Rev 0.5 / Jun. 2006 1
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Document Title
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash Memory
Revision History
Revision
No. History Draft Date Remark
0.0 Initial Draft. Apr. 04. 2005 Preliminary
0.1
1) Change AC Parameter
2) Change 256Mb Package Type.
- WSOP package is changed to USOP package.
- Figure & dimension are changed.
Jul. 07. 2005 Preliminary
0.2
1) Correct the test Conditions (DC Characteristics table)
2) Change AC Conditions table
3) Add tWW parameter ( tWW = 100ns, min)
- Texts & Figures are added.
- tWW is added in AC timing characteristics table.
4) Edit Copy Back Program operation step
5) Edit System Interface Using CE don’t care Figures.
6) Correct Address Cycle Map.
7) Change NOP (table 11)
Aug. 08. 2005 Preliminary
tCRY(1.8V)
Before 50+tr(R/B#)
After 60+tr(R/B#)
Test Co nditions (ICC1) Test Con ditions (ILI, ILO)
Before tRC=50ns,
CE#=VIL,
IOUT=0mA VIN=VOUT=0 to 3.6V
After
tRC(1.8V=60ns,
3.3V=50ns)
CE#=VIL,
IOUT=0mA
VIN=VOUT=0 to Vcc (max)
Main Array Spare Array
Before 1 2
After 2 3
Rev 0.5 / Jun. 2006 2
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Revision History
- Continued -
Revision
No. History Draft Date Remark
0.2
8) Correct PKG dimension (TSOP, USOP PKG)
9) Change VIL parameter (max.)
10) Change AC Parameter Aug. 08. 2005 Preliminary
0.3 1) Correct USOP figure. Nov. 07. 2005 Preliminary
0.4 1) Correct Figure 32. Feb. 06. 2006 Preliminary
0.5
1) Add ECC algorithm. (1bit/512bytes)
2) Delet Preliminary.
3) Change AC Parameter
4) Correct Read ID naming
Jun. 20. 2006
CP
Before 0.050
After 0.100
1.8V 3.3V
Before 0.2xVcc 0.2xVcc
After 0.4 0.8
tOH tRP tREA
Before 15 30 35
After 10 25 30
tR (1.8V) tCRY (1.8V) tCRY (3.3V)
Before 12 50+tr(R/B#)(4) 50+tr(R/B#)(4)
After 15 80+tr(R/B#)(4) 60+tr(R/B#)(4)
tWHR
Before 60 ns
After 50 ns
Rev 0.5 / Jun. 2006 3
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
FEATURES SUMMARY
HIGH DENSITY NAND FLASH MEMORIES
- Cost effective solutions for mass storage applications
NAND INTERFACE
- x8 or x16 bus width.
- Multiplexed Address/ Data
- Pinout compatibility for all densities
SUPPLY VOLTAGE
- 3.3V device: VCC = 2.7 to 3.6V : HY27USXX561A
- 1.8V device: VCC = 1.7 to 1.95V : HY27SSXX561A
Memory Cell Array
= (512+16) Bytes x 32 Pages x 2,048 Blocks
= (256+8) Words x 32 pages x 2,048 Blocks
PAGE SIZE
- x8 device : (512 + 16 spare) Bytes
: HY27(U/S)S08561A
- x16 device: (256 + 8 spare) Words
: HY27(U/S)S16561A
BLOCK SIZE
- x8 device: (16K + 512 spare) Bytes
- x16 device: (8K + 256 spare) Words
PAGE READ / PROGRAM
- Random access: 3.3V: 12us (max.)
1.8V: 15us (max.)
- Sequential access: 3.3V: 50ns (min.)
1.8V: 60ns (min.)
- Page program time: 200us (typ.)
COPY BACK PROGRAM MODE
- Fast page copy without external buffering
FAST BLOCK ERASE
- Block erase time: 2ms (Typ.)
STATUS REGISTER
ELECTRONIC SIGNATURE
- 1st cycle : Manufacturer Code
- 2nd cycle: Device Code
CHIP ENABLE DON'T CARE
- Simple interface with microcontroller
AUTOMATIC PAGE 0 READ AT POWER-UP OPTION
- Boot from NAND support
- Automatic Memory Download
SERIAL NUMBER OPTION
HARDWARE DATA PROTECTION
- Program/Erase locked during Power transitions
DATA INTEGRITY
- 100,000 Program/Erase cycles
(with 1bit/512byte ECC)
- 10 years Data Retention
PACKAGE
- HY27(U/S)S(08/16)561A-T(P)
: 48-Pin TSOP1 (12 x 20 x 1.2 mm)
- HY27(U/S)S(08/16)561A-T (Lead)
- HY27(U/S)S(08/16)561A-TP (Lead Free)
- HY27(U/S)S(08/16)561A-S(P)
: 48-Pin USOP1 (12 x 17 x 0.65 mm)
- HY27(U/S)S(08/16)561A-S (Lead)
- HY27(U/S)S(08/16)561A-SP (Lead Free)
- HY27(U/S)S(08/16)561A-F(P)
: 63-Ball FBGA (9 x 11 x 1.0 mm)
- HY27(U/S)S(08/16)561A-F (Lead)
- HY27(U/S)S(08/16)561A-FP (Lead Free)
Rev 0.5 / Jun. 2006 4
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
1. SUMMARY DESCRIPTION
The HYNIX HY27(U/S)S(08/16)561A series is a 32Mx8bit with spare 8Mx16 bit capacity. The device is offered in 1.8V
Vcc Power Supply and in 3.3V Vcc Power Supply.
Its NAND cell provides the most cost-effective solution for the solid state mass storage market.
The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old
data is erased.
The device contains 2048 blocks, composed by 32 pages consisting in two NAND structures of 16 series connected
Flash cells.
A program operation allows to write the 512-byte page in typical 200us and an erase operation can be performed in
typical 2ms on a 16K-byte(X8 device) block.
Data in the page mode can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and
data input/output as well as command input. This interf ace allows a reduced pin count an d easy migr ation towards dif-
ferent densities, without any rearrangement of footprint.
Commands, Data and Addresses are synchronously introduced using CE, WE, ALE and CLE input pin.
The on-chip Program/Erase Controller automates all program and erase functions including pulse repetition, where
required, and internal verification and margining of data.
The modifying can be locked using the WP input pin.
The output pin R/B (open drain buffer) signa ls the status of the d evice d uring each operation. In a system with multi-
ple memories the R/B pins can be connected all together to provide a global status signal.
Even the write-intensive systems can take advantage of the HY27(U/S)S(08/16)561A extended reliability of 100K pro-
gram/erase cycles by providing ECC (Error Correcting Code) with real time mapping-out algorithm.
The chip could be offered with the CE don’t care function. This function allows the direct download of the code from
the NAND Flash memory device by a microcontroller, since the CE transitions do not stop the read operation.
