MMSZ5243BT3 - ON Semiconductor

 Semiconductor Components Industries, LLC, 2003

January, 2003 - Rev. 3 1Publication Order Number:

MMSZ5221BT1/D

MMSZ5221BT1 Series

Zener Voltage Regulators

500 mW SOD-123 Surface Mount

Three complete series of Zener diodes are offered in the convenient,

surface mount plastic SOD-123 package. These devices provide a

convenient alternative to the leadless 34-package style.

Specification Features:

•500 mW Rating on FR-4 or FR-5 Board

•Wide Zener Reverse Voltage Range - 2.4 V to 110 V

•Package Designed for Optimal Automated Board Assembly

•Small Package Size for High Density Applications

•General Purpose, Medium Current

•ESD Rating of Class 3 (>16 KV) per Human Body Model

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL94 V-0

MAXIMUM RATINGS

Rating Symbol Max Unit

Total Power Dissipation on FR-5 Board,

(Note 1) @ TL = 75°C

Derated above 75°C

PD500

6.7 mW

mW/°C

Thermal Resistance -

Junction to Ambient (Note 2) RJA 340 °C/W

Thermal Resistance -

Junction to Lead (Note 2) RJL 150 °C/W

Junction and Storage

Temperature Range TJ, Tstg -55 to +150 °C

1. FR-5 = 3.5 X 1.5 inches, using the On minimum recommended footprint

2. Thermal Resistance measurement obtained via infrared Scan Method

Device Package Shipping

ORDERING INFORMATION

SOD-123

CASE 425

STYLE 1

Cathode 2

Anode

MMSZ52xxBT1 SOD-123 3000/Tape & Reel

MARKING DIAGRAM

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

DEVICE MARKING INFORMATION

xx = Specific Device Code

M = Date Code

xx M

†The “T1” suffix refers to an 8 mm, 7 inch reel.

The “T3” suffix refers to an 8 mm, 13 inch reel.

Devices listed in

bold, italic

are ON Semiconductor

Preferred devices. Preferred devices are recommended

choices for future use and best overall value.

ÂÂ

MMSZ52xxBT3 SOD-123 10,000/Tape & Reel

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MMSZ5221BT1 Series

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless

otherwise noted, VF = 0.95 V Max. @ IF = 10 mA)

Symbol Parameter

VZReverse Zener Voltage @ IZT

IZT Reverse Current

ZZT Maximum Zener Impedance @ IZT

IZK Reverse Current

ZZK Maximum Zener Impedance @ IZK

IRReverse Leakage Current @ VR

VRReverse Voltage

IFForward Current

VFForward Voltage @ IFZener Voltage Regulator

IZT

VZVF

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA)

