3-01/16/13)

LZ4 MCPCB Family

Part number Type of MCPCB Diameter

(mm)

Emitter + MCPCB

Thermal Resistance

(oC/W)

Typical Vf

(V)

Typical If

(mA)

LZ4-4xxxxx 1-channel 19.9 1.1 + 1.1 = 2.2 9.0 700

 Mechanical Mounting of MCPCB

o Mechanical stress on the emitter that could be caused by bending the MCPCB should be avoided. The

stress can cause the substrate to crack and as a result might lead to cracks in the dies.

o Therefore special attention needs to be paid to the flatness of the heat sink surface and the torque

on the screws. Maximum torque should not exceed 1 Nm (8.9 lbf/in).

o Care must be taken when securing the board to the heatsink to eliminate bending of the MCPCB. This

can be done by tightening the three M3 screws (or #4-40) in steps and not all at once. This is

analogous to tightening a wheel of an automobile

o It is recommended to always use plastic washers in combination with three screws. Two screws could

more easily lead to bending of the board.

o If non taped holes are used with self-tapping screws it is advised to back out the screws slightly after

tighten (with controlled torque) and retighten the screws again.

 Thermal interface material

o To properly transfer the heat from the LED to the heatsink a thermally conductive material is required

when mounting the MCPCB to the heatsink

o There are several materials which can be used as thermal interface material, such as thermal paste,

thermal pads, phase change materials and thermal epoxies. Each has pro’s and con’s depending on

the application. For our emitter it is critical to verify that the thermal resistance is sufficient for the

selected emitter and its environment.

o To properly transfer the heat from the MCPCB to the heatsink also special attention should be paid to

the flatness of the heatsink.

 Wire soldering

o For easy soldering of wires to the MCPCB it is advised to preheat the MCPCB on a hot plate to a

maximum of 150°. Subsequently apply the solder and additional heat from the solder iron to initiate a

good solder reflow. It is recommended to use a solder iron of more than 60W. We advise to use lead

free, no-clean solder. For example SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601)

LZ4-00A100 (5.3-01/16/13)

LZ4-4xxxxx

1 channel, Standard Star MCPCB (1x4) Dimensions (mm)

Notes:

• Unless otherwise noted, the tolerance = ± 0.2 mm.

• Slots in MCPCB are for M3 or #4-40 mounting screws.

• LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

• Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode

• LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink

• The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W

Components used

MCPCB: HT04503 (Bergquist)

ESD chips: BZX585-C30 (NPX, for 4 LED dies in series)

Pad layout

Ch. MCPCB

Pad String/die Function

1 - 1/ABCD Cathode -

+ Anode +

LZ4-00A100 (5.3-01/16/13)