TLP700
2017-05-24
1
Unit: mm
Weight: 0.26 g (typ.)
4.58±0.25
4.0
+0.25
-0.20
9.7±0.3
6.8±0.25
0.4±0.1
1.27±0.2 1.25±0.25
7.62±0.25
3.65 +0.15
-0.25
0.25
1 2 3
6 5 4
11-5J1
TOSHIBA 11-5J1
-0.05
+0.10
TOSHIBA Photocoupler GaAℓAs IRED + Photo IC
TLP700
Industrial inverters
Inverter for air conditioners
IGBT/Power MOSFET gate drive
TLP700 consists of a GaAℓAs light-emitting diode and an integrated
photodetector. This unit is 6-lead SDIP package. The TLP700 is 50% smaller than
the 8-pin DIP and meets the reinforced insulation class requirements of
international safety standards. Therefore the mounting area can be reduced in
equipment requiring safety standard certification. The TLP700 is suitable for gate
driving circuits for IGBTs or power MOSFETs. In particular, the TLP700 is capable
of “direct” gate driving of low-power IGBTs.
• Peak output current: ±2.0 A (max)
• Guaranteed performance over temperature: -40 to 100°C
• Supply current: 2.0 mA (max)
• Power supply voltage: 15 to 30 V
• Threshold input current: IFLH = 5 mA (max)
• Switching time (tpLH / tpHL): 500 ns (max)
• Common mode transient immunity: ±15 kV/μs (min)
• Isolation voltage: 5000 Vrms (min)
• UL recognized: UL1577, File No. E67349
• c-UL approved : CSA Component Acceptance Service
No. 5A, File No.E67349
• Option (D4) VDE approved :
EN60747-5-5 EN60065 EN60950-1(Note 1)
EN62368-1(Pending)
Note 1: When a EN60747-5-5 approved type is needed,
please designate the “Option(D4)”
Truth Table
Input LED M1 M2 Output
H ON ON OFF H
L OFF OFF ON L
Note: A 0.1-μF bypass capacitor must be connected
between pins 6 and 4.
Schematic
VCC
GND
ICC
(M1)
(M2)
IO
IF
1＋
4
5
6
VO
VF
3－
SHIELD
Start of commercial production
2007-08
1: ANODE
2: N.C
3: CATHODE
4: GND
5: VO ( OUTPUT )
6: VCC
1
3 4
5
6
2
SHIELD
Pin Configuration (Top View)
TLP700
2017-05-24
2
Absolute Maximum Ratings (Ta = 25 °C)
Characteristics
Symbol
Rating
Unit
LED
IF
20
mA
Forward current derating (Ta ≥ 85°C) ∆I
F
/∆Ta -0.54 mA/°C
Peak transient forward current (Note 1) I
FP
1 A
VR
5
V
Diode power dissipation P
D
40 mW
Diode power dissipation derating (Ta
85 °C) ∆PD/∆Ta -1.0 mW/°C
Junction temperature T
j
125 °C
Detector
“H” peak output current Ta=-40 to 100 °C
(Note 2)
I
OPH
-2.0 A
“L” peak output current
IOPL
2.0
A
VO
35
V
Supply voltage V
CC
35 V
Power dissipation PC 400 mW
Junction temperature T
j
125 °C
Operating frequency (Note 3)
f
50
kHz
Operating temperature range Topr -40 to 100 °C
Storage temperature range T
stg
-55 to 125 °C
Lead soldering temperature (10 s) (Note 4) T
sol
260 °C
Isolation voltage (AC, 60 s, R.H. ≤ 60%) (Note 5) BV
S
5000 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypassing may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 1: Pulse width PW ≤ 1 μs, 300 pps
Note 2: Exponential waveform pulse width PW ≤ 0.3 μs, f ≤15 kHz
Note 3: Exponential waveform IOPH ≥ -1.5 A (≤ 0.3 μs), IOPL ≤ +1.5 A (≤ 0.3 μs), Ta=100°C
Note 4: For the effective lead soldering area
Note 5: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
Recommended Operating Conditions
Characteristics Symbol Min Typ. Max Unit
Input current, ON (Note 1)
IF (ON)
7.5
―
10
mA
Input voltage, OFF
VF (OFF)
0
―
0.8
V
Supply voltage (Note 2)(Note 3)
VCC
15
―
30
V
Peak output current I
OPH
/ I
OPL
― ― ±1.5 A
Operating temperature T
opr
-40 ― 100 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 1: Input signal rise time (fall time) ≤ 0.5 μs.