Zener Voltage (Notes 3 and 4) Zener Impedance (Note 5) Leakage Current

Device

VZ (Volts) @ IZT ZZT @ IZT ZZK @ IZK IR @ VR

Device

Marking Min Nom Max mA   mA A Volts

MMSZ5221BT1 C1 2.28 2.4 2.52 20 30 1200 0.25 100 1

MMSZ5222BT1 C2 2.38 2.5 2.63 20 30 1250 0.25 100 1

MMSZ5223BT1 C3 2.57 2.7 2.84 20 30 1300 0.25 75 1

MMSZ5224BT1 C4 2.66 2.8 2.94 20 30 1400 0.25 75 1

MMSZ5225BT1 C5 2.85 3.0 3.15 20 29 1600 0.25 50 1

MMSZ5226BT1 D1 3.14 3.3 3.47 20 28 1600 0.25 25 1

MMSZ5227BT1 D2 3.42 3.6 3.78 20 24 1700 0.25 15 1

MMSZ5228BT1 D3 3.71 3.9 4.10 20 23 1900 0.25 10 1

MMSZ5229BT1 D4 4.09 4.3 4.52 20 22 2000 0.25 5 1

MMSZ5230BT1 D5 4.47 4.7 4.94 20 19 1900 0.25 5 2

MMSZ5231BT1 E1 4.85 5.1 5.36 20 17 1600 0.25 5 2

MMSZ5232BT1 E2 5.32 5.6 5.88 20 11 1600 0.25 5 3

MMSZ5233BT1 E3 5.70 6.0 6.30 20 7 1600 0.25 5 3.5

MMSZ5234BT1 E4 5.89 6.2 6.51 20 7 1000 0.25 5 4

MMSZ5235BT1 E5 6.46 6.8 7.14 20 5 750 0.25 3 5

MMSZ5236BT1 F1 7.13 7.5 7.88 20 6 500 0.25 3 6

MMSZ5237BT1 F2 7.79 8.2 8.61 20 8 500 0.25 3 6.5

MMSZ5238BT1 F3 8.27 8.7 9.14 20 8 600 0.25 3 6.5

MMSZ5239BT1 F4 8.65 9.1 9.56 20 10 600 0.25 3 7

MMSZ5240BT1 F5 9.50 10 10.50 20 17 600 0.25 3 8

MMSZ5241BT1 H1 10.45 11 11.55 20 22 600 0.25 2 8.4

MMSZ5242BT1 H2 11.40 12 12.60 20 30 600 0.25 1 9.1

MMSZ5243BT1 H3 12.35 13 13.65 9.5 13 600 0.25 0.5 9.9

MMSZ5244BT1 H4 13.30 14 14.70 9.0 15 600 0.25 0.1 10

MMSZ5245BT1 H5 14.25 15 15.75 8.5 16 600 0.25 0.1 11

MMSZ5246BT1 J1 15.20 16 16.80 7.8 17 600 0.25 0.1 12

MMSZ5247BT1 J2 16.15 17 17.85 7.4 19 600 0.25 0.1 13

MMSZ5248BT1 J3 17.10 18 18.90 7.0 21 600 0.25 0.1 14

MMSZ5250BT1 J5 19.00 20 21.00 6.2 25 600 0.25 0.1 15

MMSZ5251BT1 K1 20.90 22 23.10 5.6 29 600 0.25 0.1 17

MMSZ5252BT1 K2 22.80 24 25.20 5.2 33 600 0.25 0.1 18

MMSZ5253BT1 K3 23.75 25 26.25 5.0 35 600 0.25 0.1 19

MMSZ5254BT1 K4 25.65 27 28.35 4.6 41 600 0.25 0.1 21

MMSZ5255BT1 K5 26.60 28 29.40 4.5 44 600 0.25 0.1 21

MMSZ5256BT1 M1 28.50 30 31.50 4.2 49 600 0.25 0.1 23

MMSZ5257BT1 M2 31.35 33 34.65 3.8 58 700 0.25 0.1 25

MMSZ5258BT1 M3 34.20 36 37.80 3.4 70 700 0.25 0.1 27

MMSZ5259BT1 M4 37.05 39 40.95 3.2 80 800 0.25 0.1 30

MMSZ5260BT1 M5 40.85 43 45.15 3.0 93 900 0.25 0.1 33

MMSZ5261BT1 N1 44.65 47 49.35 2.7 105 1000 0.25 0.1 36

MMSZ5262BT1 N2 48.45 51 53.55 2.5 125 1100 0.25 0.1 39

MMSZ5263BT1 N3 53.20 56 58.80 2.2 150 1300 0.25 0.1 43

MMSZ5264BT1 N4 57.00 60 63.00 2.1 170 1400 0.25 0.1 46

MMSZ5265BT1 N5 58.90 62 65.10 2.0 185 1400 0.25 0.1 47

MMSZ5266BT1 P1 64.60 68 71.40 1.8 230 1600 0.25 0.1 52

MMSZ5267BT1 P2 71.25 75 78.75 1.7 270 1700 0.25 0.1 56

MMSZ5268BT1 P3 77.90 82 86.10 1.5 330 2000 0.25 0.1 62

MMSZ5269BT1 P4 82.65 87 91.35 1.4 370 2200 0.25 0.1 68

MMSZ5270BT1 P5 86.45 91 95.55 1.4 400 2300 0.25 0.1 69

MMSZ5272BT1 R2 104.5 110 115.5 1.1 750 3000 0.25 0.1 84

3. The type numbers shown have a standard tolerance of ±5% on the nominal Zener voltage.

4. Nominal Zener voltage is measured with the device junction in thermal equilibrium at TL = 30°C 1°C

5. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the ac current applied.

The specified limits are for IZ(AC) = 0.1 IZ(dc) with the AC frequency = 1 KHz.

