Features
• Package size: 2.0 x 1.6 mm, t = 0.5 mm Max.
• Frequency range: 16 MHz to 54 MHz
• Frequency tolerance (standard): ±10 x 10-6 / ±30 x 10-6 (@+25 °C)
• Frequency vs. temperature characteristics (standard):
±10 x 10-6 (-20 °C to +75 °C)
• ESR: 200 Ω Max. (16 MHz < f_nom < 18 MHz)
150 Ω Max. (18 MHz < f_nom < 20 MHz)
100 Ω Max. (20 MHz < f_nom < 24 MHz)
80 Ω Max. (24 MHz < f_nom < 26 MHz)
60 Ω Max. (26 MHz < f_nom < 54 MHz)
Applications
• Small communication module for consumer and industrial applications
• Wearable devices
• Clock for MCU
Description
Outline Drawing and Terminal Assignment
Pin Connection
#1 X'tal
#2 GND
#3 X'tal
#4 GND
2.0 x 1.6 mm size MHz range crystal unit: FA-128
±30 x 10-6 (-20 °C to +75 °C)
The FA-128 has been commercialized as a reference clock for communication modules, which
requires high accuracy, and as a clock for wireless communication and microcomputers for applications
that require miniaturization (TWS (True Wireless Stereo), Smart Watch, etc.).
The products created using the element processing technology cultivated over many years contribute
to improving the performance of the customer's system.
FA-128
( 2.0 x 1.6 mm, t = 0.5 mm Max. )
#1
#4
#2
#3
Internal connection
(TOP VIEW)
#2 and #4 are connected to the cover.
(Please connect to ground)
2.0±0.1
1.6±0.1
0.5 Max.
#1
#4
#2
#3
0.45
0.5
0.65
0.6
C 0.2 Min.
2600M
E66RA
#1
#2
#3
#4
Page 1 / 10
文書No FA-128_J_Ver0.1
[ 1 ] Product Number / Product Name
(1-1) Product Number
Q22FA1280xxxx18 (Please contact Epson for details)
(1-2) Product Name (Standard Form)
FA-128 24.000000MHz 12.0 +10.0-10.0
① ② ③ ④
①Model ②Frequency ③Load capacitance (pF) ④Frequency tolerance (x10-6, +25 °C)
In addition to the mentioned above specification items (① to ④),
pleases specify the frequency vs. temperature characteristics.
[ 2 ] Absolute Maximum Ratings
Min. Typ. Max.
Storage temperature range T_stg -40 - +125 °C
Satisfy environmental
characteristics specifications
[ 3 ] Operating Conditions
Min. Typ. Max.
-40 - +85
-40 - +105
Please contact Epson
Level of drive DL 1200 μW
Recommended:
1 μW to 100 μW
[ 4 ] Static Characteristics
Item Symbol Unit Condition / Remarks
Nominal frequency range f_nom MHz
Frequency tolerance
(Standard)
f_tol
x10-6
T_use = +25 °C ± 3 °C
DL = 100 μW
Does not include
frequency aging
Please contact Epson for
requirements not listed in the
specifications
Frequency vs.
temperature characteristics
(Standard)
f_tem
x10-6
Reference at
T_use = +25 °C ± 3 °C
-20 °C to +75 °C
Please contact Epson for
requirements not listed in the
specifications
Load capacitance CL pF Please specify
Motional resistance (ESR) R1 Ω
π circuit IEC 60444-2
T_use = Operating
temperature range
DL = 100 μW
Shunt capacitance C0 pF
Frequency aging f_age
x10-6
T_use = +25 °C ± 3 °C
First year
Table 1. Frequency
16 MHz < f_nom < 18 MHz
18 MHz < f_nom < 20 MHz
20 MHz < f_nom < 26 MHz
24 MHz < f_nom < 26 MHz
26 MHz < f_nom < 54 MHz
Item
Symbol
Rating value
Unit
Note
Specifications
Item
Symbol
Rating value
Unit
Note
Operating temperature range
T_use
°C
16.000 to 54.000
±10
±30
6 to ꝏ
±10
±30
Table 1.
