April 2015
Micro Modules
(Substrates with Built-in ICs, Products Utilizing with SESUB)
Bluetooth V4.0 Smart Single Mode Module
SESUB-PAN-T2541
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
(2/4)
20150413 / sesub-pan-t2541_en.fm
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: SESUB_Support@tdk.co.jp
Micro Modules
(Substrates with Built-in ICs, Products Utilizing with SESUB)
Bluetooth V4.0 Smart Single Mode Module
FEATURES
Micro size (4.6×5.6×1.0mm) ideal for wearable devices.
Communicable with Bluetooth® Smart Ready compatible devices.
Separate antenna type that provides more flexibility for product design.
APPLICATION
Health care, sports & fitness devices
(physical activity monitor, thermometer, blood pressure monitor, blood oxygen monitor,
blood sugar monitor, heart rate monitor, etc.)
Wearable computers
(bracelet type, watch type, ring type, glass type, shoe, hat, shirt, etc.)
Home & entertainment devices
(remote control, sensor tag, toy, lighting apparatus, etc.)
PC accessories
(mouse, keyboard, stylus pen, presentation pointer, etc.)
BLOCK DIAGRAM
Overview of SESUB-PAN-T2541
to RF ANT
32.768MHz
Sleep Clock∗
I2C / UART / SPI
Analog / Digital
I/O
V
supply
Filter
Crystal
32MHz
Te x as Instruments
CC2541F256
Bluetooth® and Bluetooth® Low Energy are the standards established by Bluetooth Special Interest Group (SIG).
(3/4)
20150413 / sesub-pan-t2541_en.fm
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: SESUB_Support@tdk.co.jp
SESUB-PAN-T2541
SHAPE & DIMENSIONS
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS SPECIFICATION TABLE
Line-of-sight distances. Depending on antenna properties.
Communication standards 2.4GHz Bluetooth® V4.0 low energy
Wireless output power (dBm)typ. 0
Communication range (m)10
Interface UART/SPI/I2C/GPIO/ADC
4.6 (nom.)
5.6 (nom.)
(0.06) (nom.)
1.0 (nom.)
ø0.28 (nom.)0.5 (nom.)
0.5 (nom.)
Dimensions in mm
(4/4)
20150413 / sesub-pan-t2541_en.fm
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: SESUB_Support@tdk.co.jp
SESUB-PAN-T2541
MODULE TERMINAL
EVALUATION BOARD
Based on the IC manufacturer-provided evaluation environment (TDK part number: SP13801）
The product is used by connecting to the IC evaluation kits of IC manufacturers.
All software development environments and programming tools are provided by IC manufacturers.
Various development materials of IC manufacturers are available as they are, which enables smooth development of products.
We also offer evaluation kits which enables to evaluate product functions easily. (TDK part number: SP13808)
For more details, please contact us.
1
GND
36
P2_2
35
GND
34
P2_4/32k
33
P2_3/32k
32
P1_7
31
P1_6
30
P1_1
29
P1_2
28
P1_3
10
P0_0
11
P0_1
12
P0_2
13
P0_3
14
P0_4
15
P0_5
16
P0_6
17
P0_7
18
P1_0
2
P2_1
3
P2_0
4
VDO
5
VDA_1
6
VDA_2
7
GND
8
RST_N
9
GND
27
GND
26
SCL
25
SDA
24
P1_4
23
P1_5
22
GND
21
2G_RF
20
GND
19
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin1
RF
POWER
Clock
I/O
Cont
GND
Module Bottom View
Equipped with a program
writing terminal
A chip antenna on
the evaluation board
Equipped with a land pattern for a crystal unit
for generating a sleep clock
Connectors to evaluation boards of the IC manufacturers
