
FAST RECOVERY
Io : 6.0 Amperes
* High case dielectric strength
* High surge current capability
* High reliability
* Low reverse current
* Low forward voltage drop
* Fast switching for high efficiency
* Ideal for printed circuit board
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-O rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
* Weight : 3.6 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOL
UNIT
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 Volts
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 Volts
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 Volts
Maximum Average Forward Current Tc = 50 °CIF(AV) 6.0 Amps.
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method) IFSM 150 Amps.
Current Squared Time at t < 8.3 ms.
2
64
2
Maximum Forward Voltage drop per Diode at IF = 3.0 Amps. VF1.3 Volts
Maximum DC Reverse Current Ta = 25 °CIR10 µA
at Rated DC Blocking Voltage Ta = 100 °CIR(H) 1.0 mA
Maximum Reverse Recovery Time (Note 1) Trr 150 250 500 ns
Typical Thermal Resistance per diode (Note 2) RθJC 8°C/W
Operating Junction Temperature Range TJ - 50 to + 150 °C
Storage Temperature Range TSTG - 50 to + 150 °C
= 1 Amp., Irr = 0.25 Amp.
2 ) Thermal resistance from Junction to Case with units mounted on a 6" x 5.5" x0.11" ( 15 x 14 x 0.3 cm ) Al. plate.
UPDATE : APRIL 21, 1998
RATING
φ0.158 (4.00)
0.142 (3.60)
BR6
AC
0.127 (3.20)
0.047 (1.20)
+AC
0.62 (15.75)
0.58 (14.73)
0.042 (1.06)
0.038 (0.96)
0.445 (11.30)
0.405 (10.30)
0.27 (6.90)
0.23 (5.80)
0.75 (19.1)
Min.
Dimension in inches and (millimeters)