© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 7 Publication Order Number:
BC807−16LT1/D
1
BC807−16LT1,
BC807−25LT1, BC807−40LT1
General Purpose
Transistors
PNP Silicon
Features
•Pb−Free Packages are Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage VCEO −45 V
Collector − Base Voltage VCBO −50 V
Emitter − Base Voltage VEBO −5.0 V
Collector Current − Continuous IC−500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
PD225
1.8 mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RqJA 556 °C/W
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
PD300
2.4 mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RqJA 417 °C/W
Junction and Storage Temperature TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in 99.5% alumina.
SOT−23
CASE 318
STYLE 6
12
3
http://onsemi.com
COLLECTOR
3
1
BASE
2
EMITTER
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
1
5xx M G
G
5xx = Device Code
xx = A1, B1, or C
M = Date Code*
G= Pb−Free Package
MARKING DIAGRAM
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
BC807−16LT1, BC807−25LT1, BC807−40LT1
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(IC = −10 mA) V(BR)CEO −45 − − V
Collector−Emitter Breakdown Voltage
(VEB = 0, IC = −10 mA) V(BR)CES −50 − − V
Emitter−Base Breakdown Voltage
(IE = −1.0 mA) V(BR)EBO −5.0 − − V
Collector Cutoff Current
(VCB = −20 V)
(VCB = −20 V, TJ = 150°C)
ICBO −
−−
−−100
−5.0 nA
mA
ON CHARACTERISTICS
DC Current Gain
(IC = −100 mA, VCE = −1.0 V) BC807−16
BC807−25
BC807−40
(IC = −500 mA, VCE = −1.0 V)
hFE 100
160
250
40
−
−
−
−
250
400
600
−
−
Collector−Emitter Saturation Voltage
(IC = −500 mA, IB = −50 mA) VCE(sat) − − −0.7 V
Base−Emitter On V oltage
(IC = −500 mA, IB = −1.0 V) VBE(on) − − −1.2 V
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product
(IC = −10 mA, VCE = −5.0 Vdc, f = 100 MHz) fT100 − − MHz
Output Capacitance
(VCB = −10 V, f = 1.0 MHz) Cobo − 10 − pF
ORDERING INFORMATION
Device Specific Marking Package Shipping†
BC807−16LT1
5A1
SOT−23 3000/Tape & Reel
BC807−16LT1G SOT−23
(Pb−Free) 3000/Tape & Reel
BC807−16LT3G SOT−23
(Pb−Free) 10,000/Tape & Reel
BC807−25LT1
5B1
SOT−23 3000/Tape & Reel
BC807−25LT1G SOT−23
(Pb−Free) 3000/Tape & Reel
BC807−25LT3 SOT−23 10,000/Tape & Reel
BC807−25LT3G SOT−23
(Pb−Free) 10,000/Tape & Reel
BC807−40LT1
5C
SOT−23 3000/Tape & Reel
BC807−40LT1G SOT−23
(Pb−Free) 3000/Tape & Reel
BC807−40LT3 SOT−23 10,000/Tape & Reel
BC807−40LT3G SOT−23
(Pb−Free) 10,000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
BC807−16LT1, BC807−25LT1, BC807−40LT1
http://onsemi.com
3
IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
hFE, DC CURRENT GAIN
1000
10
−1000−0.1 −10 −100
100
−1.0
VCE = −1.0 V
TA = 25°C
IB, BASE CURRENT (mA)
Figure 2. Saturation Region
IC, COLLECTOR CURRENT (mA)
Figure 3. “On” Voltages
100
10
1.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Temperature Coefficients
+1.0
IC, COLLECTOR CURRENT
Figure 5. Capacitances
−0.1 −1.0−1.0 −10 −100 −1000
−2.0
−1.0
0
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS
)
V, VOLTAGE (VOLTS)
V, TEMPERATURE COEFFICIENTS (mV/ C)°θ
C, CAPACITANCE (pF)
−1.0
−0.8
−0.6
−0.4
−0.2
0
−0.01 −0.1 −10 −100−1.0
−1.0
−0.8
−0.6
−0.4
−0.2
0
−1.0 −10 −1000−100
−10 −100
TJ = 25°C
IC = −10 mA
IC = −100 mA
IC = −300 mA
IC =
−500 mA
TA = 25°C
VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = −1.0 V
VCE(sat) @ IC/IB = 10
qVC for VCE(sat)
qVB for VBE
Cob
Cib
BC807−16LT1, BC807−25LT1, BC807−40LT1
http://onsemi.com
4
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.029
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
BC807−16LT1/D
PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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Email: orderlit@onsemi.com
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