The copy back function allows the optimization of defective blocks management: whe n a page progr am operat ion fails
the data can be directly programmed in another page inside the same arra y section without the time consuming serial
data insertion phase.
This device includes also extra f eatures like O TP/Unique ID area, Block Lock mechanism, Automatic Read at P ower Up,
Read ID2 extension.
The Hynix HY27(U/S)S(08/16)561A series is available in 48 - TSOP1 12 x 20 mm , 48 - USOP1 12 x 17 mm,
FBGA 9 x 11 mm.
1.1 Product List
PART NUMBER ORIZATION VCC RANGE PACKAGE
HY27SS08561A x8 1.70 - 1.95 Volt
63FBGA / 48TSOP1 / 48USOP1
HY27SS16561A x16
HY27US08561A x8 2.7V - 3.6 Volt
HY27US16561A x16
Rev 0.5 / Jun. 2006 5
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
9&&
966
35(
:3
&/(
$/(
5(
:(
&( ,2a,2
,2a,2[2QO\
5%
Figure1: Logic Diagram
IO15 - IO8 Data Input / Outputs (x16 Only)
IO7 - IO0 Data Input / Outputs
CLE Command latch enable
ALE Address latch enable
CE Chip Enable
RE Read Enable
WE Write Enable
WP Write Protect
R/B Ready / Busy
Vcc Power Supply
Vss Ground
NC No Connection
PRE Power-On Read Enable, Lock Unlock
Table 1: Signal Names
Rev 0.5 / Jun. 2006 6
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
9VV
,2
,2
,2
,2
,2
,2
,2
,2
1&
35(
9FF
1&
1&
1&
,2
,2
,2
,2
,2
,2
,2
,2
9VV
1$1')ODVK
7623
[
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
1&
1&
1&
1&
,2
,2
,2
,2
1&
1&
35(
9FF
9VV
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
1&
1$1')ODVK
7623
[
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
1&
1&
1&
1&
,2
,2
,2
,2
1&
1&
35(
9FF
9VV
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
1&
1$1')ODVK
8623
[
Figure 2. 48TSOP1 Contactions, x8 and x16 Device
Figure 3. 48USOP1 Contactions, x8 and x16 Device
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
9VV
,2
,2
,2
,2
,2
,2
,2
,2
1&
35(
9FF
1&
1&
1&
,2
,2
,2
,2
,2
,2
,2
,2
9VV
1$1')ODVK
8623
[
Rev 0.5 / Jun. 2006 7
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
1&
1&
1& 1&1&
1& 1&
1&
&/(
$/( 9VV
9VV
9VV
9FF
9FF
1&
1&
1&
:3
5(
&( :( 5%
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1& 35(
1&
1&
,2
,2
,2 ,2 ,2
,2
,2
,2
1& 1&
1&
1& 1& 1&
1&
1&
1&
1&
1&1&
1& 1&
$
%
&
'
(
)
*
+
-
.
/
0
1&
1&
1& 1&1&
1& 1&
1&
&/(
$/( 9VV
9VV
9VV
9FF
9FF
1&
1&
1&
:3
5(
&( :( 5%
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
,2
,2
,2
,2
,2
,2
,2
,2
,2
,2 ,2
,2
,2
,2 35(,2
1&
1& 1& 1&
1&
,2
1&
1&1&
1& 1&
$
%
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'
(
)
*
+
-
.
/
0
Figure 4. 63FBGA Contactions, x 8 Device (Top view through package)
Figure 5. 63FBGA Contactions, x16 Device (Top view through package)
Rev 0.5 / Jun. 2006 8
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
1.2 PIN DESCRIPTION
Pin Name Description
IO0-IO7
IO8-IO15(1)
DATA INPUTS/OUTPUTS
The IO pins allow to input command, address and data and to output data during read / program
operations. The inputs are latched on the rising edge of Write Enable (WE). The I/O buffer float to
High-Z when the device is deselected or the outputs are disabled.
CLE COMMAND LATCH ENABLE
This input activates the latching of the IO inputs inside the Command Register on the Rising edge of
Wri te Enable (WE).
ALE ADDRESS LATCH ENABLE
This input activates the latching of the IO inputs inside the Address Register on the Rising edge of
Wri te Enable (WE).
CE CHIP ENABLE
This input cont r ols the sele c tion of the device. When the d evice is busy CE low does not deselect the
memory.
WE WRITE ENABLE
This input acts as clock to latch Command, Address and Data. The IO inputs are latched on the rise
edge of WE.
RE
READ ENABLE
The RE input is the serial data-out control, and when activ e drives the data onto the I/O bus. Data is
valid tREA after the falling edge of RE which also increments the internal column address counter by
one.
WP WRITE PROTECT
The WP pin, when Low, provides an Hardw are pr otection against undesir ed modify (pr ogram / er ase )
operations.
R/B READY BUSY
The Ready/Busy output is an Open Drain pin that signals the state of the memory.
VCC SUPPLY VOLTAGE
The VCC supplies the power for all the operations (Read, Write, Erase).
VSS GROUND
NC NO CONNECTION
PRE
To Enable and disable the Lock mechanism and Power On Auto Read. When PRE is a logic high,
Block Lock mode and Power-On Auto-Read mode are enabled, and when PRE is a logic low, Block
Lock mode and Power -On Auto-R ead mode are disa bled. P o wer-On Auto-R ead mode is a v ailable only
on 3.3V device.
Not using LOCK MECHANISM & POWER-ON AUTO-READ, connect it Vss or leave it NC.
Table 2: Pin Description
NOTE:
1. For x16 version only
2. A 0.1uF capacitor should be connected between the Vcc Supply Voltage pin and the Vss Ground pin to decouple
the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required
during program and erase operations.
Rev 0.5 / Jun. 2006 9
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7
1st Cycle A0 A1 A2 A3 A4 A5 A6 A7
2nd Cycle A9 A10 A11 A12 A13 A14 A15 A16
3rd Cycle A17 A18 A19 A20 A21 A22 A23 A24
Table 3: Address Cycle Map(x8)
NOTE:
1. A8 is set to LOW or High by the 00h or 01h Command.
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8-IO15
1st Cycle A0 A1 A2 A3 A4 A5 A6 A7 L(1)
2nd Cycle A9 A10 A11 A12 A13 A14 A15 A16 L(1)
3rd Cycle A17 A18 A19 A20 A21 A22 A23 A24 L(1)
Table 4: Address Cycle Map(x16)
NOTE:
1. L must be set to Low.
FUNCTION 1st CYCLE 2nd CYCLE 3rd CYCLE 4th CYCLE Acceptable command
during busy
READ 100h/01h--
READ 2 50h - -
READ ID 90h - -
RESET FFh - - Yes
PAGE PROGRAM 80h 10h -
COPY BACK PGM 00h 8Ah (10h)
BLOCK ERASE 60h D0h -
READ STATUS REGISTER 70h - - Yes
LOCK BLOCK 2Ah
LOCK TIGHT 2Ch
UNLOCK (start area) 23h
UNLOCK (end area) 24h
READ LOCK STATUS 7Ah
Table 5: Command Set
Rev 0.5 / Jun. 2006 10
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
CLE ALE CE WE RE WP MODE
H L L Rising H X Read Mode Command Input
L H L Rising H X Address Input(3 cycles)
H L L Rising H H Wri te Mode Command Input
L H L Rising H H Address Input(3 cycles)
LLLRisingHHData Input
LL
L(1) H Falling X Sequential Read and Data Output
L L L H H X During Read (Busy)
XXXXXHDuring Program (Busy)
XXXXXHDuring Erase (Busy)
XXXXXLWrite Protect
XXHXX0V/VccStand By
Table 6: Mode Selection
NOTE:
1. With the CE high during latency time does not stop the read operation
Rev 0.5 / Jun. 2006 11
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
2. BUS OPERATION
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
Typically glitches le ss than 5 ns on Chi p Enable, W ri te Enable and R ead Enabl e are ig nored by the memory an d do not
affect bus operations.
