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FEATURES
DESCRIPTION/ORDERING INFORMATION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1A
1Y
1Z
G
2Z
2Y
2A
GND
VCC
4A
4Y
4Z
G
3Z
3Y
3A
D, DB, N, NS, J, OR W PACKAGE
(TOP VIEW)
192013 2
17
18
16
15
14
1312119 10
5
4
6
7
8
4Y
4Z
NC
G
3Z
1Z
G
NC
2Z
2Y
1Y
1A
NC
V
4A
GND
NC
3A
3Y
2A
FK PACKAGE
(TOP VIEW)
CC
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
•Meets or Exceeds the Requirements of ANSITIA/EIA-422-B and ITU•Operates From a Single 5-V Supply•TTL Compatible
•Complementary Outputs•High Output Impedance in Power-OffConditions
•Complementary Output-Enable Inputs
The AM26LS31 is a quadruple complementary-outputline driver designed to meet the requirements of ANSITIA/EIA-422-B and ITU (formerly CCITT)Recommendation V.11. The 3-state outputs havehigh-current capability for driving balanced lines suchas twisted-pair or parallel-wire transmission lines, andthey are in the high-impedance state in the power-offcondition. The enable function is common to all fourdrivers and offers the choice of an active-high oractive-low enable (G, G) input. Low-power Schottkycircuitry reduces power consumption withoutsacrificing speed.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Tube AM26LS31CN AM26LS31CNTube AM26LS31CDSOIC – D AM26LS31C0°C to 70 °C Tape and reel AM26LS31CDRSOP – NS Tape and reel AM26LS31CNSR 26LS31SSOP – DB Tape and reel AM26LS31CDBR SA31CCDIP – J Tube AM26LS31MJB AM26LS31MJB–55 °C to 125 °C LCCC – FK Tube AM26LS31MFKB AM26LS31MFKBCFP – W Tube AM26LS31MWB AM26LS31MWB
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1979–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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1Z
1Y
G
G
1A
4
12
12
3
2Z
2Y
2A 76
5
3Z
3Y
3A 910
11
4Z
4Y
4A 15 14
13
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
FUNCTION TABLE
(1)
(EACH DRIVER)
ENABLES OUTPUTSINPUT
A
G G Y Z
H H X H LL H X L HH X L H LL X L L HX L H Z Z
(1) H = high level, L = low level,X = irrelevant,
Z = high impedance (off)
LOGIC DIAGRAM (POSITIVE LOGIC)
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22 kΩ
To Three Other Drivers
Common to All Four Drivers
GND
Enable G
Enable G
VCC
V
V
Output Y
9 Ω
Input A
22 kΩ
22 kΩ
All resistor values are nominal.
Output Z
9 Ω
Absolute Maximum Ratings
(1)
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
SCHEMATIC (EACH DRIVER)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
7 VV
I
Input voltage 7 VOutput off-state voltage 5.5 VD package 73DB package 82θ
JA
Package thermal impedance
(3)
°C/WN package 67NS package 64Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °CLead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential output voltage V
OD
, are with respect to network GND.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
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Recommended Operating Conditions
Electrical Characteristics
(1)
Switching Characteristics
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
MIN NOM MAX UNIT
AM26LS31C 4.75 5 5.25V
CC
Supply voltage VAM26LS31M 4.5 5 5.5V
IH
High-level input voltage 2 VV
IL
Low-level input voltage 0.8 VI
OH
High-level output current –20 mAI
OL
Low-level output current 20 mAAM26LS31C 0 70T
A
Operating free-air temperature °CAM26LS31M –55 125
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
IK
Input clamp voltage V
CC
= MIN, I
I
= –18 mA –1.5 VV
OH
High-level output voltage V
CC
= MIN, I
OH
= –20 mA 2.5 VV
OL
Low-level output voltage V
CC
= MIN, I
OL
= 20 mA 0.5 VV
O
= 0.5 V –20Off-state (high-impedance-state)
I
OZ
V
CC
= MIN, µAoutput current
V
O
= 2.5 V 20I
I
Input current at maximum input voltage V
CC
= MAX, V
I
= 7 V 0.1 mAI
IH
High-level input current V
CC
= MAX, V
I
= 2.7 V 20 µAI
IL
Low-level input current V
CC
= MAX, V
I
= 0.4 V –0.36 mAI
OS
Short-circuit output current
(3)
V
CC
= MAX –30 –150 mAI
CC
Supply current V
CC
= MAX, All outputs disabled 32 80 mA
(1) For C-suffix devices, V
CC
min = 4.75 V and V
CC
max = 5.25 V. For M-suffix devices, V
CC
min = 4.5 V and V
CC
max = 5.5 V.(2) All typical values are at V
CC
= 5 V and T
A
= 25 °C.(3) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.