3.0 Max.
±1 Max. (16 MHz < f_nom < 40 MHz)
±2 Max. (40 MHz < f_nom < 54 MHz)
200 Ω Max.
150 Ω Max.
100 Ω Max.
R1
80 Ω Max.
60 Ω Max.
Page 2 / 10
文書No FA-128_J_Ver0.1
[ 5 ] Example of Frequency Temperature Characteristics
16 MHz n = 30 19.2 MHz n = 30
20 MHz n = 30 24 MHz n = 30
24.576 MHz n = 30 25 MHz n = 30
Page 3 / 10
文書No FA-128_J_Ver0.1
26 MHz n = 30 27.12 MHz n = 30
32 MHz n = 30 37.4 MHz n = 30
38.4 MHz n = 30 40 MHz n = 30
Temperature [°C]
Page 4 / 10
文書No FA-128_J_Ver0.1
48 MHz n = 30 52 MHz n = 30
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文書No FA-128_J_Ver0.1
[ 6 ] Marking Description
Table 1. Month of manufacture
Table 2. Date of manufacture
[ 7 ] Outline Drawing and Recommended Footprint
Unit: mm
Pin Connection
#1 X'tal
#2 GND
#3 X'tal
#4 GND
Reference weight Typ.: 7 mg
Terminal coating: Au plating
2400 P
E 0 9 E A
Internal ID
Frequency
Year of manufacture
(Last digit of the year) Month of manufacture
(Table 1.)
Date of manufacture
(Table 2.)
Symbol mark
Month
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 X Y Z
#1
#4
#2
#3
Internal connection
(TOP VIEW)
#2 and #4 are connected to the cover.
(Please connect to ground)
2.0±0.1
1.6±0.1
0.5 Max.
#1
#4
#2
#3
0.45
0.5
0.65
0.6
C 0.2 Min.
2600M
E66RA
#1
#2
#3
#4
1.45
0.95
0.85
1.15
Date 1st 2nd 3rd 4th 5th 6th 7th 8th 9th 10th 11th 12th
Code 1 2 3 4 5 6 7 8 9 A B C
Date 13th 14th 15th 16th 17th 18th 19th 20th 21st 22nd 23rd 24th
Code D E F G H J K L M N O P
Date 25th 26th 27th 28th 29th 30th 31st
Code Q R S T U V W
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文書No FA-128_J_Ver0.1
[ 8 ] Moisture Sensitivity Level
Parameter
MSL
[ 9 ] Reflow Profile (JEDEC J-STD-020D.01)
LEVEL1
JEDEC J-STD-020D.01
Specification
Conditions
Temperature [ C ]
60
300
250
200
150
100
50
0
ts
60 s to 180 s
( +150 C to +200 C )
Avg. Ramp-up
3 C / s Max.
Ramp-down
6 C / s Max.
Time [ s ]
120
180
240
300
360
420
480
540
600
660
720
780
Ts min ; +150 C
Ts max ; +200 C
TL ; +217 C
+255 C
tL
60 s to 150 s
( +217 C over )
tp ; 20 s to 40 s
TP ; +260 C
Time +25 C to Peak
Page 7 / 10
文書No FA-128_J_Ver0.1
[ 10 ] Packing Information
(1) Packing Quantity
The last two digits of the Product Number (Q22FA1280xxxxxx) are a code that defines the packing quantity.
The standard is "18" for a 5 000 pcs / Reel.
(2) Taping Specification
Subject to EAI-481, IEC 60286 and JIS C0806
(2-1) Tape Dimensions
Carrier Tape Material : PS (Polystyrene)
Top Tape Material : PET (Polyethylene Terephthalate) + PE (Polyethylene)
(2-2) Reel Dimensions
Center Material : PS (Polysty rene)
Reel Material : PS (Polystyrene)
Unit : mm
User direction of feed
Epson
2.00
Φ160
Φ76
G
H
Φ3
+0.3
-0
11.4 ± 1
9.00 ± 0.3
Φ60
Φ180.00
+0
-3
Φ21 ± 0.8
Φ13 ± 0.2
10P: 40±0.15
Φ0.5±0.05
4.0±0.1
Φ1.5 -0
+0.1
1.8±0.1
2.0±0.1
4.0±0.1
2.2±0.1
0.7±0.1
8.0±0.2
3.5±0.05
1.75±0.1
0.25±0.05
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文書No FA-128_J_Ver0.1
[ 11 ] Handling Precautions
Prior to using this product, please carefully read the section entitled “Precautions” on our Web site
(https://www5.epsondevice.com/en/information/#precaution) for instructions on how to handle and use
the product properly to ensure optimal performance of the product in your equipment.