Note 2: This item denotes operating ranges, not meaning of recommended operating conditions.
Note 3: If the VCC rise slope is sharp, an internal circuit might not operate with stability. Please design the VCC rise
slope under 3.0 V/μs.
TLP700
2017-05-24
3
Electrical Characteristics (Ta = -40 to 100 °C, unless otherwise specified)
Characteristics Symbol Test
Circuit Test Condition Min Typ. Max Unit
Forward voltage VF ― IF = 10 mA, Ta = 25 °C ― 1.57 1.75 V
Temperature coefficient of forward
voltage ∆VF/∆Ta ― IF = 10 mA ― -1.8 ― mV/°C
Input reverse current IR ― VR = 5 V, Ta = 25 °C ― ― 10 μA
Input capacitance CT ― V = 0 V, f = 1 MHz, Ta = 25 °C ― 100 ― pF
Output current
(Note 1)
“H” Level
IOPH1
1 VCC = 15 V
IF = 5 mA
V6-5 = 3.5 V ― -1.4 -1.0
A
IOPH2 V6-5 = 7 V ― ― -1.5
“L” Level
IOPL1
2 VCC = 15 V
IF = 0 mA
V5-4 = 2.5 V 1.0 1.4 ―
IOPL2 V5-4 = 7 V 1.5 ― ―
Output voltage
“H” Level VOH 3 VCC1=+15V, VEE1=-15V
RL = 200Ω, IF = 5 mA 11 13.7 ―
V
“L” Level VOL 4 VCC1=+15V, VEE1=-15V
RL = 200Ω, VF = 0.8 V ― -14.9 -12.5
Supply current
“H” Level ICCH 5 VCC = 30 V
VO=Open
IF = 10 mA ― 1.3 2.0
mA
“L” Level ICCL 6 IF = 0 mA ― 1.3 2.0
Threshold input current L → H IFLH ― VCC = 15 V, VO > 1 V ― 1.8 5 mA
Threshold input voltage H → L VFHL ― VCC = 15 V, VO < 1 V 0.8 ― ― V
Supply voltage VCC ― ― 15 ― 30 V
UVLO thresh hold
VUVLO+ ― VO > 2.5V, IF = 5 mA 11.0 12.5 13.5 V
VUVLO- ― VO < 2.5V, IF = 5 mA 9.5 11.0 12.0 V
UVLO hysteresis UVLOHYS ― ― ― 1.5 ― V
Note: All typical values are at Ta = 25°C
Note: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low
power consumption design. It is therefore all the more necessary to observe general precautions regarding
ESD when handling this component.
Note 1: Duration of Io time ≤ 50 μs, 1 pulse
Isolation Characteristics (Ta = 25 °C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Capacitance input to output CS Vs = 0 V, f = 1MHz (Note 1)
― 1.0 ― pF
Isolation resistance RS R.H. ≤ 60 %, VS = 500 V (Note 1)
1×1012 1014 ― Ω
Isolation voltage BVS
AC, 60 s 5000 ― ―
Vrms
AC, 1 s, in oil ― 10000 ―
DC, 60 s, in oil ― 10000 ― Vdc
Note 1: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
TLP700
2017-05-24
4
Switching Characteristics (Ta = -40 to 100 °C, unless otherwise specified)
Characteristics Symbol Test
Circuit
Test Condition Min Typ. Max Unit
Propagation delay time
L → H tpLH
7
VCC = 30 V
Rg = 20 Ω
Cg = 10 nF
IF = 0 → 5 mA 50 ― 500
ns
H → L tpHL IF = 5 → 0 mA 50 ― 500
Output rise time (10-90 %) tr IF = 0 → 5 mA ― 50 ―
Output fall time (90-10 %) tf IF = 5 → 0 mA ― 50 ―
Switching time dispersion
between ON and OFF
| tpHL-tpLH |
IF = 0 ↔ 5 mA ― ― 250
Common mode transient immunity
at HIGH level output
CMH
8
VCM =1000 Vp-p
Ta = 25 °C
VCC = 30 V
IF = 5 mA
VO (min) = 26 V
-15 ― ―
kV/μs
Common mode transient immunity
at LOW level output
CML IF = 0 mA
VO (max) = 1 V 15 ― ―
Note: All typical values are at Ta = 25 °C.
