UC1825
UC2825
UC3825
SLUS235A - MARCH 1997 - REVISED MARCH 2004
BLOCK DIAGRAM
•Compatible with Voltage or Current Mode
Topologies
•Practical Operation Switching Frequencies
to 1MHz
•50ns Propagation Delay to Output
•High Current Dual Totem Pole Outputs
(1.5A Peak)
•Wide Bandwidth Error Amplifier
•Fully Latched Logic with Double Pulse
Suppression
•Pulse-by-Pulse Current Limiting
•Soft Start / Max. Duty Cycle Control
•Under-Voltage Lockout with Hysteresis
•Low Start Up Current (1.1mA)
The UC1825 family of PWM control ICs is optimized for high fre-
quency switched mode power supply applications. Particular care
was given to minimizing propagation delays through the comparators
and logic circuitry while maximizing bandwidth and slew rate of the
error amplifier. This controller is designed for use in either cur-
rent-mode or voltage mode systems with the capability for input volt-
age feed-forward.
Protection circuitry includes a current limit comparator with a 1V
threshold, a TTL compatible shutdown port, and a soft start pin
which will double as a maximum duty cycle clamp. The logic is fully
latched to provide jitter free operation and prohibit multiple pulses at
an output. An under-voltage lockout section with 800mV of hysteresis
assures low start up current. During under-voltage lockout, the out-
puts are high impedance.
These devices feature totem pole outputs designed to source and
sink high peak currents from capacitive loads, such as the gate of a
power MOSFET. The on state is designed as a high level.
High Speed PWM Controller
FEATURES DESCRIPTION
application
INFO
available
UDG-92030-2
2
UC1825
UC2825
UC3825
CONNECTION DIAGRAMS
DIL-16 (Top View)
J or N Package
SOIC-16 (Top View)
DW Package
PACKAGE PIN FUNCTION
FUNCTION PIN
N/C 1
INV 2
NI 3
E/A Out 4
Clock 5
N/C 6
RT7
CT8
Ramp 9
Soft Start 10
N/C 11
ILIM/SD 12
Gnd 13
Out A 14
Pwr Gnd 15
N/C 16
VC17
Out B 18
VCC 19
VREF 5.1V 20
PLCC-20 & LCC-20
(Top View)
Q & L Packages
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage (Pins 13, 15). . . . . . . . . . . . . . . . . . . . . . . . 30V
Output Current, Source or Sink (Pins 11, 14)
DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A
Pulse (0.5s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0A
Analog Inputs
(Pins 1, 2, 7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
(Pin 8, 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
Clock Output Current (Pin 4). . . . . . . . . . . . . . . . . . . . . . . -5mA
Error Amplifier Output Current (Pin 3) . . . . . . . . . . . . . . . . 5mA
Soft Start Sink Current (Pin 8) . . . . . . . . . . . . . . . . . . . . . 20mA
Oscillator Charging Current (Pin 5). . . . . . . . . . . . . . . . . . -5mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
Storage Temperature Range. . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . 300°C
Package QJA QJC
DIL-16J 80-120 28(2)
DIL-16N 90(1) 45
PLCC-20 43-75(1) 34
LCC-20 70-80 20(2)
SOIC-16 50-120(1) 35
THERMAL RATINGS TABLE
Q
Q
3
UC1825
UC2825
UC3825
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT= 3.65k, CT= 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TO.
UC1825 UC3825
PARAMETERS TEST CONDITIONS UC2825
MIN TOP MAX MIN TOP MAX UNITS
Reference Section
Output Voltage TO= 25°C, IO= 1mA 5.05 5.10 5.15 5.00 5.10 5.20 V
Line Regulation 10V < VCC < 30V 2 20 2 20 mV
Load Regulation 1mA < IO< 10mA 5 20 5 20 mV
Temperature Stability* TMIN < TA<TMAX 0.2 0.4 0.2 0.4 mV/°C
Total Output Variation* Line, Load, Temperature 5.00 5.20 4.95 5.25 V
Output Noise Voltage* 10Hz < f < 10kHz 50 50 µV
Long Term Stability* TJ= 125°C, 1000hrs. 5 25 5 25 mV
Short Circuit Current VREF = 0V -15 -50 -100 -15 -50 -100 mA
Oscillator Section
Initial Accuracy* TJ= 2°C 360 400 440 360 400 440 kHz
Voltage Stability* 10V < VCC < 30V 0.2 2 0.2 2 %
Temperature Stability* TMIN < TA<TMAX 55%
Total Variation* Line, Temperature 340 460 340 460 kHz
Oscillator Section (cont.)
