Product Folder Order Now Support & Community Tools & Software Technical Documents TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 TLV6208x 1.2-A and 2-A High-Efficiency Step-Down Converter in 2-mm x 2-mm WSON Package 1 Features 3 Description * The TLV6208x family devices are small buck converters with few external components, enabling cost effective solutions. They are synchronous stepdown converters with an input voltage range of 2.5 and 2.7 (2.5 V for TLV62080, 2.7 V for TLV62084x) to 6 V. The TLV6208x devices focus on highefficiency step-down conversion over a wide output current range. At medium to heavy loads, the TLV6208x converters operate in PWM mode and automatically enter power save mode operation at light-load currents to maintain high efficiency over the entire load current range. 1 * * * * * * * * * * DCS-ControlTM Architecture for Fast Transient Regulation 2.5 to 6-V Input Voltage Range (TLV62080) 2.7 to 6-V Input Voltage Range (TLV62084, TLV62084A) 100% Duty Cycle for Lowest Dropout Power Save Mode for Light Load Efficiency Output Discharge Function Power Good Output Thermal Shutdown Available in 2 mm x 2 mm 8-Terminal WSON Package For Improved Features Set, see the TPS62080 Create a Custom Design Using the TLV6208x With the WEBENCH(R) Power Designer To address the requirements of system power rails, the internal compensation circuit allows a wide range of external output capacitor values. With the DCSControlTM (Direct Control with Seamless transition into Power save mode) architecture excellent load transient performance and output voltage regulation accuracy are achieved. The devices are available in 2-mm x 2-mm WSON package with Thermal Pad. 2 Applications * * * * * Battery-Powered Portable Devices Point-of-Load Regulators PC, Notebook, Server Set Top Box Solid State Drive (SSD), Memory Supply Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) WSON (8) 2.00 mm x 2.00 mm TLV62080 TLV62084, TLV62084A (1) For all available packages, see the orderable addendum at the end of the datasheet. space Typical Application Schematic Efficiency vs Output Current, VOUT = 1.2V space space POWER GOOD 100 90 2.7 V to 6 V PG VIN 80 180 k 1 H 70 SW EN VOUT TLV62084 10 F GND VOS GND FB R1 22 F Efficiency (%) VIN 60 50 40 30 R2 20 VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V 10 Copyright (c) 2016, Texas Instruments Incorporated 0 1E-5 0.0001 0.001 0.01 Output Current (A) 0.1 1 2 D002 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 4 5 7.1 7.2 7.3 7.4 7.5 7.6 5 5 5 5 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 8.1 8.2 8.3 8.4 Overview ................................................................... 9 Functional Block Diagram ......................................... 9 Feature Description................................................... 9 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application .................................................. 12 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 18 11.1 Layout Guidelines ................................................. 18 11.2 Layout Example .................................................... 18 11.3 Thermal Considerations ........................................ 19 12 Device and Documentation Support ................. 20 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Receiving Notification of Documentation Updates Community Resources.......................................... Glossary ................................................................ 20 20 20 20 20 21 21 21 13 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (September 2016) to Revision H Page * Added WEBENCH(R) information to Features, Detailed Design Procedure, and Device Support sections............................. 1 * Added SW (AC, less than 10 ns) to the Absolute Maximum Rating table ............................................................................. 5 Changes from Revision F (January 2015) to Revision G Page * Added TLV62084A device and Applications ......................................................................................................................... 1 * Added Power Good Pin Logic Table (TLV62080/84) and Power Good Pin Logic Table (TLV62084A) ............................. 10 * Added scale factors in Figure 14 ......................................................................................................................................... 16 * Changed PCB Layout Image ............................................................................................................................................... 18 * Added Receiving Notification of Documentation Updates and Community Resources sections. ........................................ 