Before using the product under any conditions other than those specified therein,
please consult with us to verify and confirm that the performance of the product will not be negatively
affected by use under such conditions.
In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product,
we strongly recommend that you DO NOT use the product under ANY of the following conditions:
1. Max three (3) times re-flow is allowed. Its recommended to manually solder when not enough/no solder
detected. (Using soldering iron at +350 C Max within 5 seconds)
2. Patterning on a board should follow our company recommended pattern.
3. Too much exciting shock or vibration may cause deterioration on damage.
The product may damage depends on the condition such as a shock in assembly machinery.
Please check your process condition in advance to minimize and maintain the shock level.
4. It is recommended to do patterning to the oscillator as short as possible. Abnormal oscillation may
happened if the line is too long.
5. Condensation may occur when products are used/stored under remarkable temperature change.
6. This product may be affected to ultrasonic cleaning. It is depends on the cleaning conditions (Cleaning machine
type/power/time/content/position etc.). The warranty will not cover any damage due to this type of usage.
Check conditions prior to use.
7. When the substrate of oscillation become dewy, the crystal frequency is changed or stopped.
Please use under without the dewfall.
8. Applying excessive excitation Drive Level to the crystal Unit may cause deterioration damage.
9. Few data or readings taken at user side may be different from our company’s data. Confirmation of the
different value is necessary before application.
10. To avoid malfunction, no pattern across or near the crystal is allowed.
11. Start up time of oscillation may be increased or no oscillation may occur unless adequate negative
resistance is allocated in the oscillation circuit In order to avoid this, please provide enough negative
resistance to the circuit design.
How to check the negative resistance.
(1) Connect the resistance (R) to the circuit in series
with the crystal resonator.
(2) Adjust (R) so that oscillation can start (or stop).
(3) Measure (R) when oscillation just start (or stop) in
above (2).
(4) Get the negative resistance
-R = R + R1 alue.
(5) Recommended -R
-R > R1 x 5
12. Please refer to packing specification for the storage method and packing standard.
Rf
Rd
X'tal
R
Cg
Cd
Page 9 / 10
文書No FA-128_J_Ver0.1
PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM
CONFORMING TO INTERNATIONAL STANDARDS
At Seiko Epson, all environmental initiatives operate under the
Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous
improvements. The environmental management system (EMS)
operates under the ISO 14001 environmental management standard.
All of our major manufacturing and non-manufacturing sites, in
Japan and overseas, completed the acquisition of ISO 14001 certification.
WORKING FOR HIGH QUALITY
In order provide high quality and reliable products and services
than meet customer needs, Seiko Epson made early efforts towards
obtaining ISO9000 series certification and has acquired ISO9001 for
all business establishments in Japan and abroad. We have also
acquired IATF 16949 certification that is requested strongly by major
manufacturers as standard.
■ Explanation of marks used in this datasheet
1. The content of this document is subject to change without notice. Before purchasing or using Epson products, please contact with sales
representative of Seiko Epson Corporation (“Epson”) for the latest information and be always sure to check the latest information
published on Epson’s official web sites and resources.
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NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020
●Pb free.
●Complies with EU RoHS directive.
*About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive
(Contains Pb in sealing glass, high melting temperature type solder or other)
ISO 14000 is an international standard for environmental
management that was established by the International Standards
Organization in 1996 against the background of growing concern
regarding global warming, destruction of the ozone layer, and global
deforestation.
IATF 16949 is the international standard that added the sector-
specific supplemental requirements for automotive industry based on
ISO9001.
Page 10 / 10
文書No FA-128_J_Ver0.1