Test Circuit 1: I
OPH
Test Circuit 2: I
OPL
Test Circuit 3: V
OH
Test Circuit 4: V
OL
Test Circuit 5: I
CCH
Test Circuit 6: I
CCL
A
IOPL
V5-4
VCC
1
3 4
6
0.1μF
A
IF
1
3 4
6
IOPH
V6-5
VCC
0.1μF
VCC
A
ICCH
IF
1
3 4
6
0.1μF
VCC
A
ICCL
1
3 4
6
0.1μF
VCC1
V
VOH
IF
1
3 4
6
0.1μF
VEE1
RL VF
1
3
VCC1
V
VOL
4
6
0.1μF
VEE1
RL
TLP700
2017-05-24
5
Test Circuit 7: tpLH, tpHL, tr, tf, | tpHL-tpLH |
Test Circuit 8: CMH, CML
Note: CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output
voltage in the LOW (HIGH) state.
90%
1
0
%
1000 V
tf tr
26V
CMH
1V
CML
VCM
VO
•
SW A: IF =
5 mA
•
SW B: IF =
0 mA
CM
L
=
800 V
tr (μs)
CM
H = -
800 V
tf (μs)
VCC
1
3 4
6
0.1 μF
VO
Rg = 20 Ω
Cg = 10nF
IF
tpHL
IF
90%
tf
50%
10%
VO
tpLH
tr VOH
VOL
1 6
IF
3 4
0.1μF
VO
VCC
SW
A
B
+ -
VCM
(f=25kHz, duty=50%, less than tr=tf=5ns)
TLP700
2017-05-24
6
IF － VF ∆VF/∆Ta － IF
VOL － Ta
Forward Voltage VF [V]
Ambient Temperature Ta [ °C]
Forward Current IF [mA] Low Level Output Voltage VOL [V]
Coefficient ∆VF/∆Ta [mV/°C]
VOH － Ta
ICCL － Ta ICCH － Ta
Forward Current IF [mA]
High Level Output Voltage VOH [V]
Ambient Temperature Ta [ °C]
Ambient Temperature Ta [ °C] Ambient Temperature Ta [ °C]
1 1.2 1.4 1.6 1.8 2
0.1
1
10
100
Ta=-40°C
Ta=25°C
Ta=100°C
0.1 1 10
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-40 -20 020 40 60 80 100
-30
-25
-20
-15
-10
-5
0
VF=0.8V, RL=200Ω
VCC1=7.5V, VEE1=-7.5V
VCC1=15V, VEE1=-15V
-40 -20 0 20 40 60 80 100
0
5
10
15
20
25
30
IF=5mA, RL=200Ω
-40 -20 0 20 40 60 80 100
0
1
2
3
4
5
Low level supply current ICCL [mA]
IF=0mA
VCC=30V
-40 -20 0 20 40 60 80 100
0
1
2
3
4
5
High level supply current ICCH [mA]
IF=10mA
VCC=30V
VCC1=7.5V, VEE1=-7.5V
VCC1=15V, VEE1=-15V
TLP700
2017-05-24
7
-40 -20 0 20 40 60 80 100
0
1
2
3
4
5
Propagation delay time tpHL, tpLH [ns]
Propagation delay time tpHL, tpLH [ns]
tpHL, tpLH － Ta tpHL, tpLH － VCC
tpHL, tpLH － IF IFLH － Ta
IOPL－ Ta IOPH－ Ta
Ambient Temperature Ta [ °C] Supply Voltage VCC [V]
Forward current IF [mA] Ambient Temperature Ta [ °C]
Low Level Peak Output Current IOPL [A]
Propagation delay time tpHL, tpLH [ns]
Threshold input current IFLH [mA]
High Level Peak Output Current IOPH [A]
Ambient Temperature Ta [ °C] Ambient Temperature Ta [ °C]
IF=5mA
-40 -20 0 20 40 60 80 100
0
100
200
300
400
500
IF=5mA, VCC=30V
Rg=20Ω, Cg=10nF
tpHL
tpLH
15 20 25 30
0
100
200
300
400
500
tpHL
tpLH
IF=5mA, Rg=20Ω
Cg=10nF
4 6 8 10 12 14 16 18 20
0
100
200
300
400
500
VCC=30V
Rg=20Ω, Cg=10nF
VCC=15V, VO>1V
IO=0mA
-40 -20 0 20 40 60 80 100
0
1
2
3
4
5
IOPL
MAX
IF=0mA, VCC=15V
V5-4=2.5V
V5-4=7.0V
tpLH
tpHL
-40 -20 0 20 40 60 80 100
-5
-4
-3
-2
-1
0
IF=5mA, VCC=15V
V6-5=-7.0V
V6-5=-3.5V
IOPH
MAX
TLP700
2017-05-24
8
V5-4 － IOPL V6-5 － IOPH
VO(VUVLO)** - VCC
Output Voltage V5-4 [V]
Output Voltage V6-5 [V]
Output Voltage VO(VUVLO) [V]