21 Changes from Revision E (February 2014) to Revision F Page * Changed Device Information table. ....................................................................................................................................... 1 * Renamed the Configuration and Functions section .............................................................................................................. 4 * Added new TI-Legal note to Application and Implementation section. ................................................................................ 12 * Renamed "Thermal Information" to Thermal Considerations ............................................................................................... 19 Changes from Revision D (June 2013) to Revision E Page * Added the Device Information table, Power Supply Recommendations, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................................................................ 1 * Clarified the input voltage ranges of 2.5 V to 5.5 V for the TLV62080 device and 2.7 V to 5.5 V for the TLV62084 device 1 * Changed the Ordering Information table to the Device Comparison table and removed the Package Marking, TA, and Package columns from the table .................................................................................................................................... 4 2 Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 * Changed the word pin to terminal in most cases throughout the document ......................................................................... 4 * Added the Handling Ratings table which now contains the storage temperature range and ESD ratings ........................... 5 * Added ILIM range for TLV62084 in Electrical Characteristics table......................................................................................... 6 * Added the higher output voltage graphs "Output Voltage vs Load Current", Figure 6, Figure 7 in the Typical Characteristics section............................................................................................................................................................ 7 * Replaced the "Switching Frequency vs Load Current" graph to the new "Switching Frequency vs Output Current" graph in the Typical Characteristics section........................................................................................................................... 7 * Replaced the TLV62080 typical application circuit with the circuit for the TLV62084.......................................................... 12 * Deleted the Parameter Measurement Information Section and moved image and list of components to Typical Application section................................................................................................................................................................ 12 * Added Table 4 to the Design Requirements section ........................................................................................................... 12 * Added Moved Waveforms from the Typical Characteristics section into the Application Curves section. Changed LCOIL (coil inductance) to ICOIL (coil current) in the Typical Application (PWM Mode and PFM Mode), Load Transient, Line Transient, and Startup waveforms................................................................................................................................ 15 * Added the output capacitance and inductance conditions to the first (original) Load Transient graph................................ 16 * Added the second Load Transient graph (Figure 14) .......................................................................................................... 16 Changes from Revision C (May 2013) to Revision D * Page Deleted TLV62084 device number from datasheet.............................................................................................................. 19 Changes from Revision B (July 2012) to Revision C * Page Changed the Thermal Information table values ..................................................................................................................... 5 Changes from Revision A (November 2011) to Revision B Page * Changed QFN to SON in ORDERING INFORMATION ......................................................................................................... 4 * Changed QFN to SON in DEVICE INFORMATION ............................................................................................................... 4 * Changed Thermal Pad description in Pin Functions .............................................................................................................. 