Description
These chip LEDs are designed in an industry standard
package for ease of handling and use. Various di erent
LED colors are available in nine compact, single color
packages.
The HSMx-C150 has the industry standard 3.2 x 1.6
mm footprint that is excellent for all around use. The
HSMx-C170 has the widely used 2.0 x 1.25 mm foot-print
with 0.8 mm pro le. The HSMx-C177 has the widely
used 2.0 x 1.25 mm footprint with 0.4 mm pro le. The
HSMx-C19x series has the industry standard 1.6 x 0.8 mm
footprint with varying pro le to suit designers needs,
the HSMx-C190 has 0.8 mm pro le, the HSMx-C191 has a
low pro le of 0.6 mm, and the HSMx-C197 has the ultra
low pro le of 0.4 mm. This family with its thin pro le and
wide viewing angle makes this LED exceptional for back-
lighting applications.
The HSMx-C110 is a right angle package with the uni-
versally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The
HSMx-C120 is a smaller right angle package with industry
standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse
mount package with dimensions of 3.4 x 1.25 x 1.1 mm.
These devices are ideal for LCD backlighting and side-
lighting applications.
In order to facilitate pick and place operation, these
chip LEDs are shipped in tape and reel with 4000 units
per reel for HSMx-C120, C170, C177, C190, C191, C197
packages, and 3000 units per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with IR reflow solder
processes. The small size and wide viewing angle make
these LEDs prime choices for backlighting applications
and front panel illumination especially where space is a
premium.
HSMx-C110/ HSMx-C120/HSMx-C150/HSMx-C170/HSMx-C177/
HSMx-C190/HSMx-C191/HSMx-C197/HSMx-C265
Features
Small size
Industry standard footprint
Compatible with IR solder
Di used optics
Operating temperature range of -40°C to +85°C
Right angle & reverse mount package available
Various colors available
Available in 8 mm tape on 7 in. (178 mm) diameter
reels
Applications
Keypad backlighting
Push-button backlighting
LCD backlighting
Symbol backlighting
Front panel indicator
HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx,
HSMS-Cxxx, HSMY-Cxxx,
Surface Mount Chip LEDs
Data Sheet
2
As AlGaAs
Red Description
HSMH-C110 Untinted, Non-Di used
HSMH-C120 Untinted, Non-Di used
HSMH-C150 Untinted, Di used
HSMH-C170 Untinted, Di used
HSMH-C190 Untinted, Di used
HSMH-C191 Untinted, Di used
HSMH-C265 Untinted, Non-Di used
Device Selectiion Guide
GaP
Green HER Orange Yellow Description
HSMG-C110 HSMS-C110 HSMD-C110 HSMY-C110 Untinted, Non-Di used
HSMG-C120 HSMS-C120 HSMD-C120 – Untinted, Non-Di used
HSMG-C150 HSMS-C150 HSMD-C150 HSMY-C150 Untinted, Di used
HSMG-C170 HSMS-C170 HSMD-C170 HSMY-C170 Untinted, Di used
HSMG-C177 HSMS-C177 HSMD-C177 HSMY-C177 Untinted, Di used
HSMG-C190 HSMS-C190 HSMD-C190 HSMY-C190 Untinted, Di used
HSMG-C191 HSMS-C191 HSMD-C191 HSMY-C191 Untinted, Di used
HSMG-C197 HSMS-C197 HSMD-C197 HSMY-C197 Untinted, Di used
HSMG-C265 – – – Untinted, Non-Di used
Package Dimensions
HSMx-C150 HSMx-C170
3.2 (0.126)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
[3]
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
(ANODE MARK FOR
HSMH-C150)
CATHODE LINE
(ANODE LINE
FOR HSMH-C150)
2.0 (0.079)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY[3]
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
(ANODE MARK FOR
HSMH-C170)
CATHODE LINE
(ANODE LINE
FOR HSMH-C170)
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise speci ed.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
3
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise speci ed.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
HSMx-C190 HSMx-C110
1.6
(0.063)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
[3]
CATHODE MARK
(ANODE MARK FOR HSMH-C190)
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
(ANODE LINE
FOR HSMH-C190)
0.7 (0.028) MIN.
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
POLARITY
[3]
CATHODE
LINE
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
(ANODE LINE
FOR HSMH-C110)
3.2 (0.126 )
(ANODE MARK
FOR HSMH-C110)
HSMx-C191 HSMx-C177
CATHODE MARK
1.25
(0.049)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
1.10 (0.043) MIN.
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY[3]
CATHODE MARK
(ANODE MARK FOR HSMH-C191)
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
(ANODE LINE
FOR HSMH-C191)
0.7 (0.028) MIN.
4
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise speci ed.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
HSMx-C265
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY[3]
CATHODE
MARK (ETCHED)
[ANODE MARK FOR HSMH-C265]
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
1.25 (0.049)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
GREEN SOLDER MASK
CATHODE LINE
(ANODE LINE
FOR HSMH-C265)
HSMx-C197
CATHODE MARK
0.80
(0.031)
1.60
(0.063)
DIFFUSED
EPOXY
PC BOARD 0.40 (0.016)
0.16 (0.006)
POLARITY
0.70 (0.028) MIN.