2.1 Command Input.
Command Input bus operation is used to give a command to the memory device. Command are accepted with Chip
Enable low, Command Latch Enable High, Address Latch Enable low and Read Enable High and latched on the rising
edge of Write Enable. Moreover for commands that starts a modifying operation (write/erase) the Write Protect pin
must be high. See figure 7 and table 12 for details of the timings requirements. Command codes ar e always applied on
IO7:0, disregarding the bus configuration (X8/X16).
2.2 Address Input.
Address Input bus operation allows the insertion of the memory address. Three bus cycles are required to input the
addresses for the 256Mbit devices. Addresses are accepted with Chip Enable low, Address Latch Enable High, Com-
mand Latch Enable low and R ead Enable high and latche d on the rising edge of Write Enable. More over f or commands
that starts a modify operation (write/er ase) the W rite Protect pin must be high. See figure 8 and table 12 f or details of
the timings requirements. Addresses are always applied on IO7:0, disregarding the bus configuration (X8/X16).
2.3 Data Input.
Data Input bus operation allows to feed to the device the data to be programmed. The data insertion is serially and
timed by the Write Enable cycles. Data are accepted only with Chip Enable low, Address Latch Enable low, Command
Latch Enable low, Read Enable High, and Write Protect High and latched on the rising edge of Write Enable. See figur e
9 and table 12 for details of the timings requirements.
2.4 Data Output.
Data Output bus operation allows to read data from the memory array and to check the status register content, the
lock status and the ID data. Data can be serially shifted out toggling the Read Enable pin with Chip Enable low, Write
Enable High, Address Latch Ena ble low, and Command Latch Enable low. See figures 10 to 14 and table 12 for details
of the timings requirements.
2.5 Write Protect.
Hardware Write Protection is activated when the Write Protect pin is low. In this condition modify operation do not
start and the content of the memory is not altered. Write Protect pin is not latched by Write Enable to ensure the pro-
tection even during the power up.
2.6 Standby.
In Standby mode the device is deselected, outputs are disabled and Power Consumption is reduced.
Rev 0.5 / Jun. 2006 12
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
3. DEVICE OPERATION
3.1 Page Read.
Upon initial device power up, the device def aults to Read1 mode. This operation is also initiated by writing 00h to the
command register along with followed by the three address input cycles. Once the command is latched, it does not
need to be written for the following page read operation.
Three types of operations are available: random read, serial page read and sequential row read.
The random read mode is enabled when the page address is changed. The 528 bytes (x8 device) or 264 word (x16
device) of data within the selected page are transferred to the data registers in less than access random read time tR
(12us). The system controller can detect the completion of th is data tr ansf er tR (12us) by analyzing the output of R/B
pin. Once the data in a page is loaded into the registers, they may be r ead out in 50ns cycle time by sequentially puls-
ing RE. High to low transitions of the RE clock output the data stating from the selected column address up to the last
column address.
After the data of last column address is clocked out, the next page is automatically selected for sequential row read.
Waiting tR again allows reading the selected page. The sequential row read operation is terminated by bringing CE
high.
The way the Read1 and Re ad2 comma nds work is like a pointer set to either the main area or the spare area. Writing
the R ead2 comm and use r may selectively access the spare area of bytes 512 to 527. Addresses A0 to A3 set the start-
ing address of the spar e area while addr esses A4 to A7 are ignore d. Unless the oper ation is aborted, the p age addr ess
is automatically incremented for sequential row
Read as in Read1 operation and spare sixteen bytes of each page may be sequentially read. The Read1 command
(00h/01h) is needed to move the pointer back to the main area. Figure_12 to 15 show typical sequence and timings
for each re ad operati on.
Devices with automatic read of page0 at power up can be provided on request.
3.2 Page Program.
The device is progr am med basically on a page ba sis, but it does allow multiple partial page progr amming of a b yte or
consecutive bytes up to 528 (x8 device), in a single page program cycle. The number of consecutive partial page pro-
gramming operations within the same page without an intervening erase operation must not exceed 2 for main array
and 3 for spar e arr ay. The addressing may be done in any r andom order in a block. A pa ge progr am cycle consists of a
serial data loading period in which up to 528 bytes (x8 device) or 264 word (x16 device) of data may be loaded into
the page register, followed by a non-volatile programming period where the loaded data is programmed into the
appropriate cell. Serial data loading can be started from 2nd half arr ay by mo ving pointer. About the pointer operation,
please refer to Figure_29, 30.
The data-loading sequence begins by inputting the Serial Data Input command (80h), followed by the three address
input cycles and then serial data loading. The P age Prog r am confirm command (10h) starts the progr amming process.
Writing 10h alone without previously entering the serial data will not initiate the programming process. The internal
Program Er ase Controller automatically execute s the algorithms and timings necessary f or program and verif y, thereby
freeing the system controller for other tasks. Once the program process starts, the Read Status Register command
may be entered, with RE and CE low, to read the status register. The system controller can detect the completion of a
program cycle by monitoring the R/B output, or the Status bit (I/O 6) of the Status Register. Only the Read Status
command and Reset command are valid while programming is in progress. When the Page Program is complete, the
Write Status Bit (I/O 0) may be checked Figure_16.
The internal write verify detects only errors for "1"s that are not successfully programmed to "0"s. The command reg-
ister remains in Read Status command mode until another valid command is written to the command register.
Rev 0.5 / Jun. 2006 13
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
3.3 Block Erase.
The Erase operation is done on a block (16K Byte) basis. It consists of an Erase Setup command (60h), a Block
address loading and an Erase Confirm Command (D0h). The Erase Confirm command (D0h) following the block
address loading initiates the internal erasing process. This two-step sequence of setup followed by execution com-
mand ens ures that memory contents are not accidental ly erased due to external noise conditions.
The block address loading is accomplished in two to three cycles depending on the device density. Only block
addresses (A14 to A24) are needed while A9 to A13 is ignored.