4 * Changed TJ in the Absolute Maximum Ratings (1) From: -40 to 125C To: -40 to 150C ...................................................... 5 * Changed several instances of DSC to DCS in DEVICE OPERATION section...................................................................... 9 * Changed DSC to DCS in Functional Block Diagram.............................................................................................................. 9 Changes from Original (October 2011) to Revision A Page * Changed pin VSNS to VOS in Figure 9 ............................................................................................................................... 12 * Changed pin VSNS to VOS in Figure 10 ............................................................................................................................. 15 Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 3 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 5 www.ti.com Device Comparison Table PART NUMBER (1) INPUT VOLTAGE OUTPUT CURRENT Power Good Logic Level (EN=Low) TLV62080 2.5 V to 6 V 1.2 A High Impedance TLV62084 2.7 V to 6 V 2A High Impedance TLV62084A 2.7 V to 6 V 2A Low (1) For detailed ordering information please check the Mechanical, Packaging, and Orderable Information section at the end of this datasheet. 6 Pin Configuration and Functions space 8-Pin WSON With Thermal Pad DSG Package (Top View) EN 1 GND 2 GND 3 FB 4 Exposed Thermal Pad 8 VIN 7 SW 6 PG 5 VOS space space Pin Functions PIN NO. 1 2, 3 NAME EN GND IN PWR DESCRIPTION Device enable logic input. Do not leave floating. Logic HIGH enables the device, logic LOW disables the device and turns it into shutdown. Power and signal ground. 4 FB IN Feedback terminal for the internal control loop. Connect this terminal to the external feedback divider to program the output voltage. 5 VOS IN Output voltage sense terminal for the internal control loop. Must be connected to output. 6 PG OUT Power Good open drain output. This terminal is pulled to low if the output voltage is below regulation limits. This terminal can be left floating if not used. 7 SW PWR Switch terminal connected to the internal MOSFET switches and inductor terminal. Connect the inductor of the output filter here. 8 VIN PWR Power supply voltage input. Exposed Thermal Pad 4 I/O -- Must be connected to GND. Must be soldered to achieve appropriate power dissipation and mechanical reliability. Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 7 Specifications 7.1 Absolute Maximum Ratings (1) Voltage range (2) Power Good Sink Current MIN MAX VIN, PG, VOS - 0.3 7 V SW - 0.3 VIN + 0.3 V SW (AC, less than 10 ns) (3) - 3.0 10 V FB - 0.3 3.6 V EN - 0.3 VIN + 0.3 PG UNIT V 1 mA Operating junction temperature range, TJ - 40 150 C Storage temperature range, Tstg - 65 150 C (1) (2) (3) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. While switching. 7.2 ESD Ratings V(ESD) (1) (2) Electrostatic discharge Human body model (HBM) ESD stress voltage (1) Charged device model (CDM) ESD stress voltage VALUE UNIT 2000 V 500 V (2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) MIN TYP MAX UNIT VIN Input voltage range, TLV62080 2.5 6 V VIN Input voltage range, TLV62084, TLV62084A 2.7 6 V TJ Operating junction temperature -40 125 C (1) Refer to the Application Information section for further information. 7.4 Thermal Information THERMAL METRIC (1) TLV6208x DSG (8 PINS) UNITS JA Junction-to-ambient thermal resistance 59.7 C/W JCtop Junction-to-case (top) thermal resistance 70.1 C/W JB Junction-to-board thermal resistance 30.9 C/W JT Junction-to-top characterization parameter 1.4 C/W JB Junction-to-board characterization parameter 31.5 C/W JCbot Junction-to-case (bottom) thermal resistance 8.6 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 5 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 7.5 Electrical Characteristics Over recommended free-air temperature range, TA = -40C to 85C, typical values are at TA = 25C (unless otherwise noted), VIN= 3.6 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Input voltage range,TLV62080 2.5 6 VIN Input voltage range,TLV62084, TLV62084A 2.7 6 IQ Quiescent current into VIN IOUT = 0 mA, Device not switching ISD Shutdown current into VIN EN = LOW Under voltage lock out Input voltage falling 1.8 Under voltage lock out hysteresis Rising above VUVLO 120 mV Thermal shutdown Temperature rising 150 C Thermal shutdown hysteresis Temperature falling below TJSD 20 C VUVLO TJSD 30 V V uA 1 2 A V LOGIC INTERFACE (EN) VIH High level input voltage 2.5 V VIN 6 V VIL Low level input voltage 2.5 V VIN 6 V ILKG Input leakage current 1 V 0.4 V 0.01 0.5 A -10 -5 % POWER GOOD VPG Power good threshold