Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of su bstitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regar ding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corpo r ation assumes no resp on sibility for any dam age, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
2SB1409(L)/(S)
Silicon PNP Epitaxial
ADE-208-877 (Z)
1st. Edition
September 2000
Application
Low frequency power amplifier complementary Pair with 2SD2123(L)/(S)
Outline
4
123
4
3
2
11. Base
2. Collector
3. Emitter
4. Collector
DPAK
S Type
L Type
2SB1409(L)/(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage VCBO –180 V
Collector to emitter voltage VCEO –160 V
Emitter to base voltage VEBO –5 V
Collector current IC–1.5 A
Collector peak current IC(peak) –3 A
Collector power dissipation PC*118 W
Junction temperature Tj 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. Value at TC = 25°C.
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown
voltage V(BR)CBO –180 V IC = –1 mA, IE = 0
Collector to emitter breakdown
voltage V(BR)CEO –160 V IC = –10 mA, RBE =
Emitter to base breakdown
voltage V(BR)EBO –5 V IE = –1 mA, IC = 0
Collector cutoff current ICBO –10 µAV
CB = –160 V, IE = 0
DC current transfer ratio hFE1*160 200 VCE = –5 V, IC = –150 mA*2
hFE2 30 VCE = –5 V, IC = –500 mA*2
Collector to emitter saturation
voltage VCE(sat) ——1V I
C = –500 mA, IB = –50 mA
Base to emitter voltage VBE –1.5 V VCE = –5 V, IC = –150 mA
Gain bandwidth product fT 240 MHz VCE = –5 V, IC = –150 mA
Collector output capacitance Cob 25 pF VCB = –10 A, IE = 0, f = 1 MHz
Notes: 1. The 2SB1409(L)/(S) is grouped by hFE1 as follows.
BC
60 to 120 100 to 200
2. Pulse test.
2SB1409(L)/(S)
3
0Case Temperature TC (°C)
Collector power dissipation Pc (W)
Maximum Collector Dissipation Curve
50 100 150
10
30
20
–0.01
–0.03
–0.1
–0.3
–1.0
–10
–3
Collector to emitter Voltage VCE (V)
Collector Current IC (A)
–3 –10 –30 –100 –300
Area of Safe Operation
IC (max)
iC (peak)
PW = 10 ms
1 ms
DC Operation (T
C
= 25°C)
Ta = 25°C
1 Shot Pulse
Collector to emitter Voltage VCE (V)
Collector Current IC (A)
0
Typical Output Characteristics
–10 –20 –30 –40 –50
–0.2
–0.4
–0.6
–0.8
–1.0
IB = 0 TC = 25°C
PC = 18 W
–1 mA
–1.5
–2.5
–3.5
–4.5
–2
–3
–4
–5
10
30
100
300
1,000
Collector current IC (A)
DC current transfer ratio hFE
–0.01 –0.03 –0.1 –0.3 –1.0
DC Current Transfer Ratio vs.
Collector Current
VCE = –5 V
Ta = 25°C
2SB1409(L)/(S)
4
–0.01
–0.1
–1.0
–10
Collector current IC (A)
–0.001 –0.01 –0.1 –1.0
Collector to emitter saturation voltage
VCE (sat) (V)
Saturation Voltage vs. Collector Current
lC = 10 lB
Ta = 25°C–0.1
–0.3
–1.0
–3
–10
Collector current IC (A)
–0.03 –0.1 –0.3 –1.0 –3.0
Base to emitter saturation voltage
VBE (sat) (V)
Saturation Voltage vs. Collector Current
lC = 10 lB
Ta = 25°C
0
–0.4
–0.8
–1.2
–1.6
–2.0
Base to emitter voltage VBE (V)
Collector current IC (A)
0 –0.4 –0.8 –1.2 –1.6 –2.0
Typical Transfer Characteristics
VCE = –5 V
Ta = 25°C10
30
100
300
1,000
Collector current IC (A)
Gain bandwidth product fT (MHz)
–0.01 –0.03 –0.1 –0.3 –1.0
Gain Bandwidth Product vs.
Collector Current
VCE = –5 V
Ta = 25°C
2SB1409(L)/(S)
5
3
10
30
100
300
Collector to base voltage VCB (V)
Collector output capacitance Cob (pF)
–1 –3 –10 –30 –100
Collector Output Capacitance vs.
Collector to Base Voltage
f = 1 MHz
IE = 0
Ta = 25°C
2SB1409(L)/(S)
6
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
U S A
Tel: 415-589-8300
Fax: 415-583-4207
Hitachi Europe GmbH
Electronic Components Group
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30 00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 0628-585000
Fax: 0628-778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 0104
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071