Clock Out High 3.9 4.5 3.9 4.5 V
Clock Out Low 2.3 2.9 2.3 2.9 V
Ramp Peak*2.6 2.8 3.0 2.6 2.8 3.0 V
Ramp Valley*0.7 1.0 1.25 0.7 1.0 1.25 V
Ramp Valley to Peak*1.6 1.8 2.0 1.6 1.8 2.0 V
Error Amplifier Section
Input Offset Voltage 10 15 mV
Input Bias Current 0.6 3 0.6 3 µA
Input Offset Current 0.1 1 0.1 1 µA
Open Loop Gain 1V < VO< 4V 60 95 60 95 dB
CMRR 1.5V < VCM < 5.5V 75 95 75 95 dB
PSRR 10V < VCC < 30V 85 110 85 110 dB
Output Sink Current VPIN 3 = 1V 1 2.5 1 2.5 mA
Output Source Current VPIN 3 = 4V -0.5 -1.3 -0.5 -1.3 mA
Output High Voltage IPIN 3 = -0.5mA 4.0 4.7 5.0 4.0 4.7 5.0 V
Output Low Voltage IPIN 3 = 1mA 0 0 .5 1.0 0 0.5 1.0 V
Unity Gain Bandwidth*3 5.5 3 5.5 MHz
Slew Rate*6 12 6 12 V/µs
4
UC1825
UC2825
UC3825
UC1825 UC3825
PARAMETERS TEST CONDITIONS UC2825
MIN TOP MAX MIN TOP MAX UNITS
PWM Comparator Section
Pin 7 Bias Current VPIN 7 = 0V -1 -5 -1 -5 µA
Duty Cycle Range 0 80 0 85 %
Pin 3 Zero DC Threshold VPIN 7 = 0V 1.1 1.25 1.1 1.25 V
Delay to Output*50 80 50 80 ns
Soft-Start Section
Charge Current VPIN 8 = 0.5V 3 9 20 3 9 20 µA
Discharge Current VPIN 8 = 1V 1 1 mA
Current Limit / Shutdown Section
Pin 9 Bias Current 0 < VPIN 9 < 4V 15 10 µA
Current Limit Threshold 0.9 1.0 1.1 0.9 1.0 1.1 V
Shutdown Threshold 1.25 1.40 1.55 1.25 1.40 1.55 V
Delay to Output 50 80 50 80 ns
Output Section
Output Low Level IOUT = 20mA 0.25 0.40 0.25 0.40 V
IOUT = 200mA 1.2 2.2 1.2 2.2 V
Output High Level IOUT = -20mA 13.0 13.5 13.0 13.5 V
IOUT = -200mA 12.0 13.0 12.0 13.0 V
Collector Leakage VC= 30V 100 500 10 500 µA
Rise/Fall Time*CL = 1nF 30 60 30 60 ns
Under-Voltage Lockout Section
Start Threshold 8.8 9.2 9.6 8.8 9.2 9.6 V
UVLO Hysteresis 0.4 0.8 1.2 0.4 0.8 1.2 V
Supply Current Section
Start Up Current VCC = 8V 1.1 2.5 1.1 2.5 mA
ICC VPIN 1, VPIN 7, VPIN 9 = 0V; VPIN 2 = 1V 22 33 22 33 mA
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT= 3.65k, CT= 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TJ.
5
UC1825
UC2825
UC3825
High speed circuits demand careful attention to layout
and component placement. To assure proper perfor-
mance of the UC1825 follow these rules: 1) Use a ground
plane. 2) Damp or clamp parasitic inductive kick energy
from the gate of driven MOSFETs. Do not allow the out-
put pins to ring below ground. A series gate resistor or a
shunt 1 Amp Schottky diode at the output pin will serve
this purpose. 3) Bypass VCC,VC, and VREF. Use 0.1µF
monolithic ceramic capacitors with low equivalent series
inductance. Allow less than 1 cm of total lead length for
each capacitor between the bypassed pin and the ground
plane. 4) Treat the timing capacitor, CT, like a bypass ca-
pacitor.