VOUT falling referenced to VOUT nominal -15 Power good hysteresis 5 VOL Low level voltage Isink = 500 A IPG,LKG PG Leakage current VPG = 5.0 V % 0.3 V 0.01 0.1 A 4 V 0.45 0.462 V 10 100 OUTPUT VOUT Output voltage range VFB Feedback regulation voltage VIN 2.5 V and VIN VOUT + 1 V IFB Feedback input bias current VFB = 0.45 V RDIS Output discharge resistor EN = LOW, VOUT = 1.8 V High side FET on-resistance Low side FET on-resistance ILIM High side FET switch current-limit, TLV62080 Rising inductor current 1.6 2.8 4 A ILIM High side FET switch current-limit, TLV62084, TLV62084A Rising inductor current 2.3 2.8 4 A RDS(on) 6 Submit Documentation Feedback 0.5 0.438 nA 1 k ISW = 500 mA 120 m ISW = 500 mA 90 m Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 7.6 Typical Characteristics See Typical Application for characterization setup. space Table 1. Table of Graphs FIGURE Load current, VOUT = 0.9 V Figure 1 Load current, VOUT = 1.2 V Figure 2 Load current, VOUT = 2.5 V Figure 3 Input Voltage, VOUT = 0.9 V Figure 4 Input Voltage, VOUT = 2.5 V Figure 5 Load current, VOUT = 0.9 V Figure 6 Load current, VOUT = 2.5 V Figure 7 Switching Frequency Load current, VOUT = 2.5 V Figure 8 Efficiency 100 100 90 90 80 80 70 70 Efficiency (%) Efficiency (%) Output Voltage Accuracy 60 50 40 60 50 40 30 30 20 20 VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V 10 0 1E-5 0.0001 0.001 0.01 Output Current (A) 0.1 1 VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V 10 0 1E-5 2 0.0001 D001 VOUT = 0.9 V 0.001 0.01 Output Current (A) 0.1 1 2 D002 VOUT = 1.2 V Figure 1. Efficiency vs Load Current Figure 2. Efficiency vs Load Current 100 0.91 90 0.905 80 Output Voltage (V) Efficiency (%) 70 60 50 40 30 20 VIN = 3.6 V VIN = 4.2 V VIN = 5 V 10 0 1E-5 0.0001 0.001 0.01 Output Current (A) 0.1 VOUT = 2.5 V 1 0.9 0.895 IOUT = 10 mA, TA = 25qC IOUT = 1 A, TA = 25qC IOUT = 2 A, TA = 25qC IOUT = 10 mA, TA = 40qC IOUT = 1 A, TA = 40qC IOUT = 2 A, TA = 40qC IOUT = 10 mA, TA = 85qC IOUT = 1 A, TA = 85qC IOUT = 2 A, TA = 85qC 0.89 0.885 2 0.88 2.5 3 3.5 D003 4 4.5 Input Voltage (V) 5 5.5 6 D004 VOUT = 0.9 V Figure 3. Efficiency vs Load Current Figure 4. Output Voltage vs Input Voltage Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 7 TLV62080, TLV62084, TLV62084A www.ti.com 2.54 0.92 2.52 0.912 Output Voltage (V) Output Voltage (V) SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 2.5 2.48 IOUT = 10 mA, TA = 25qC IOUT = 1 A, TA = 25qC IOUT = 2 A, TA = 25qC IOUT = 10 mA, TA = 40qC IOUT = 1 A, TA = 40qC IOUT = 2 A, TA = 40qC IOUT = 10 mA, TA = 85qC IOUT = 1 A, TA = 85qC IOUT = 2 A, TA = 85qC 2.46 2.44 2.42 2.5 3 3.5 4 4.5 Input Voltage (V) 5 5.5 0.904 0.896 0.888 TA = 40qC TA = 25qC TA = 85qC 0.88 1E-5 6 D005 0.0001 1 2 D006 Figure 6. Output Voltage vs Load Current Figure 5. Output Voltage vs Input Voltage 2.54 Switching Frequency (MHz) 5 2.52 Output Voltage (V) 0.1 VIN = 3.6 V VOUT = 2.5 V 2.5 2.48 TA = 40qC TA = 25qC TA = 85qC 2.46 1E-5 0.0001 0.001 0.01 Output Current (A) 0.1 VIN = 3.6 V Submit Documentation Feedback 1 2 VIN = 3.3 V VIN = 4.2 V VIN = 5 V 4 3 2 1 0 0.2 0.4 0.6 D007 0.8 1 1.2 1.4 Output Current (A) 1.6 1.8 2 D008 VOUT = 2.5 V Figure 7. Output Voltage vs Load Current 8 0.001 0.01 Output Current (A) Figure 8. Switching Frequency vs Output Current Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 8 Detailed Description 8.1 Overview The TLV62080 and TLV62084x synchronous switched-mode converters are based on DCS-ControlTM. DCSControlTM is an advanced regulation topology that combines the advantages of hysteretic and voltage mode control. The DCS-ControlTM topology operates in PWM (pulse width modulation) mode for medium to heavy load conditions and in power save mode at light load currents. In PWM mode, the TLV6208x converter operates with the nominal switching frequency of 2 MHz, having a controlled frequency variation over the input voltage range. As the load current decreases, the converter enters power save mode, reducing the switching frequency and minimizing the IC quiescent current to achieve high efficiency over the entire load current range. DCS-ControlTM supports both operation modes (PWM and PFM) using a single building block with a seamless transition from PWM to power save mode without effects on the output voltage. The TLV62080 and TLV62084x devices offer both excellent DC voltage and superior load transient regulation, combined with very low output voltage ripple, minimizing interference with RF circuits. 