At the rising edge of WE after the erase confirm command input, the internal Program Erase Controller handles erase
and erase-verify. When the erase operation is completed, the Write Status Bit (I/O 0) may be checked. Figure_18
details the sequence.
3.4 Copy-Back Program.
The copy-back program is provided to quickly and efficiently rewrite data stored in one page within the plane to
another page within the same plane without using an external memory. Since the time-consuming sequential-reading
and its reloading cycles are removed, the system performance is improved. The benefit is especially obvious when a
portion of a block is updated and the rest of the block also need to be copied to the newly assigned free block. The
operation for performing a copy-back program is a sequential execution of page-read without burst-reading cycle and
copying-progr am with the address of destination page. A normal r ead operation with "00h" comman d and the address
of the source page moves the whole 528byte data into the internal buffer. As soon as the device returns to Ready
state, P age-Copy Data-input command (8Ah) with the address cy cles of destination page followed may be written. The
Program Confirm command (10h) is not needed to actually begin the programming operation. For backward-compati-
bility, issuing Program Confirm command during copy-back does not affect correct device operation.
Copy-Back Pr ogram oper ation is allowed only within the same memory plane. Once the Copy -Back Program is finished,
any additional partial page programming into the copied pages is prohibited before erase. Plane address must be the
same between source and target page
"When there is a program-failure at Copy-Back operation, error is reported by pass/fail status. But, if
Copy-Back operations are accumu lated over time, bit e rror due to charge loss is not checked by external
error detection/correction scheme. For this reason, two bit error correction is recommended for the u se
of Copy-Back operation."
Figure 17 shows the command sequence for the copy-back operation
.The Copy Back Program operation requires three steps:
- 1. The source page must be read using the Read A command (one bus write cycle to setup the command and then 3
bus cycles to input the source page address.) This operation copies all 264 Words/ 528 Bytes from the page into
the page Buffer.
- 2. When the device returns to the ready state (Ready/Busy High), the second bus write cycle of the command is
given with the 3cycles to input the target page address. A24 must be the same for the Source and Target Pages.
- 3. Then the confirm command is issued to start the P/E/R Controller.
Rev 0.5 / Jun. 2006 14
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
3.5 Read Status Register.
The device contains a Status Register which ma y be read to find out whether rea d, progra m or erase oper ation is com-
pleted, and whether the progr am or er as e oper a tion is c omplet ed successf u lly. After writi ng 70h co mmand to the com-
mand register, a read cycl e outputs the content of the Status Register to the I/O pins on the falling edge of CE or RE,
whichever occurs last. This two line control allows the system to poll the progress of each device in multiple memory
connections even when R/B pins are common-wired. RE or CE does not need to be toggled for updated status. Refer
to table 13 for specific Status Register definitions. The command register remains in Status Read mode until further
commands are issued to it. Theref ore, if the status r egister is re ad during a random read cy cle, a r ead command (00h
or 50h) should be given before sequential page read cycle.
3.6 Read ID.
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an
address input of 00h. Two read cycles sequentially output the manufacturer code (ADh), the device code. The com-
mand register remains in Read ID mode until further commands are issued to it. Figure 19 shows the operation
sequence, while tables 13, 14 explain the byte meaning.
3.7 Reset.
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state
during random read, pr ogr am or er ase mode, the res et operation will abort these operations. The contents of memory
cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is
cleared to wait for the next comm and, and the Status R egister is clear ed to value E0h when WP is high. Refer to table
12 for device status after reset operation. If the device is already in reset state a new reset command will not be
accepted by the command register. The R/B pin transitions to low for tRST after the Reset command is written. Refer
to figure 25.
Rev 0.5 / Jun. 2006 15
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
4. OTHER FEATURES
4.1 Data Protection & Power On/Off Sequence
The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal
voltage detector disables all functions whenever Vcc is below about 1.1V(1.8V device), 2V(3.3V device). WP pin pro-
vides hardware protection and is recommended to be kept at VIL during power-up and power-down. A recovery time
of minimum 10us is required before internal circuit gets ready for any command sequences as shown in Figure 26. The
two-step command sequence for program/erase provides additional software protection.
If the power is dropped during the ready read/write/erase operation, Power protection function may not guaranteed
the data. Power protection function is only available during the power on/off sequence.
4.2 Ready/Busy.
The device has a Ready/Busy output that provides method of indicating the completion of a page program, erase,
copy-back, cache progr am and random read completion. The R/B pin is normally high and goes to low when the device
is busy (after a reset, read, pr og ram, er as e op eration). It returns to high when the internal controller has finished the
operation. The pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up
resistor value is related to tr(R/B) and current drain during busy (Ibusy), an appropriate value can be obtained with
the following reference chart (F ig 27). Its value can be determined by the following guidance.
4.3 Lock Block Feature
In high state of PRE pin, Block lock mode and Power on Auto read are enabled, otherwise it is regarded
as NAND Flash without PRE pin.
Block Lock mode is enabled while PRE pin state is high, which is to offer protection features for NAND Flash data. The
Block Lock mode is divided into Unlock, Lock, Lock-tight operation. Consecutive blocks protects data allows those
blocks to be locked or lock-tighten with no latency. This block lock scheme offers two levels of protection. The first
allows so ftware control (command input method) of block locking that is useful for frequently changed data blocks,
while the second requires hardware control (WP low pulse input method) bef or e locking ca n be chang ed that is usef ul
for protecting infrequently changed code blocks. The followings summarized the locking functionality.
- All blocks are in a locked state on power-up. Unlock sequence can unlock the locked blocks.
- The Lock-tight command locks blocks and prevents from being unlocked. Lock-tight state can be returned to lock
state only by Hardware control(WP low pulse input).
1. Block lock operation
1) Lock
- Command Sequence: Lock block Command (2Ah). See Fig. 20.
- All blocks default to locked by power-up and Hardware control (WP low pulse input)
- Partial block lock is not available; Lock block operation is based on all block unit
- Unlocked blocks can be locked by using the Lock block command, and a lock block’s status can be changed to
unlock or lock-tight using the appropriate commands
- On the program or erase operation in Locked or Lock-tighten block, Busy state holds 1~10us(tLBSY)
Rev 0.5 / Jun. 2006 16
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
2) Unlock
- Command Sequence: Unlock block Command (23h) + Start block address + Command (24h) + End block address.
See Fig. 21.
- Unlocked blocks can be programmed or erased.
- An unlocked block’s status can be changed to the locked or lock-tighten state using the appropriate sequence of
commands.
- Only one consecutive area can be released to unlock state from lock state; Unlocking multi area is not available.
- Start block address must be nearer to the logical LSB (Least Significant Bit) than End block address.
- One block is selected for unlocking block when Start block address is same as End block address.
3) Lock-tight
- Command Sequence: Lock-tight block Command (2Ch). See Fig. 22.