Low Level Output Peak Current IOPL [A] High Level Output Peak Current IOPH [A]
Supply Voltage VCC [V]
0 0.5 1 1.5 2
1
2
3
4
5
6
7
-2-1.5
-1
-0.50
-7
-6
-5
-4
-3
-2
-1
0
IF=0mA, VCC=15V IF=5mA, VCC=15V
Ta=25°C
Ta=100°C
Ta=-40°C
Ta=100°C
Ta=-40°C
Ta=25°C
0 5 10 15 20
2
4
6
8
10
12
14
+VUVLO
-VUVLO
UVLOHYS
IF=5mA
VCC
1
3 4
6
IF VO
**Test Circuit : VO(VUVLO) - VCC
*: The above graphs show typical characteristics.
TLP700
2017-05-24
9
Soldering and Storage
(1) Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of
whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 °C (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 °C or less within 10 seconds is recommended.
Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds
not exceeding 350 °C.
Heating by soldering iron must be only once per 1 lead
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the described
profile.
(°C)
(
°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the described
profile.
TLP700
2017-05-24
10
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 °C to 35 °C,
and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
TLP700
2017-05-24
11
Embossed-Tape Packing (TP) Specifications for SDIP6 Type Photocouplers
1. Applicable Package
Package Name Product Type
SDIP6 Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP700 (TP, F)
[[G]]/RoHS COMPATIBLE (Note 1)
Tape type
Device name
Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
3. Tape Dimensions
3.1 Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2 Tape Packing Quantity: 1500 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0 device Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses 6 devices (max) per reel
Not including leader and trailer
3.4 Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes and
two empty turns only for a cover tape.
Tape feed
TLP700
2017-05-24
12
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 10.4
B 5.1
D 7.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 12.0 Cumulative error per 10 feed holes
G 4.0 Cumulative error per 10 feed holes
K0 4.1 Internal space
+0.1
-0.3
+0.1
-0.3
φ1.6 ± 0.1
2.0 ± 0.1
D
B
E
F G
16.0 ± 0.3
φ1.5
+0.1
-0
0.4 ± 0.05
4.55 ± 0.2
K0 A
TLP700
2017-05-24
13
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the
quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example) TLP700 (TP, F) 1500 pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 1)
Tape type
Device name
Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
記 号 寸 法
A φ380 ± 2
B φ80 ± 1
C φ13 ± 0.5
E 2.0 ± 0.5
U 4.0 ± 0.5
W1 17.5 ± 0.5
W2 21.5 ± 1.0
E
W1
W2
A
B
C
U
Table 3 Reel Dimension
Unit: mm
TLP700
2017-05-24
14
EN60747-5-5 Option (D4) Specification
Types : TLP700
Type designations for “option: (D4)”, which are tested under EN60747 requirements.