8.2 Functional Block Diagram space PG VIN High Side N-MOS Power Good 50 Gate Driver Control Logic SW Low Side N-MOS Active Output Discharge Thermal Shutdown GND EN ramp Softstart comparator Under Voltage Shutdown error amplifier minimum on-timer DCS-CONTROL direct control & compensation TM VOS FB REF Copyright (c) 2016, Texas Instruments Incorporated space 8.3 Feature Description 8.3.1 100% Duty-Cycle Low-Dropout Operation The devices offer low input-to-output voltage difference by entering the 100% duty-cycle mode. In this mode the high-side MOSFET switch is constantly turned on and the low-side MOSFET is switched off. This mode is particularly useful in battery powered applications to achieve the longest operation time by taking full advantage of the whole battery voltage range. Equation 1 calculates the minimum input voltage to maintain regulation based on the load current and output voltage. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 9 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com Feature Description (continued) space VIN,MIN = VOUT + IOUT,MAX (RDS(on) + RL ) With: * * * * VIN,MIN = Minimum input voltage IOUT,MAX = Maximum output current RDS(on) = High-side FET on-resistance RL = Inductor ohmic resistance (1) space 8.3.2 Enabling and Disabling the Device The device is enabled by setting the EN input to a logic HIGH. Accordingly, a logic LOW disables the device. If the device is enabled, the internal power stage starts switching and regulates the output voltage to the programmed threshold. The EN input must be terminated and not left floating. 8.3.3 Output Discharge The output gets discharged through the SW terminal with a typical discharge resistor of RDIS whenever the device shuts down (by disable, thermal shutdown or UVLO). 8.3.4 Soft Start When EN is set to start device operation, the device starts switching after a delay of about 40 s and VOUT rises with a slope of about 10mV/s (See Figure 16 and Figure 17 for typical startup operation). Soft start avoids excessive inrush current and creates a smooth output voltage rise slope. Soft start also prevents excessive voltage drops of primary cells and rechargeable batteries with high internal impedance. If the output voltage is not reached within the soft start time, such as in the case of heavy load, the converter enters standard operation. Consequently, the inductor current limit operates as described in Inductor CurrentLimit. The TLV62080 and TLV62084x devices are able to start into a pre-biased output capacitor. The converter starts with the applied bias voltage and ramps the output voltage to the nominal value. 8.3.5 Power Good The TLV62080 and TLV62084x devices have a power-good output going low when the output voltage is below the nominal value. The power good maintains high impedance once the output is above 95% of the regulated voltage, and is driven to low once the output voltage falls below typically 90% of the regulated voltage. The PG terminal is an open drain output and is specified to sink typically up to 0.5 mA. The power good output requires a pull-up resistor which is recommended connecting to the device output. When the device is off because of disable, UVLO, or thermal shutdown, the PG terminal is at high impedance. TLV62084A features PG=Low in these cases. Table 2 and Table 3 show the different PG operation for the TLV6208x and TLV62084A. The PG output can be left floating if unused. space Table 2. Power Good Pin Logic Table (TLV62080/84) PG Logic Status Device Information Enable (EN=High) High Z VFB VPG VFB VPG Shutdown (EN=Low) UVLO 0.7V < VIN < VUVLO Thermal Shutdown TJ > TJSD Power Supply Removal VIN < 0.7V 10 Low Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 space Table 3. Power Good Pin Logic Table (TLV62084A) PG Logic Status Device Information Enable (EN=High) High Z VFB VPG Low VFB VPG Shutdown (EN=Low) UVLO 0.7V < VIN < VUVLO Thermal Shutdown TJ > TJSD Power Supply Removal VIN < 0.7V space The PG signal can be used for sequencing of multiple rails by connecting to the EN terminal of other converters. Leave the PG terminal unconnected when not in use. 8.3.6 Undervoltage Lockout To avoid misoperation of the device at low input voltages, an undervoltage lockout is implemented which shuts down the device at voltages lower than VUVLO with a VHYS_UVLO hysteresis. 8.3.7 Thermal Shutdown The device goes into thermal shutdown once the junction temperature exceeds typically TJSD. Once the device temperature falls below the threshold, the device returns to normal operation automatically. 