- Lock -tighten blocks offer the user an additional level of write protection beyond that of a regular lock block. A block
that is lock-tighten can’t have its state changed by softwa re control, only by hardware control (WP low pulse
input); Unlocking multi area is not available
- Only locked blocks can be lock-tighten by lock-tight command.
- On the program or erase operation in Locked or Lock-tighten block, Busy state holds 1~10us(tLBSY)
4) Lock Block Boundaries after Unlock Command issuing
- If Start Block address = 0000h and End Block Address = FFFFh , the device is all unlocked
- If Start Block address = End Block Address = FFFFh , the device is all locked except for the last Block
- If Start Block address = End Block Address = 0000h , the device is all locked except for the first Block
2. Block lock Status Read
Block Lock Status can be read on a block basis to find out whether designated block is av ailable to be pr ogrammed or
erased. After writing 7Ah command to the command register and block address to be checked, a read cycle outputs
the content of the Block Lock Status R egister to the I/O pins on the falling edge of CE or RE, whichever occurs last. RE
or CE does not need to be toggled for updated status. Block Lock Status Read is prohibited while the device is busy
state.
Refer to table 16 for specific Status Register definitions. The command register remains in Block Lock Status Read
mode until further commands are issued to it.
In high state of PRE pin, write protection status can be checked by Block Lock Status Read (7Ah) while
in low state by Status Read (70h).
4.4 Power-On Auto-Read
The device is designed to off er a utomatic reading of the first page without command and address inp ut sequence dur-
ing power-on.
An internal voltage detector enables auto-page read functions when Vcc reaches about 1.8V. PRE pin controls activa-
tion of auto-page r ead function. Auto-page read function is enabled only when PRE pin is lo gic high state. Serial access
may be done after power-on without latency. Power-On Auto Read mode is available only on 3.3V device.
Rev 0.5 / Jun. 2006 17
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Parameter Symbol Min Typ Max Unit
Valid Block Number NVB 2008 2048 Blocks
Table 6: Valid Blocks Number
NOTE:
1. The 1st block is guaranteed to be a valid block up to 1K cycles without ECC. (1bit/512bytes)
Symbol Parameter Value Unit
1.8V 3.3V
TA
Ambient Operating Temperature (Commercial Temperature Range) 0 to 70 0 to 70 ℃
Ambient Operating Temperature (Extended Temperature Range) -25 to 85 -25 to 85 ℃
Ambient Operating Temperature (Industrial Temperature Range) -40 to 85 -40 to 85 ℃
TBIAS Temperature Under Bias -50 to 125 -50 to 125 ℃
TSTG Storage Temperature -65 to 150 -65 to 150 ℃
VIO(2) Input or Output Voltage -0.6 to 2.7 -0.6 to 4.6 V
Vcc Supply Voltage -0.6 to 2.7 -0.6 to 4.6 V
Table 7: Absolute maximum ratings
NOTE:
1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “A bsolute
Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of
the device at these or a ny other conditions abov e those indicated in the Oper ating sections of this specification is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
2. Minimum Voltage may undershoot to -2V during transition and for less than 20ns during transitions.
Rev 0.5 / Jun. 2006 18
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
$''5(66
5(*,67(5
&2817(5
352*5$0
(5$6(
&21752//(5
+9*(1(5$7,21
&200$1'
,17(5)$&(
/2*,&
&200$1'
5(*,67(5
'$7$
5(*,67(5
,2
5(
%8))(56
<'(&2'(5
3$*(%8))(5
;
'
(
&
2
'
(
5
0ELW0ELW
1$1')ODVK
0(025<$55$<
:3
&(
:(
&/(
$/(
35(
$a$
Figure 6: Block Diagram
Rev 0.5 / Jun. 2006 19
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Parameter Symbol Test Conditions 1.8Volt 3.3Volt Unit
Min Typ Max Min Typ Max
Operating
Current
Sequential
Read ICC1 tRC(1.8V=60ns,
3.3V=50ns)
CE=VIL, IOUT=0mA -815-1020mA
Program ICC2 - - 8 15 - 10 20 mA
Erase ICC3 - - 8 15 - 10 20 mA
Stand-by Current (TTL) ICC4 CE=VIH,
PRE=WP=0V/Vcc --1- 1mA
Stand-by Current (CMOS) ICC5 CE=Vcc-0.2,
PRE=WP=0V/Vcc - 10 50 - 10 50 uA
Input Leakage Current ILI VIN=0 to Vcc (max) - - ±10 --
±10 uA
Output Leakage Current ILO VOUT =0 to Vcc (max) - - ±10 --
±10 uA
Input High Voltage VIH - Vcc-0.4 - Vcc+0.
32-
Vcc+0.
3V
Input Low Voltage VIL - -0.3 - 0.4 -0.3 - 0.8 V
Output High Voltage
Level VOH IOH=-100uA Vcc-0.1 - - - - - V
IOH=-400uA - - - 2.4 - - V
Output Low V oltage Level VOL IOL=100uA - - 0.1 - - - V
IOL=2.1mA - - - - - 0.4 V
Output Low Current (R/
B) IOL
(R/B)VOL=0.2V 3 4 - - - - mA
VOL=0.4V - - - 8 10 - mA
Table 8: DC and Operating Characteristics
Parameter Value
1.8Volt 3.3Volt
Input Pulse Levels 0V to Vcc 0.4V to 2.4V
Input Rise and Fall Times 5ns 5ns
Input and Output Timing Levels Vcc / 2 1.5V
Output Load (1.7V - 1.95Volt & 2.7V - 3.3V) 1 TTL GATE and CL=30pF 1 TTL GATE and CL=50pF
Output Load (3.0V - 3.6V) 1 TTL GATE and CL=100pF
Table 9: AC Conditions
Rev 0.5 / Jun. 2006 20
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Item Symbol Test Condition Min Max Unit
Input / Output Capacitance CI/O VIL=0V - 10 pF
Input Capacitance CIN VIN=0V - 10 pF
Table 10: Pin Capacitance (TA=25C, F=1.0MHz)
Parameter Symbol Min Typ Max Unit
Program Time tPROG - 200 500 us
Dummy Busy Time for the Lock or Lock-tight Block tLBSY -510us
Number of partial Program Cycles in the same page Main Array NOP - - 2 Cycles
Spare Array NOP - - 3 Cycles
Block Erase Time tBERS -23ms
Table 11: Program / Erase Characteristics
Rev 0.5 / Jun. 2006 21
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Parameter Symbol 1.8Volt 3.3Volt Unit
Min Max Min Max
CLE Setup time tCLS 00ns
CLE Hold time tCLH 10 10 ns
CE setup time tCS 00ns
CE hold time tCH 10 10 ns
WE pulse width tWP 40 25(1) ns
ALE setup time tALS 00ns
ALE hold time tALH 10 10 ns
Data setup time tDS 20 20 ns
Data hold time tDH 10 10 ns
Write Cycle time tWC 60 50 ns
WE High hold time tWH 20 15 ns
Data Transfer from Cell to register tR15 12 us
ALE to RE Delay (ID Read) tAR 10 10 ns
CLE to RE Delay tCLR 10 10 ns
Ready to RE Low tRR 20 20 ns
RE Pulse Width tRP 40 25 ns
WE High to Busy tWB 100 100 ns
Read C ycl e Time tRC 60 50 ns
RE Access Time tREA 35 30 ns
RE High to Output High Z tRHZ 30 30 ns
CE High to Output High Z tCHZ 20 20 ns
RE or CE high to Output hold tOH 10 10 ns
RE High Hold Time tREH 20 15 ns
Output High Z to RE low tIR 00ns
CE Access Time tCEA 45 45 ns
WE High to RE low tWHR 50 50 ns
Last RE High to busy (at sequential read) tRB 100 100 ns
CE High to Ready (in case of interception by CE at read) tCRY 80+tr(R/B#)(4) 60+tr(R/B#)(4) ns
CE High Hold Time (at the last serial read)(3) tCEH 100 100 ns
Device Resetting Time (Read / Program / Erase) tRST 5/10/500(2) 5/10/500(2) us
Write Protection time tWW(5) 100 100 ns
Table 12: AC Timing Characteristics
NOTE:
