INTEGRATED CIRCUITS DIVISION
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DS-CPC1330-R06 1
CPC1330
Single-Pole, Normally Open
4-Pin OptoMOS® Relay
Part Number Description
CPC1330G 4-Pin DIP (100/Tube)
CPC1330GR 4-Pin Surface Mount (100/Tube)
CPC1330GRTR 4-Pin Surface Mount (1000/Reel)
Parameters Ratings Units
Peak Blocking Voltage 350 VP
Load Current 120 mArms / mADC
On-Resistance (max) 30
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
The CPC1330G is a single-pole normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient infrared LED, controls the optically
coupled output.
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
• 5000Vrms Input/Output Isolation
• 350VP Blocking Voltage
• 100% Solid State
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin Package
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
23
4
+ Control
– Control
Load
Load
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CPC1330
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Ratings Units
Peak Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1100 mW
Total Package Dissipation 2550 mW
Isolation Voltage, Input to Output 5000 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33mW / ºC
2 Derate linearly 3mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous - IL- - 120 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance IL=120mA RON -2530
Off-State Leakage Current VL=350VPILEAK -- 1 A
Switching Speeds
Turn-On IF=5mA, VL=10V
(See Timing Diagram)
ton -- 2 ms
Turn-Off toff -- 1
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=120mA IF- 0.33 2 mA
Input Control Current to Deactivate - IF0.2 0.3 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -3 - pF
Timing Diagram
10%
90%
toff
ton
0 mA
IL
IF
0 mA
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PERFORMANCE DATA (@25ºC Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
01.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.85 1.00 1.15 1.250.90 1.10 1.20
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA)
0.21 0.23 0.25 0.270.260.240.22
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA)
0.30 0.32 0.340.29 0.31 0.33 0.35
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=120mA)
25
20
15
10
5
0
0.28 0.30 0.320.27 0.29 0.31 0.33
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=120mA)
35
30
25
20
15
10
5
0
23.5 24.5 25.5 26.524 25 26
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=120mA)
On-Resistance (:)
35
30
25
20
15
10
5
0
370 380 390 400375 385 395
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mA)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
= 50mA
I
F
= 30mA
I
F
= 20mA
I
F
= 10mA
I
F
= 5mA
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=120mA)
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CPC1330
PERFORMANCE DATA (@25ºC Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
LED Current (mA)
-40
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
Temperature (ºC)
LED Current (mA)
-40
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
Typical IF for Switch Dropout
vs. Temperature
(IL=80mA)
Temperature (ºC) Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150 -3 -2 -1 0 1 2 3
Typical Load Current
vs. Load Voltage
(IF=5mA)
IF = 5mA
IF
= 10mA
Turn-On Time (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-On Time
vs. Temperature
(IL=80mA)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
IF
= 5mA
IF = 10mA
Typical Turn-Off Time
vs. Temperature
(IL=80mA)
Temperature (ºC)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=80mA)
On-Resistance (:)
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
I
F
= 2mA
I
F
= 10mA
Maximum Load Current
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
400
395
390
385
380
375
370
365
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
Temperature (ºC)
Time
Load Current (A)
10μs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100μs 100ms 1s
10ms 10s 100s
Energy Rating Curve
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1330G MSL 1
CPC1330GR MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1330GR, the solder
reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.
For the through-hole device, CPC1330G, and any other processes, the guidelines of J-STD-020 must be observed.
Device Maximum Body Temperature (Tc) Time
CPC1330GR 250ºC 15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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CPC1330
MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1330G
CPC1330GR
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1330-R06
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/7/2016
For additional information please visit our website at: www.ixysic.com
CPC1330
7
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1330GRTR Tape & Reel
Mouser Electronics
Authorized Distributor
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