8.3.8 Inductor Current-Limit The Inductor current-limit prevents the device from high inductor current and drawing excessive current from the battery or input voltage rail. Excessive current can occur with a shorted or saturated inductor, a heavy load, or shorted output circuit condition. The incorporated inductor peak-current limit measures the current during the high-side and low-side power MOSFET on-phase. Once the high-side switch current-limit is tripped, the high-side MOSFET is turned off and the low-side MOSFET is turned on to reduce the inductor current. When the inductor current drops down to the low-side switch current-limit, the low-side MOSFET is turned off and the high-side switch is turned on again. This operation repeats until the inductor current does not reach the high-side switch current-limit. Because of an internal propagation delay, the real current-limit value exceeds the static-current limit in the Electrical Characteristics table. 8.4 Device Functional Modes 8.4.1 Power Save Mode As the load current decreases, the TLV62080 and TLV62084x devices enter power save mode operation. During power save mode, the converter operates with a reduced switching frequency in PFM mode and with a minimum quiescent current maintaining high efficiency. Power save mode occurs when the inductor current becomes discontinuous. Operation in power save mode is based on a fixed on time architecture. The typical on time is given by ton = 400 ns x (VOUT / VIN). The switching frequency over the whole load current range is shown in Figure 8. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 11 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The devices are designed to operate from an input voltage supply range between 2.5 V (2.7 V for the TLV62084x devices) and 6 V with a maximum output current of 2 A (1.2 A for the TLV62080 device). The TLV6208x devices operate in PWM mode for medium to heavy load conditions and in power save mode at light load currents. In PWM mode the TLV6208x converters operate with the nominal switching frequency of 2 MHz which provides a controlled frequency variation over the input voltage range. As the load current decreases, the converter enters power save mode, reducing the switching frequency and minimizing the IC quiescent current to achieve high efficiency over the entire load current range. The WEBENCH software uses an iterative design procedure and accesses a comprehensive database of components when generating a design. See the Documentation Support section for additional documentation. 9.2 Typical Application POWER GOOD 2.7 V to 6 V PG VIN VIN R3 L1 SW EN + C3 VOUT TLV62084 C1 GND VOS GND FB R1 C2 R2 Copyright (c) 2016, Texas Instruments Incorporated Figure 9. Typical Application Schematic 9.2.1 Design Requirements Use the following typical application design procedure to select external components values for the TLV62084 device. Table 4. Design Parameters 12 DESIGN PARAMETERS EXAMPLE VALUES Input Voltage Range 2.8 V to 4.2 V Output Voltage 1.2 V Transient Response 5% VOUT Input Voltage Ripple 400 mV Output Voltage Ripple 30 mV Output Current Rating 2A Operating frequency 2 MHz Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 9.2.2 Detailed Design Procedure 9.2.2.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the TLV62080 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. Table 5. List of Components REFERENCE (1) MANUFACTURER (1) DESCRIPTION C1 10 F, Ceramic Capacitor, 6.3 V, X5R, size 0603 Std C2 22 F, Ceramic Capacitor, 6.3 V, X5R, size 0805, GRM21BR60J226ME39L Murata C3 47 F, Tantalum Capacitor, 8 V, 35 m, size 3528, T520B476M008ATE035 Kemet L1 1 H, Power Inductor, 2.2 A, size 3 mm x 3 mm x 1.2 mm, XFL3012-102MEB R1 65.3 k, Chip Resistor, 1/16 W, 1%, size 0603 Std R2 39.2 k, Chip Resistor, 1/16 W, 1%, size 0603 Std R3 178 k, Chip Resistor, 1/16 W, 1%, size 0603 Std Coilcraft See Third-party Products Disclaimer 9.2.2.2 Output Filter Design The inductor and the output capacitor together provide a low pass frequency filter. To simplify this process Table 6 outlines possible inductor and capacitor value combinations for the most application. Table 6. Matrix of Output Capacitor and Inductor Combinations L [H] (1) COUT [F] (1) 10 22 47 100 1 + + (2) (3) + + 2.2 + + + + 150 0.47 4.7 (1) (2) (3) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by +20% and -50%. Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by +20% and -30%. Plus signs (+) indicates recommended filter combinations. Filter combination in typical application. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 13 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 9.2.2.3 Inductor Selection The main parameter for the inductor selection is the inductor value and then the saturation current of the inductor. To calculate the maximum inductor current under static load conditions, Equation 2 is given. DI IL,MAX = IOUT,MAX + L 2 VOUT VIN DIL = VOUT L fSW 1- Where * * * * IOUT,MAX = Maximum output current IL = Inductor current ripple fSW = Switching frequency L = Inductor value (2) space TI recommends choosing the saturation current for the inductor 20% to approximately 30% higher than the IL,MAX, out of Equation 2. A higher inductor value is also useful to lower ripple current, but increases the transient response time as well. The following inductors are recommended to be used in designs (see Table 7). Table 7. List of Recommended Inductors INDUCTANCE [H] CURRENT RATING [mA] DIMENSIONS L x W x H [mm3] DC RESISTANCE [m typ] 1 2500 3 x 3 x 1.2 1 1650 (2) 3 x 3 x 1.2 2.2 2500 2.2 (1) (2) 1600 (2) TYPE MANUFACTURER (1) 35 XFL3012-102ME Coilcraft 40 LQH3NPN1R0NJ0 Murata 4 x 3.7 x 1.65 49 LQH44PN2R2MP0 Murata 3 x 3 x 1.2 81 XFL3012-222ME Coilcraft See Third-party Procucts Disclaimer Recommended for TLV62080 only due to limited current rating 9.2.2.4 Capacitor Selection The input capacitor is the low impedance energy source for the converter which helps to provide stable operation. A low ESR multilayer ceramic capacitor is recommended for best filtering and must be placed between VIN and GND as close as possible to those terminals. For most applications 10 F is sufficient though a larger value reduces input current ripple. The architecture of the TLV6208x device allows use of tiny ceramic-type output capacitors with low equivalentseries resistance (ESR). These capacitors provide low output voltage ripple and are recommended. To keep the resistance up to high frequencies and to get narrow capacitance variation with temperature, TI recommends use of the X7R or X5R dielectric. The TLV62080 and TLV62084x devices are designed to operate with an output capacitance of 10 to 100 F and beyond, as listed in Table 6. Load transient testing and measuring the bode plot are good ways to verify stability with larger capacitor values. Table 8. List of Recommended Capacitors CAPACITANCE [F] TYPE DIMENSIONS L x W x H [mm3] MANUFACTURER (1) 10 GRM188R60J106M 0603: 1.6 x 0.8 x 0.8 Murata 22 GRM188R60G226M 0603: 1.6 x 0.8 x 0.8 Murata 22 GRM21BR60J226M 0805: 2 x 1.2 x 1.25 Murata (1) See Third-party Products Disclaimer 14 Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 9.2.2.5 Setting the Output Voltage By selecting R1 and R2, the output voltage is programmed to the desired value. Use Equation 3 to calculate R1 and R2. POWER GOOD 2.7 V to 6 V VIN PG VIN 180 k 1 H SW EN VOUT TLV62084 10 F GND VOS GND FB R1 22 F R2 Copyright (c) 2016, Texas Instruments Incorporated Figure 10. Typical Application Circuit space R1 o R1 o ae ae VOUT = VFB c1 + / = 0.45 V c1 + / e R2 o e R2 o (3) For best accuracy, R2 must be kept smaller than 40 k to ensure that the current flowing through R2 is at least 100-times larger than IFB. Changing the sum towards a lower value increases the robustness against noise injection. Changing the sum towards higher values reduces the current consumption. 9.2.3 Application Curves SW (2 V/div) SW (2 V/div) VOUT (20 mV/div) VOUT (20 mV/div) I COIL (0.5 A/div) I COIL (0.2 A/div) Time (2 s/div) Time (200 ns/div) VIN = 3.3 V VOUT = 1.2 V ILOAD = 500 mA Figure 11. Typical Application (PWM Mode) VIN = 3.3 V VOUT = 1.2 V ILOAD = 10 mA Figure 12. Typical Application (PFM Mode) Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 15 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 1A LOAD (1 A/div) 50 mA LOAD (1A/div) VOUT (20 mV/div) VOUT (50mV/div) I COIL (1 A/div) I COIL (2A/div) Time (20 s/div) Time (50 s/div) L = 1 H VOUT = 1.2 V COUT = 22 F ILOAD = 50 mA to 1 A VIN = 3.3 V L = 1 H VOUT = 1.2 V VIN = 3.3 V Figure 14. Load Transient Figure 13. Load Transient 4.2 V VIN (1 V/div) COUT = 22 F ILOAD = 200 mA to 1.8 A EN (5 V/div) 3.3 V PG (1 V/div) VOUT (1 V/div) VOUT (50 mV/div) ICOIL (0.5 A/div) Time (20 s/div) Time (100 s/div) VIN = 3.3 to 4.2 V VOUT = 1.2 V ILOAD = 2.2 VIN = 3.3 V Figure 15. Line Transient 16 Submit Documentation Feedback VOUT = 1.2 V ILOAD = 2.2 Figure 16. Startup Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 EN (5 V/div) PG (1 V/div) VOUT (1 V/div) ICOIL (0.2 A/div) Time (20 s/div) VIN = 3.3 V VOUT = 1.2 V Figure 17. Startup (No Load) Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 17 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 10 Power Supply Recommendations The input power supply's output current needs to be rated according to the supply voltage, output voltage and output current of the TLV6208x. 11 Layout 11.1 Layout Guidelines The PCB layout is an important step to maintain the high performance of the TLV62080 and TLV62084x devices. * Place input and output capacitors, along with the inductor, as close as possible to the IC which keeps the traces short. Routing these traces direct and wide results in low trace resistance and low parasitic inductance. * Use a common-power GND. * Properly connect the low side of the input and output capacitors to the power GND to avoid a GND potential shift. * The sense traces connected to FB and VOS terminals are signal traces. Keep these traces away from SW nodes. * Use care to avoid noise induction. By a direct routing, parasitic inductance can be kept small. * Use GND layers for shielding if needed. 