SOLDERING
TERMINAL
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
HSMx-C120
1.6 (0.063)
0.5 (0.020)
POLARITY[3]
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
(ANODE LINE
FOR HSMH-C120)
5
Absolute Maximum Ratings for GaP at TA=25°C
Parameter C110/150/265 C120/170/177/190/191/197 Units
DC Forward Current[1] 25 20 mA
Power Dissipation 65 52 mW
Reverse Voltage (IR=100 μA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range -40 to +85 -40 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 °C
Soldering Temperature See re ow soldering pro le (Figure 9 & 10)
Absolute Maximum Ratings for AlGaAs at TA=25°C
Parameter C110/150 C120/170/190/191/265 Units
DC Forward Current[1] 30 25 mA
Power Dissipation 78 65 mW
Reverse Voltage (IR=100μA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range -40 to +85 -40 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 °C
Soldering Temperature See re ow soldering pro le (Figure 9 & 10)
Electrical Characteristics at TA=25°C
Reverse Capacitance
Forward Voltage Breakdown C(pF), Thermal
Part Number Color VF(Volts) VR(Volts) @ VF = 0 V, Resistance
@ IF = 20 mA @ IR = 100 μA f = 1 MHz RJ-P (°C/W)
Typ. Max. Min. Typ. Typ.
HSMS-C110/150 HER 2.1 2.6 5 5 400
HSMS-C120 350
HSMS-C170/177/190/191/197 250
HSMD-C110/150 Orange 2.2 2.6 5 7 400
HSMD-C120 350
HSMD-C170/177/190/191/197 250
HSMY-C110/150 Yellow 2.1 2.6 5 6 400
HSMY-C170/177/190/191/197 250
HSMG-C110/150 Green 2.2 2.6 5 9 400
HSMG-C120 350
HSMG-C170/177/190191/197/265 250
HSMH-C110/150 AlGaAs 1.8 2.6 5 18 460
HSMH-C120 400
HSMH-C170/190/191/265 300
Note:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
6
Color Bin Limits[1]
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Yellow Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ±1 nm
Tolerance: ±1 nm
Tolerance: ±1 nm
Optical Characteristics at TA=25°C
Luminous Peak Dominant
Intensity[1] Wavelength Wavelength Viewing
Part Number Color Iv(mcd)@20mA peak(nm) d(nm) Angle 21/2(°)[2]
Min. Typ. Typ. Typ. Typ.
HSMG-C110/177/197 Green 4.5 15.0 570 572 130
HSMG-C120 155
HSMG-C150/170/190/191/265 170
HSMS-C110/177/197 HER 2.8 10.0 630 626 130
HSMS-C120 155
HSMS-C150/170/190/191 170
HSMD-C110/177/197 Orange 2.8 8.0 605 604 130
HSMD-C120 155
HSMD-C150/170/190/191 170
HSMY-C110/177/197 Yellow 2.8 8.0 589 586 130
HSMY-C150/170/190/191 170
HSMH-C110 AlGaAs 7.2 17.0 660 639 130
HSMH-C120 155
HSMH-C150/170/190/191/265 170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of
the lamp package.
2. 1/2 is the o -axis angle where the luminous intensity is 1/2 the peak intensity.
7
Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs. ambient
temperature.
Figure 1. Relative intensity vs. wavelength.
WAVELENGTH – nm
HER
GREEN
RELATIVE INTENSITY
1.0
0.5
0500 550 600 650 700 750
YELLOW
ORANGE
AlGaAs
100
10
1
0.11.5 1.7 1.9 2.1 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
GREEN
ORANGE
YELLOW
AlGaAs
HER
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Note:
1. Bin categories are established for classi -
cation of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
2. The Iv binning speci cation set-up is for
lowest allowable Iv binning only. There is
no upper Iv bin limits.
Tolerance: ±15%
0
35
020 60 80 100
5
IF MAX. – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
15
25
30
10
RqJ-A =
800°C/W
RqJ-A =
600°C/W
20
C110/C150/C265
HER, ORANGE,
YELLOW, GREEN
C120/C170/C177/
C190/C191/C197/
C265 AlGaAs
C120/C170/
C177/C190/
C191/C197
HER,
ORANGE,
YELLOW,
GREEN
C110/C150 AlGaAs
8
Figure 5. Relative intensity vs. angle for HSMx-C110.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Relative intensity vs. angle for HSMx-C120.
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
9
Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265.
Figure 10. Recommended Pb-free re ow soldering pro le.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 11. Recommended soldering pattern
for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Figure 13. Recommended soldering pattern
for HSMx-C190, C191 and C197.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 12. Recommended soldering
pattern for HSMx-C170 and C177.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
Figure 9. Recommended re ow soldering pro le.
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
3 C/SEC. MAX.
150 C
255 - 260 C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE
10
Figure 14. Recommended soldering pattern for HSMx-C110.
Figure 17. Reeling orientation.
Figure 18. Reel dimensions.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
Figure 15. Recommended soldering pattern for HSMx-C120.
Note: All dimensions in millimeters (inches).
Figure 16. Recommended soldering pattern for HSMx-C265.
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
11
Figure 19. Tape dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
HSMx-C110/C120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
R 0.5 ± 0.05
(0.020 ± 0.002)
1.20 (0.047)
0.75 (0.030)
1.27 (0.050)
0.95 (0.037)
0.60 (0.024)
0.90 (0.035)
0.87 (0.034)
0.60 (0.024)
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.30 (0.091)
1.75 (0.069)
1.86 (0.073)
1.75 (0.069)
1.70 (0.067)
1.15 (0.045)
1.88 (0.074)
1.45 (0.057)
1.40 (0.055)
0.90 (0.035)
0.89 (0.035)
0.95 (0.037)
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise speci ed.
Figure 20. Tape leader and trailer dimensions. Convective IR Re ow Soldering
For more information on IR re ow
soldering, refer to Application Note
1060, Surface Mounting SMT LED
Indicator Components.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23 ± 5°C.
b) Device exposed to factory
conditions <30°C/60% RH
more than 672 hours.
Baking recommended condition: 60
+/– 5˚C for 20 hours.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4806EN
AV02-0551EN - March 5, 2012