V
CC
= 5 V (see Figure 1 )
T
A
= 25 °C AM26LS31MPARAMETER TEST CONDITIONS UNITMIN TYP MAX MIN MAX
Propagation delay time, low- tot
PLH
14 20 30high-level output
C
L
= 30 pF, S1 and S2 open nsPropagation delay time, high- tot
PHL
14 20 30low-level outputt
PZH
Output enable time to high level R
L
= 75 Ω25 40 60C
L
= 30 pF nst
PZL
Output enable time to low level R
L
= 180 Ω37 45 68t
PHZ
Output disable time from high level 21 30 45C
L
= 10 pF, S1 and S2 closed nst
PLZ
Output disable time from low level 23 35 53t
SKEW
Output-to-output skew C
L
= 30 pF, S1 and S2 open 1 6 9 ns
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PARAMETER MEASUREMENT INFORMATION
Waveform 1
(see Note E)
Output Z
Output Y
Input A
(see Notes B
and C)
VOL
VOH
VOL
VOH
3 V
tPHL
Skew Skew
tPLH
tPLH
tPHL
0 V
PROPAGATION DELAY TIMES AND SKEW TEST CIRCUIT
VCC
Test Point
S1
S2
75 Ω
180 Ω
CL
(see Note A)
From Output
Under Test
VOH
VOL
≈1.5 V
0 V
3 V
Enable G
Enable G
(see Note D)
S1 Open
S2 Closed
S1 Closed
S2 Open
tPZH
tPZL
tPHZ
tPLZ
S1 Closed
S2 Closed
0.5 V
≈0 V
≈4.5 V S1 Closed
S2 Closed
≈1.5 V
ENABLE AND DISABLE TIME WAVEFORMS
See Note D
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 15 ns, tf ≤ 6 ns.
C. When measuring propagation delay times and skew, switches S1 and S2 are open.
D. Each enable is tested separately.
E. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
1.3 V 1.3 V
1.5 V
1.5 V
1.5 V 1.5 V
Waveform 2
(see Note E)
0.5 V
1.5 V
1.5 V
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
Figure 1. Test Circuit and Voltage Waveforms
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TYPICAL CHARACTERISTICS
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
VCC = 5.25 V
VCC = 5 V
VCC = 4.75 V
Load = 470 Ω to GND
TA = 25°C
See Note A
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
VCC = 5 V
Load = 470 Ω to GND
See Note A
TA = 70°C
TA = 0°C
TA = 25°C
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
VI − Enable G Input Voltage − V
− Output Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
VO
VCC = 5.25 V
VCC = 5 V
VCC = 4.75 V
4
3
2
1
00 1 2 3
5
6
Load = 470 Ω to VCC
TA = 25°C
See Note B
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
TA = 25°C
TA = 0°C
TA = 70°C
− Output Voltage − VVO
4
3
2
1
00 1 2 3
5
6
VCC = 5 V
Load = 470 Ω to VCC
See Note B
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
Figure 2. Figure 3.
Figure 4. Figure 5.
A. The A input is connected to V
CC
during testing of the Y outputs and to ground during testing of the Z outputs.B. The A input is connected to ground during testing of the Y outputs and to V
CC
during testing of the Z outputs.
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− High-Level Output Voltage − V
TA − Free-Air Temperature − °C
IOH = −20 mA
IOH = −40 mA
HIGH-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
VOH
VCC = 5 V
See Note A
4
3
2
1
00 25 50 75
5
IOH − High-Level Output Current − mA
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
VCC = 5.25 V
VCC = 4.75 V
VCC = 5 V
TA = 25°C
See Note A
− High-Level Output Voltage − V
VOH
4
3
2
1
00 −20 −40 −60 −80 −100
− Low-Level Output Voltage − V
TA − Free-Air Temperature − °C
VCC = 5 V
IOL = 40 mA
See Note B
LOW-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
VOL
0.4
0.3
0.2
0.1
025 50 75
0.5
0
IOL − Low-Level Output Current − mA
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
VCC = 5.25 V
VCC = 4.75 V
TA = 25°C
See Note B
− Low-Level Output Voltage − VVOL
0.4
0.3
0.2
0.1
040 80 120
0.5
0 1006020
0.6
0.7
0.8
0.9
1
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Figure 6. Figure 7.
Figure 8. Figure 9.
A. The A input is connected to V
CC
during testing of the Y outputs and to ground during testing of the Z outputs.B. The A input is connected to ground during testing of the Y outputs and to V
CC
during testing of the Z outputs.
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VCC = 5 V
VI − Data Input Voltage − V
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE
VCC = 4.75 V
No Load
TA = 25°C
VCC = 5.25 V
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
5
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE
TA = 25°C
No Load
TA = 0°C
TA = 70°C
VI − Data Input Voltage − V
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
5
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I – JANUARY 1979 – REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Figure 10. Figure 11.
8
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PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-7802301M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
7802301M2A
AM26LS31
MFKB
5962-7802301MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME
A
AM26LS31MJB
5962-7802301MFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF
A
AM26LS31MWB
5962-7802301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-
7802301Q2A
AM26LS31M
AM26LS31-W ACTIVE WAFERSALE YS 0 3921 TBD Call TI Call TI
AM26LS31CD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C
AM26LS31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C
AM26LS31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C
AM26LS31CDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
AM26LS31CN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
AM26LS31CNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN
AM26LS31CNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26LS31
AM26LS31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26LS31
AM26LS31MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
7802301M2A
AM26LS31
MFKB
AM26LS31MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME
A
AM26LS31MJB
AM26LS31MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF
A
AM26LS31MWB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 3
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26LS31, AM26LS31M :
•Catalog: AM26LS31
•Military: AM26LS31M
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
AM26LS31CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26LS31CDBR SSOP DB 16 2000 367.0 367.0 38.0
AM26LS31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26LS31CDR SOIC D 16 2500 367.0 367.0 38.0
AM26LS31CDRG4 SOIC D 16 2500 367.0 367.0 38.0
AM26LS31CDRG4 SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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