11.2 Layout Example space space space L1 VOUT PG VOS SW C1 VIN VIN GND FB GND EN GND C2 GND R1 R2 Figure 18. PCB Layout Suggestion 18 Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 11.3 Thermal Considerations Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below: * Improving the power dissipation capability of the PCB design. * Improving the thermal coupling of the component to the PCB by soldering the Thermal Pad. * Introducing airflow in the system. For more details on how to use the thermal parameters, see the Thermal Characteristics application notes SZZA017 and SPRA953. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 19 TLV62080, TLV62084, TLV62084A SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.1.2 Development Support 12.1.2.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the TLV62080 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 12.2 Documentation Support For related documentation see the following: * TLV62080EVM-756 User's Guide, TLV62080, 1.2-A, High-Efficiency, Step-Down Converter in 2-mm x 2-mm SON Package, SLVU640 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 9. Related Links PARTS PRODUCT FOLDER BUY NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TLV62080 Click here Click here Click here Click here Click here TLV62084 Click here Click here Click here Click here Click here TLV62084A Click here Click here Click here Click here Click here 12.4 Trademarks DCS-Control, E2E are trademarks of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 20 Submit Documentation Feedback Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A TLV62080, TLV62084, TLV62084A www.ti.com SLVSAK9H - OCTOBER 2011 - REVISED JANUARY 2017 12.6 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.7 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.8 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright (c) 2011-2017, Texas Instruments Incorporated Product Folder Links: TLV62080 TLV62084 TLV62084A Submit Documentation Feedback 21 PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TLV62080DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAU TLV62080DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAU TLV62084ADSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 14M TLV62084ADSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 14M TLV62084DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 SLO TLV62084DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 SLO (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2016 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.25 1.0 4.0 8.0 Q2 TLV62080DSGR WSON DSG 8 3000 178.0 8.4 TLV62080DSGR WSON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TLV62080DSGT WSON DSG 8 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 TLV62084ADSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TLV62084ADSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TLV62084DSGR WSON DSG 8 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 TLV62084DSGT WSON DSG 8 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2 Pack Materials-Page 1 2.25 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV62080DSGR WSON DSG 8 3000 205.0 200.0 33.0 TLV62080DSGR WSON DSG 8 3000 195.0 200.0 45.0 TLV62080DSGT WSON DSG 8 250 205.0 200.0 33.0 TLV62084ADSGR WSON DSG 8 3000 210.0 185.0 35.0 TLV62084ADSGT WSON DSG 8 250 210.0 185.0 35.0 TLV62084DSGR WSON DSG 8 3000 205.0 200.0 33.0 TLV62084DSGT WSON DSG 8 250 205.0 200.0 33.0 Pack Materials-Page 2 PACKAGE OUTLINE DSG0008A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD 2.1 1.9 A B PIN 1 INDEX AREA 2.1 1.9 0.3 0.2 0.4 0.2 OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD (0.2) TYP 0.9 0.1 5 4 6X 0.5 2X 1.5 SEE OPTIONAL TERMINAL 9 8 1 PIN 1 ID 1.6 0.1 8X 0.4 8X 0.2 0.3 0.2 0.1 0.05 C A B C 4218900/B 09/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) 8X (0.5) ( 0.2) VIA TYP 1 8 8X (0.25) (0.55) SYMM 9 (1.6) 6X (0.5) 5 4 SYMM (R0.05) TYP (1.9) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4218900/B 09/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.5) SYMM METAL 1 8 8X (0.25) (0.45) SYMM 9 (0.7) 6X (0.5) 5 4 (R0.05) TYP (0.9) (1.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X 4218900/B 09/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: TLV62084DSGT TLV62084DSGR