Ex.: TLP700 (D4-T P, F ) D4 : EN60747 option
TP : Standard tape & reel type
F : [[G]]/RoHS COMPATIBLE (Note 1)
Note: Use TOSHIBA standard type number for safety standard application.
Ex.: TLP700 (D4-T P, F ) → TLP700
Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
EN60747 Isolation Characteristics
Description Symbol Rating Unit
Application classification
for rated mains voltage ≤ 300Vrms
for rated mains voltage ≤ 600Vrms
I-IV
I-III
—
Climatic classification
40/ 100 / 21 —
Pollution degree 2 —
Maximum operating insulation voltage
TLPxxx type
VIORM
890
Vpk
TLPxxxFtype 1140
Input to output test voltage, method A
Vpr=1.6 × VIORM, type and sample test
tp=10 s, partial discharge<5 pC
TLPxxx type
Vpr
1424
Vpk
TLPxxxFtype 1824
Input to output test voltage, method B
Vpr=1.875 × VIORM, 100 % production test
tp=1 s, partial discharge < 5 pC
TLPxxx type
Vpr
1670
Vpk
TLPxxxFtype 2140
Highest permissible overvoltage
(transient overvoltage, tpr = 60 s)
VTR 8000 Vpk
Safety limiting values (max. permissible ratings in case of
fault, also refer to thermal derating curve)
current (input current IF, Psi = 0)
power (output or total power dissipation)
temperature
Isi
Psi
Ts
300
700
150
mA
mW
°C
Insulation resistance,
Rsi
≥1012
≥1011
≥109
Ω
=500 V, Ta = 25 °C
=500 V, Ta = 100 °C
=500 V, Ta = Ts
V
IO
VIO
VIO
TLP700
2017-05-24
15
Insulation Related Specifications
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
If this is not permissible, the user shall take suitable measures.
2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Marking on product for EN60747 :
Marking Example:
7.62mm pitch
TLPxxx type
10.16mm pitch
TLPxxxF type
Minimum creepage distance Cr 7.0mm 8.0mm
Minimum clearance Cl 7.0mm 8.0mm
Minimum insulation thickness ti 0.4mm
Comperative tracking index
CTI 175
4
Lot.Code
4
Mark for option(D4)
6 4
3
1
1pin indication
Type name without “TL”
P700
TLP700
2017-05-24
16
= 0.1 s
= 1 s
= 1.2 s
Figure 1 Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Method A
(for type and sampling tests,
destructive tests)
t1, t2
t3, t4
tp(Measuring time for
partial discharge)
tb
tini
V
VINITIAL(8kV)
Vpr(1424V for TLPxxx)
(1824V for TLPxxxF)
VIORM(890V for TLPxxx)
(1140V for TLPxxxF)
0
t1
tini
t3
t2
tP
tb
t4
t
= 1 to 10 s
= 1 s
= 10 s
= 12 s
= 60 s
tP
Vpr(1670V for TLPxxx)
(2140V for TLPxxxF)
VIORM(890V for TLPxxx)
(1140V for TLPxxxF)
V
t
t3 t4
tb
Figure 2 Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
(for sample test,non-
destructive test)
t3, t4
tp(Measuring time for
partial discharge)
tb
500
400
300
200
100
0
0 25
50
75
100
125
150
175
1000
800
600
400
200
0
Ta (°C)
← Isi Psi →
Isi
(mA)
Psi
(mW)
Figure 3 Dependency of maximum safety ratings on ambient temperature
TLP700
2017-05-24
17
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.