1. If tCS is less than 10ns tWP must be minimum 35ns, otherwise, tWP may be minimum 25ns.
2. If Reset Command (FFh) is written at Ready state, the device goes into Busy for maximum 5us
3. To break the sequential read cycle, CE must be held for longer time than tCEH.
4. The time to Ready depends on the value of the pull-up resistor tied R/B pin.ting time.
5. Program / Erase Enable Operation : WP high to WE High.
Program / Erase Disable Operation : WP Low to WE High
Rev 0.5 / Jun. 2006 22
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
IO Page
Program Block
Erase Read CODING
0 Pass / Fail Pass / Fail NA Pass: ‘0’ Fail: ‘1’
1NA NA NA Pass: ‘0’ Fail: ‘1’
(Only for Cache Progr am , else Don’t
care)
2NA NA NA -
3NA NA NA -
4NA NA NA -
5 Ready/Busy Ready/Busy Ready/Busy Active: ‘0’ Idle: ‘1’
6 Ready/Busy Ready/Busy Ready/Busy Busy: ‘0’ Ready’: ‘1’
7 Write Protect Write Protect Write Protect Protected: ‘0’
Not Protected: ‘1’
Table 13: Status Register Coding
DEVICE IDENTIFIER CYCLE DESCRIPTION
1st Manufacturer Code
2nd Device Identifier
Table 14: Device Identifier Coding
Part Number Voltage Bus Width 1st cycle
(Manufacture Code) 2nd cycle
(Device Code)
HY27US08561A 3.3V x8 ADh 75h
HY27US16561A 3.3V x16 ADh 55h
HY27SS08561A 1.8V x8 ADh 35h
HY27SS16561A 1.8V x16 ADh 45h
Table 15: Read ID Data Table
Rev 0.5 / Jun. 2006 23
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Figure 7: Command Latch Cycle
W&/
6
W&6
W:3
&RPPDQG
&/(
&(
:(
$/(
,2a
W'+W'6
W$/6 W$/+
W&/+
W&+
Table 16: Lock Status Code
Rev 0.5 / Jun. 2006 24
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
W&/6
W&6 W:& W:&
VW$GG
W:3W:3 W:3
W:+ W:+
W$/6 W$/6 W$/6W$/+ W$/+ W$/+
W'6 W'6 W'6
W'+ W'+ W'+
QG$GG UG$GG
&/(
&(
:(
$/(
,2a
Figure 8: Address Latch Cycle
Rev 0.5 / Jun. 2006 25
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
W:&W$/6
W&/+
W&+
W:3
W:+
',1 ',1 ',1ILQDO
W:+
W'+ W'+ W'+
W'6 W'6 W'6
W:3 W:3
&/(
$/(
&(
,2[
:(
Figure 10: Sequential Out Cycle after Read (CLE=L, WE=H, ALE=L)
NOTES : Transition is measured ±200mV from steady state voltage with load.
This parameter is sampled and not 100% tested.
tCEA
tREA tRP tREA
tRHZ* tRHZ*
Dout Dout Dout
tCHZ*
tOH
tOH
tREA
tREH
tRCtRR
CE
RE
R/B
I/Ox
Figure 9. Input Data Latch Cycle
Rev 0.5 / Jun. 2006 26
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Figure 11: Status Read Cycle
tCLS
tCLR
tCLH
tCS
tCH
tWP
tWHR
tCEA
tDS tREA
tCHZ
tRHZ
70h Status Output
tDH tIR
CE
WE
I/O
0-7
CLE
RE
CLE
CE
WE
ALE
RE
I/O0~7
R/B
tWC
tCEH
tCHZ
tCRY
tRHZ
tRC
tR
tAR
tWB
tRP
00h or 01h Col. add 1 Row add 1 Row add 2 Dout N Dout N+1 Dout N+2 Dout 527
tRB
Column
Address Page(Row) Address
Busy
Figure 12: Read1 Operation (Read One Page)
Rev 0.5 / Jun. 2006 27
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
CLE
CE
WE
ALE
RE
I/O
0~7
R/B
00h or 01h Col. add 1 Row add 1 Row add 2 Dout N Dout N+1 Dout N+2
Busy
Column
Address Row Address
tRP
tRC
tR
tWB
tAR
tCHZ
Figure 13: Read1 Operation intercepted by CE
CLE
CE
WE
ALE
RE
I/O0~7
R/B
tR
tAR
tWB
tRR
50h Col. add 1 Row add 1 Row add 2 Dout
511+M Dout 527
M Address
A0-A3: Valid Address
A4-A7: Dont’ care
Selected
Row
512 16
Start
Address M
Figure 14: Read2 Operation (Read One Page)
Rev 0.5 / Jun. 2006 28
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
CLE
CE
WE
ALE
RE
I/O0~7
R/B
00h Col. add1 Row add1
Row add2
Dout
NDout
N+1 Dout
527 Dout
0Dout
1Dout
527
M
NOutput
M+1
Output
Busy Busy
Ready
Figure 15: Sequential Row Read Operation Within a Block
Rev 0.5 / Jun. 2006 29
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Figure 16: Page Program Operation
CLE
ALE
CE
RE
R/B
I/Ox
WE
tWC
80h Col. Add1
Serial Data
Input Command Column
Address
Row
Address
Read Status
Command
Program
Command
I/Oo=0 Successful Program
I/Oo=1 Error in Program
1upto512Byte
Serial Input
Row Add1 Row Add2 Din
NDin
M10h 70h I/Oo
tWC tWC
tWB tPROG
Rev 0.5 / Jun. 2006 30
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
tWC
tWB
tR
tPROG
I/O0
70h
8Ah
Row add1 Row add2Col. add1 Row add1 Row add2Col. add1
00h
Column
Address Row Address Column
Address Row Address Read Status
Command
Busy
Busy
I/O0=0 Successful Program
I/O1=1 Error in Program
Copy-Back Data
Input Command 10h write cycle no more
CLE
CE
WE
ALE
RE
I/O0~7
R/B
Figure 17 : Copy Back Program
Rev 0.5 / Jun. 2006 31
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
W:&
&/(
&(
:(
$/(
5(
,2a
5%
W:% W%(56
%86<
K ,2'K
5RZDGG 5RZDGG