Open Loop Frequency Response Unity Gain Slew Rate
Simplified Schematic
Error Amplifier Circuit
PWM Applications
Conventional (Voltage Mode) Current-Mode
Printed Circuit Board Layout Considerations
6
UC1825
UC2825
UC3825
Oscillator Circuit
Timing Resistance vs Frequency
80
100
120
140
160
10k 100k
470pF
1.0nF
1M
FREQ (Hz)
T (ns)
D
Deadtime vs Frequency
Synchronized Operation
Two Units in Close Proximity Generalized Synchronization
µ
Deadtime vs CT(3k RT100k)
7
UC1825
UC2825
UC3825
Forward Technique for Off-Line Voltage Mode Application
Constant Volt-Second Clamp Circuit
The circuit shown here will achieve a constant
volt-second product clamp over varying input voltages.
The ramp generator components, RTand CRare cho-
sen so that the ramp at Pin 9 crosses the 1V threshold
at the same time the desired maximum volt-second
product is reached. The delay through the functional
nor block must be such that the ramp capacitor can be
completely discharged during the minimum deadtime.
Output Section
Simplified Schematic Rise/Fall Time (CL=1nF)
Rise/Fall Time (CL=10nF) Saturation Curves
8
UC1825
UC2825
UC3825
Open Loop Laboratory Test Fixture
UDG-92032-2
This test fixture is useful for exercising many of the
UC1825’s functions and measuring their specifications. As with any wideband circuit, careful grounding and by-
pass procedures should be followed. The use of a
ground plane is highly recommended.
Design Example: 50W, 48V to 5V DC to DC Converter - 1.5MHz Clock Frequency
UDG-92033-3
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-87681012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8768101EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
5962-8768101QFA ACTIVE CFP W 16 1 TBD Call TI Call TI
UC1825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1825J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1825L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1825L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1825W883B ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
UC2825DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2825DW/1 PREVIEW SOIC DW 16 TBD Call TI Call TI
UC2825DW/1G4 PREVIEW SOIC DW 16 TBD Call TI Call TI
UC2825DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2825DWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2825DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC2825N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2825NG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2825Q ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2825QG3 ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2825QTR ACTIVE PLCC FN 20 TBD Call TI Call TI
UC2825QTRG3 ACTIVE PLCC FN 20 TBD Call TI Call TI
UC3825DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC3825DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3825DWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3825DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC3825N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3825NG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3825Q ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3825QG3 ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3825QTR ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3825QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1825, UC2825, UC2825M, UC3825, UC3825M :
•Catalog: UC3825, UC2825, UC3825M, UC3825
•Military: UC2825M, UC1825
•Space: UC1825-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2825DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
UC3825DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
UC3825QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2825DWTR SOIC DW 16 2000 367.0 367.0 38.0
UC3825DWTR SOIC DW 16 2000 367.0 367.0 38.0
UC3825QTR PLCC FN 20 1000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
MECHANICAL DATA
MPLC004A – OCTOBER 1994
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
4040005/B 03/95
20 PIN SHOWN
0.026 (0,66)
0.032 (0,81)
D2/E2
0.020 (0,51) MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D2/E2
0.013 (0,33)
0.021 (0,53)
Seating Plane
MAX
D2/E2
0.219 (5,56)
0.169 (4,29)
0.319 (8,10)
0.469 (11,91)
0.569 (14,45)
0.369 (9,37)
MAX
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.008 (0,20) NOM
1.158 (29,41)
0.958 (24,33)
0.756 (19,20)
0.191 (4,85)
0.141 (3,58)
MIN
0.441 (11,20)
0.541 (13,74)
0.291 (7,39)
0.341 (8,66)
18
19
14
13
D
D1
13
9
E1E
4
8
MINMAXMIN
PINS
**
20
28
44
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
52
68
84 1.185 (30,10)
0.985 (25,02)
0.785 (19,94)
D/E
0.395 (10,03)
0.495 (12,57)
1.195 (30,35)
0.995 (25,27)
0.695 (17,65)
0.795 (20,19)
NO. OF D1/E1
0.350 (8,89)
0.450 (11,43)
1.150 (29,21)
0.950 (24,13)
0.650 (16,51)
0.750 (19,05)
0.004 (0,10)
M
0.007 (0,18)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