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TYPICAL CHARACTERISTICS

VZ, NOMINAL ZENER VOLTAGE (V)

-3

-2

-1

12111098765432

Figure 1. Temperature Coefficients

(Temperature Range - 55°C to +150°C)

TYPICAL TC VALUES

FOR MMSZ5221BT1 SERIES

VZ @ IZT

100

110 100

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 2. Temperature Coefficients

(Temperature Range - 55°C to +150°C)

VZ @ IZT

1.2

1.0

0.8

0.6

0.4

0.2

01501251007550250 T, TEMPERATURE (°C)

Figure 3. Steady State Power Derating

PD versus TA

PD versus TL

0.1 PW, PULSE WIDTH (ms)

Figure 4. Maximum Nonrepetitive Surge Power

1 10 100 1000

1000

100

RECTANGULAR

WAVEFORM, TA = 25°C

100

VZ, NOMINAL ZENER VOLTAGE

Figure 5. Effect of Zener Voltage on

Zener Impedance

101

1000

100

TJ = 25°C

IZ(AC) = 0.1 IZ(DC)

f = 1 kHz

IZ = 1 mA

5 mA

20 mA

VF, FORWARD VOLTAGE (V)

Figure 6. Typical Forward Voltage

1.21.11.00.90.80.70.60.50.4

1000

100

75 V (MMSZ5267BT1)

91 V (MMSZ5270BT1)

150°C75°C 25°C 0°C

TYPICAL TC VALUES

FOR MMSZ5221BT1 SERIES

VZ, TEMPERATURE COEFFICIENT (mV/°C)

Ppk, PEAK SURGE POWER (WATTS)

ZZT, DYNAMIC IMPEDANCE ()

IF, FORWARD CURRENT (mA)

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TYPICAL CHARACTERISTICS

C, CAPACITANCE (pF)

100

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 7. Typical Capacitance

1000

100

1101

BIAS AT

50% OF VZ NOM

TA = 25°C

0 V BIAS

1 V BIAS

VZ, ZENER VOLTAGE (V)

100

0.1

0.01 1086420

TA = 25°C

VZ, ZENER VOLTAGE (V)

100

0.1

0.01 10 30 50 70 90

TA = 25°C

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 8. Typical Leakage Current

1000

100

0.1

0.01

0.001

0.0001

0.00001 80706050403020100

+150°C

+25°C

-55°C

Figure 9. Zener Voltage versus Zener Current

(VZ Up to 12 V) Figure 10. Zener Voltage versus Zener Current

(12 V to 91 V)

IR, LEAKAGE CURRENT (A)

IZ, ZENER CURRENT (mA)

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INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to ensure proper solder connection

interface between the board and the package.

The minimum recommended footprint for the SOD-123

is shown at the right.

The SOD-123 package can be used on existing surface

mount boards which have been designed for the leadless 34

package style. The footprint compatibility makes

conversion from leadless 34 to SOD-123 straightforward.

ÉÉÉÉ

inches

0.91

0.036

1.22

0.048

2.36

0.093

4.19

0.165

Figure 11. Minimum Recommended Footprint

SOD-123 POWER DISSIPATION

The power dissipation of the SOD-123 is a function of

the pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

determined by TJ(max), the maximum rated junction

temperature of the die, RJA, the thermal resistance from

the device junction to ambient; and the operating

temperature, TA. Using the values provided on the data

sheet for the SOD-123 package, PD can be calculated as

follows:

PD = TJ(max) - TA

RJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

into the equation for an ambient temperature TA of 25°C,

one can calculate the power dissipation of the device which

in this case is 0.37 watts.

PD = 150°C - 25°C

340°C/W = 0.37 watts

The 340°C/W for the SOD-123 package assumes using

recommended footprint shown on FR-4 glass epoxy printed

circuit board. Another alternative is to use a ceramic

substrate or an aluminum core board such as

Thermal Clad. By using an aluminum core board

material such as Thermal Clad, the power dissipation can

be doubled using the same footprint.

GENERAL SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied

during cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

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PACKAGE DIMENSIONS

SOD-123

CASE 425-04

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

STYLE 1:

PIN 1. CATHODE

2. ANODE

ÂÂÂÂ

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.055 0.071 1.40 1.80

B0.100 0.112 2.55 2.85

C0.037 0.053 0.95 1.35

D0.020 0.028 0.50 0.70

E0.01 −−− 0.25 −−−

H0.000 0.004 0.00 0.10

J−−− 0.006 −−− 0.15

K0.140 0.152 3.55 3.85

500 mW SOD-123

Zener Voltage Regulators - Surface Mounted

MMSZ5221BT1 Series

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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center

2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051

Phone: 81-3-5773-3850

Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local

Sales Representative.

MMSZ5221BT1/D

Thermal Clad is a registered trademark of the Bergquist Company

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