K
$XWR%ORFN(UDVH6HWXS&RPPDQG
(UDVH&RPPDQG
5HDG6WDWXV
&RPPDQG
,2 6XFFHVVIXO(UDVH
,2 (UURULQ(UDVH
3DJH5RZ$GGUHVV
Figure 18: Block Erase Operation (Erase One Block)
K
&/(
&(
:(
$/(
5(
,2a K
W5($
W$5
5HDG,'&RPPDQG $GGUHVVF\FOH 0DNHU&RGH 'HYLFH&RGH
$'K K
Figure 19: Read ID Operation
Rev 0.5 / Jun. 2006 32
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
$K
/RFN&RPPDQG
:3
&/(
&(
:(
,2[
Figure 20: Lock Command
:3
&/(
&(
:(
$/(
,2[ K
8QRFN&RPPDQG 6WDUW%ORFN$GGUHVVF\FOHV 8QORFN&RPPDQG (QG%ORFN$GGUHVVF\FOHV
K$GG $GG $GG $GG
Figure 21: Unlock Command Sequence
Rev 0.5 / Jun. 2006 33
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
:3
&/(
&(
:(
,2[ &K
/RFNWLJKW&RPPDQG
Figure 22: Lock Tight Command
:3
&/(
$/(
&(
:(
,2[
5(
$K $GG $GG 'RXW
5HDG%ORFN/RFN
VWDWXV&RPPDQG
%ORFN$GGUHVVF\FOH
W:+5
%ORFN/RFN6WDWXV
Figure 23: Lock Status Read Timing
Rev 0.5 / Jun. 2006 34
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
9
9FF
:(
&(
$/(
&/(
5%
35(
W5
5(
,2[
'DWD 'DWD 'DWD
'DWD2XWSXW
/DVW
'DWD
Figure 24: Automatic Power at Power On
FFh
tRST
WE
ALE
CLE
RE
IO7:0
R/B
Figure 25: Reset Operation
Rev 0.5 / Jun. 2006 35
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
:3
:(
9FF
XV
W
97+
Figure 26: Power On / Off Timing
VTH = 1.5 Volt for 1.8 Volt Supply devices; 2.5 Volt for 3.3 Volt Supply devices
Rev 0.5 / Jun. 2006 36
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
5SYDOXHJXLGHQFH
5SPLQ
ZKHUH,/LVWKHVXPRIWKHLQSXWFXUUQWVRIDOOGHYLFHVWLHGWRWKH5%SLQ
5SPD[LVGHWHUPLQHGE\PD[LPXPSHUPLVVLEOHOLPLWRIWU
#9FF 97D &&
/
S)
)LJ5SYVWUWI5SYVLEXV\
9FF0D[9
2/0D[ 9
P$,/,2/,/
5S LEXV\
5SRKP
LEXV\
LEXV\>$@
WUWI>V@
WI
%XV\
5HDG\ 9FF
9
WUWI
9
9FF
Q P
N N N N
Q P
Q P
*1'
'HYLFH
RSHQGUDLQRXWSXW
5%
Figure 27: Ready/Busy Pin electrical specifications
Rev 0.5 / Jun. 2006 37
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Figure 28: Lock/Unlock FSM Flow Cart
['HYLFHV
$UHD$
K
$UHD%
K
$UHD&
K
%\WHV %\WHV %\WHV
$%&
3RLQWHU
KKK
3DJH%XIIHU
['HYLFHV
$UHD$
K
$UHD&
K
%\WHV %\WHV
$&
3RLQWHU
KK
3DJH%XIIHU
Figure 29: Pointer operations
Rev 0.5 / Jun. 2006 38
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
K K $GGUHVV
,QSXWV 'DWD,QSXW K K K $GGUHVV
,QSXWV 'DWD,QSXW K
K K $GGUHVV
,QSXWV 'DWD,QSXW K K K $GGUHVV
,QSXWV 'DWD,QSXW K
K K $GGUHVV
,QSXWV 'DWD,QSXW K K K $GGUHVV
,QSXWV 'DWD,QSXW K
$5($$
$5($%
$5($&
,2
,2
,2
$UHDV$%&FDQEHSURJUDPPHGGHSHQGLQJRQKRZPXFKGDWDLVLQSXW6XEVHTXHQWKFRPPDQGVFDQEHRPLWWHG
$UHDV%&FDQEHSURJUDPPHGGHSHQGLQJRQKRZPXFKGDWDLVLQSXW7KHKFRPPDQGPXVWEHUHLVVXHGEHIRUHHDFKSURJUDP
2QO\$UHDV&FDQEHSURJUDPPHG6XEVHTXHQWKFRPPDQGFDQEHRPLWWHG
Figure 30: Pointer Operations for porgramming
Rev 0.5 / Jun. 2006 39
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
System Interface Using CE don’t care
To simplify system interface, CE may be inactive during data loading or sequential data-reading as shown below.
So, it is possible to conn ect NAND Flash to a mi croprocess or. The only function that was removed from standard NAND
Flash to make CE don’t care read operation was disabling of the automatic sequential read function.
jsl
hsl
pVv
jl
~l
_W XWzGhUOZjP kGpkGp
jlGNT
Figure 31: Program Operation with CE don’t-care.
,IVHTXHQWLDOURZUHDGHQDEOHG
&(PXVWEHKHOGORZGXULQJW5 &(GRQ¶WFDUH
W5
K
&/(
&(
5(
$/(
5%
:(
,2[
6WDUW$GG&\FOH 'DWD2XWSXWVHTXHQWLDO
Figure 32: Read Operation with CE don’t-care.
Rev 0.5 / Jun. 2006 40
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Bad Block Management
Devices with Bad Blocks have the same quality level and the same AC and DC characteristics as devices where all the
blocks are va lid. A Bad Block does not affect the perf ormance of valid blocks because it is isolated from the bit line and
common source line by a select transi stor. The devices are supplied with all the locations inside valid blocks
erased(FFh).The Bad Block Information is written prior to shipping. Any block where the 6th Byte/ 1st Word in the
spare area of the 1st or 2 nd page (if the 1st p age is Bad) d oes not c ontai n FFh is a Bad Blo ck. The Bad Bloc k I nf orma-
tion must be read before any erase is attempted as the Bad Block Information may be erased. For the system to be
able to recognize the Bad Blocks based on the original information it is recommended to create a Bad Block table fol-
lowing the flowchart shown in Figure 33. The 1st block, which is placed on 00h block address is guaranteed to be a
valid block.
Block Replacement
Over the lifetime of the device additional Bad Blocks may dev elop. In this case the block has to be replaced by copying
the data to a v alid block. These additional Bad Blocks ca n be identified as attempts to progr am or er ase them will give
errors in the Status Register.
As the failure of a page progr am operation doe s not affect the data in other pages in the same block, the block can be
replaced by re-pro gramming the current data and copying the rest of the replaced block to an av ailable v alid block.The
Copy Back Program command can be used to copy the data to a valid block.
See the “Copy Back Program” section for more details.
Refer to Table 17 for the recommended procedure to follow if an error occurs during an operation.
Operation Recommended Procedure
Erase Block Replacement
Program Block Replacement or ECC (with 1bit/512byte)
Read ECC (with 1bit/512byte)
Table 17: Block Failure
<HV
<HV
1R
1R
67$57
%ORFN$GGUHVV
%ORFN
'DWD
))K"
/DVW
EORFN"
(1'
,QFUHPHQW
%ORFN$GGUHVV
8SGDWH
%DG%ORFNWDEOH
Figure 33: Bad Block Management Flowchart
Rev 0.5 / Jun. 2006 41
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Write Protect Operation
The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations
are enabled and disabled as follows (Figure 34~37)
::
W
K K
:(
,2[
:3
5%
K K
W::
:(
,2[
:3
5%
Figure 34: Enable Programming
Figure 35: Disable Programming
Rev 0.5 / Jun. 2006 42
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
K
W
'K
::
:(
,2[
:3
5%
K
W::
'K
:(
,2[
:3
5%
Figure 36: Enable Erasing
Figure 37: Disable Erasing
Rev 0.5 / Jun. 2006 43
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Table 18: 48pin-TSOP1, 12 x 20mm, Package Mechanical Data
Symbol millimeters
Min Typ Max
A1.200
A1 0.050 0.150
A2 0.980 1.030
B 0.170 0.250
C 0.100 0.200
CP 0.100
D 11.910 12.000 12.120
E 19.900 20.000 20.100
E1 18.300 18.400 18.500
e 0.500
L 0.500 0.680
alpha 0 5
Figure 38: 48pin-TSOP1, 12 x 20mm, Package Outline
'
$
',(
$
H
%
/
Į
(
(
&
&3
$
Rev 0.5 / Jun. 2006 44
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Symbol millimeters
Min Typ Max
A0.650
A1 0 0.050 0.080
A2 0.470 0.520 0.570
B 0.130 0.160 0.230
C 0.065 0.100 0.175
C10.450 0.650 0.750
CP 0.100
D 16.900 17.000 17.100
D1 11.910 12.000 12.120
E 15.300 15.400 15.500
e0.500
alpha 0 8
Table 19: 48
p
in-USOP1
,
12 x 17mm
,
Packa
g
e Mechanical Data
Figure 39. 48pin-USOP1, 12 x 17mm, Package Outline
$
$
$
&
'
(
&
H%
$QJOH DOSKD
'
Į
&3
Rev 0.5 / Jun. 2006 45
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Symbol Millimeters
Min Typ Max
A 0.80 0.90 1.00
A1 0.25 0.30 0.35
A2 0.55 0.60 0.65
b 0.40 0.45 0.50
D 8.90 9.00 9.10
D1 4.00
D2 7.20
E 10.90 11.00 11.10
E1 5.60
E2 8.80
e0.80
FD 2.50
FD1 0.90
FE 2.70
FE1 1.10
SD 0.40
SE 0.40
'
'
6'
)'
)'
$
$
$
6(
)(
)(
(
(
%$//³$´
(
H
H
GGG
HE
'
Figure 40. 63ball-FBGA, Pakage Outline
NOTE: Drawing is not to scale.
Table 20: 63ball-FBGA, Pakage Mechanical Data
Rev 0.5 / Jun. 2006 46
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
MARKING INFORMATION - TSOP1/USOP
Packag M arking Exam ple
TSOP1
/
USOP
K O R
H Y 2 7 x S x x 5 6 x A
x x x x Y W W x x
- hynix
- K O R
- HY27xSxx56xA xxxx
HY : HYNIX
2 7 : NAND Flash
x : Power Supply
S : Classification
x x : B it Org an ization
5 6 : Density
x : Mode
A: Version
x : Package Type
x : Package M aterial
x : Operating Tem perature
x : Bad Block
- Y : Year (ex: 5= year 2005, 06= year 2006)
- ww: W ork W eek (ex: 12= work week 12)
- xx : Process Code
Note
- C ap ita l Lette r
- S ma ll L e tte r
: H yn ix Symbo l
: Origin C o u n try
: U(2.7V~ 3.6V), L(2.7V), S(1.8V)
: S in g le L e v el C e ll+S in g le Die +S ma ll B lo c k
: 08(x8), 16(x16)
: 256M bit
: 1(1nCE & 1R/nB; Sequential Row Read enable)
2(1nCE & 1R/nB; Sequential Row Read Disable)
: 2nd G en era tio n
: T(48-TSOP1), S(48-USOP)
: Blank(N orm al), P(Lead Free)
: C (0℃~70℃), E (-25℃~85℃)
M(-30℃~85℃), I(-40℃~85℃)
: B(Included Bad Block), S(1~5 Bad Block),
P(All Good Block)
: Fixed Item
: N on-fixed Item
: Part N u mb er
Rev 0.5 / Jun. 2006 47
HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
MARKING INFORMATION - FBGA
Packag Marking Example
FBGA
K O R
H Y 2 7 x S x x 5 6 x A
x x x x Y W W x x
- hynix
- K O R
- H Y27xSxx56xA xxxx
H Y : HYNIX
2 7 : NAND Flash
x : Power Supply
S : Classification
x x : B it O rg a niz atio n
5 6 : Density
x : Mode
A : Version
x : Package Type
x : Package M aterial
x : Operating Temperature
x : Bad Block
- Y : Year (ex: 5= year 2005, 06= year 2006)
- ww: W ork W eek (ex: 12= w ork w eek 12)
- xx : Process C ode
Note
- C ap ita l L ette r
- Sma ll Le tter
: H y nix S ymb ol
: Orig in C o u n try
: U (2.7V~ 3.6V), L(2.7V), S(1.8V)
: S ing le L e v el C e ll+S in g le Die +S ma ll B lo ck
: 08(x8), 16(x16)
: 256M bit
: 1(1nCE & 1R/nB; Sequential Row Read Enable)
2 (1 n CE & 1 R /n B ; S eq u en tial R ow R e ad D isa b le )
: 2 nd G e ne ration
: F(63FBG A)
: Blank(Norm al), P(Lead Free)
: C (0 ℃~70℃), E(-2 5℃~85℃)
M(-3 0℃~85℃), I(-40℃~85℃)
: B(Included Bad Block), S(1~5 Bad Block),
P(All Good Block)
: Fixed Ite m
: N o n-fixe d Ite m
: P art N u mb er
