AN26011A
1Ver. CEB
zCellular Phone 800MHz / 450MHz Band Application
SIMPLIFIED APPLICATION
APPLICATIONS
FEATURES DESCRIPTION
LNA-IC for 800MHz / 450MHz Band Applications
AN26011A is LNA-IC for 800MHz / 450MHz Band
Applications.
Realizing high performance b y usi ng 0.18 µm SiGeC
Bi-CMOS process(fT= 90 GHz, fmax = 140 GHz).
Low Gain mode is available, controlled by integrated
CMOS logic circuit.
Achieving miniaturization b y us ing small size package.
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully respo nsible f or t h e incorpor ati o n o f t h e
above application circuit and information in the design of your
equipment.
•Low voltage operation +2.80 V typ.
•High gain 15.0 dB typ. fRX = 881.5 MHz
16.0 dB typ. fRX = 450 MHz
•Low noise figure 1.40 dB typ. fRX = 881.5 MHz
1.30 dB typ. fRX = 450 MHz
•Low distortion
(IIP3 +10 MHz offset)
+10.0 dBm typ. fRX = 881.5 MHz
+10.0 dBm typ. fRX= 450 MHz
•5 pin Plastic Small Surface Mount Package (SMINI Type)
MurataGJM0332C1E4R0BB01D4.0 pF0603C3
MurataLQPT03TN10NH0410 nH0603L3 MurataLQPT03TN12NH0412 nH0603L2
MurataGRM033B11C102KD011000 pF0603C1
MurataGRM033B30J104KE18
0.1 μF
0603C4
VendorPart NumberValueSizeComponents
MurataGJM0332C1E4R0BB01D4.0 pF0603C2
MurataLQPT03TN12NH0412 nH0603L1
C4
VCC
C1
OUT
IN GND
VCC
CNT
(Gain Control)
C3 L3
54
123
L2
L1 C2
50Ω
IN
50Ω
OUT
TOP VIEW
Publication date: M arch 2013
AN26011A
2Ver. CEB
ABSOLUTE MAXIMUM RATINGS
*4V– 0.3 to (VCC +0.3)CNT (Pin No.3)
—mA18ICC
Supply current
*2°C–40 to +125Tj
Operating junction temperature
*4V– 0.3 to (VCC +0.3)OUT (Pin No.5)
Input Voltage Range
*3V—IN (Pin No.1)
*2°C–55 to +125Tstg
Storage temperature
—V1500HBM (Human Body Model)ESD
NoteUnitRatingSymbolParameter
*2°C–20 to +70Topr
Operating ambient temperature
*1V3.6VCC
Supply voltage
Notes). This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.
This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated
recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2:Except for the operating ambient temperature, operating junction temperature and storage temperature,
all ratings are for Ta = 25°C.
*3:RF signal input pin. Do not apply DC. Do not apply more than 0 dBm to RF input.
*4:(Vcc + 0.3) V must not be exceeded 3.6 V.
0.066W0.12W833℃/WSSMINI-5DC
PD (Ta=70℃)PD (Ta=25℃)θJA
PACKAGE
POWER DISSIPATION RATING
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, supply
voltage, load and ambient temperature conditions to ensure that there is enough margin follo w the power and
the thermal design does not exceed the allo wable value.
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
RECOMMENDED OPERATING CONDITIONS
2.8
Typ.
2.65
Min.
*1V2.95VCC
Supply voltage range
NoteUnitMax.SymbolParameter
Note) *１: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation
AN26011A
3Ver. CEB
—μA100—
Current at CNT Pin.
Voltage at CNT Pin = 0 V
IcntLS
CNT current
(Low Gain mode)
—μA100—
VCC current at Low Gain mode.
No input signal
IccLS
Supply current
(Low Gain mode)
—μA355—
Current at CNT Pin.
Voltage at CNT Pin = 2.80 V
IcntHS
CNT current
(High Gain mode)
—V3.1—2.52—VIHS
CNT voltage
(High Gain mode)
DC electrical characteristics
—V0.30——VILS
CNT voltage
(Low Gain mode)
—mA14.511.5—
VCC current at High Gain mode.
No input signal
IccHS
Supply current
(High Gain mode)
Limits
Typ Unit
Max Note
Min
Condition SymbolParameter
ELECRTRICAL CHARACTERISTICS
Note) VCC = 2.80 V, Ta= 25 °C±2°C, un less otherwise specified.
Performance based on application circuit 1 on page 11.
LNA AC electrical characteristics ( Low Gain Mode )
—dBm—10.06.0
f1 = fRX + 10 MHz
f2 = fRX + 20 MHz
Input 2 signals (f1, f2)
IIP3S
IIP3
+10 MHz offset
—dB–1.5–3.0–5.0PRX = – 20 dBmGLSPower Gain LG
—dB17.015.013.0—GHSPower Gain HG
LNA AC electrical characteristics ( High Gain Mod e )
Limits
Typ Unit
Max Note
Min
Condition SymbolParameter
ELECRTRICAL CHARACTERISTICS (continued)
Note) Vcc = 2.80 V,
Ta = 25°C±2°C, fRX = 881.5 MHz, PRX = –30 dBm, CW unless otherwise specified.
Performance based on application circu it 1 on page 11.
AN26011A
4Ver. CEB
APPLICATION INFORMATION
REFERENCE VALUES FOR D E SIGN
Note) Vcc = 2.80 V
Ta = 25°C±2°C, fRXa = 869 MHz, 881.5 MHz, 894 MHz, PRXa = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 1 on page 11.
*1dB—7.55.5—S11HaInput Return Loss HG
*1dB—9.07.0—S22HaOutput Return Loss HG
*1dBm—10.06.0
f1 = fRXa – 10 MHz
f2 = fRXa – 20 MHz
Input 2 signals (f1, f2)
IIP3H2a
IIP3
–10 MHz offset HG
*1dBm—–6.0–10.0—IP1dBHaInput P1dB
*1dB–18.0–22.0——ISOHaReverse Isolation HG
*1dBm—20.017.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
PRXa = –15 dBm
Input 2 signals (f1, f2)
IIP3L1a
IIP3
+10 MHz offset LG
*1dB–1.5–3.0–5.0PRXa = –20 dBmGLaPower Gain LG
*1dB5.53.0——NFLaNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1dB—9.07.0—S11LaInput Return Loss LG
*1dB—7.55.5—S22LaOutput Return Loss LG
*1,*2dB2.1
1.5——NFHaNoise Figure HG
*1dBm—10.06.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
IIP3H1a
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB17.015.013.0—GHaPower Gain HG
*1dB–1.5–3.0–5.0—ISOLaReverse Isolation LG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
AN26011A
5Ver. CEB
*1dB—4.02.5—S11HbInput Return Loss HG
*1dB—7.55.5—S22HbOutput Return Loss HG
*1dBm—11.57.5
f1 = fRXa – 10 MHz
f2 = fRXa – 20 MHz
Input 2 signals (f1, f2)
IIP3H2b
IIP3
–10 MHz offset HG
*1dBm—–5.0–9.0—IP1dBHbInput P1dB
*1dB–18.0–22.0——ISOHbReverse Isolation HG
*1dBm—20.017.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
PRXa = –15 dBm
Input 2 signals (f1, f2)
IIP3L1b
IIP3
+10 MHz offset LG
*1dB–2.5–4.0–6.0PRXa = –20 dBmGLbPower Gain LG
*1dB6.54.0——NFLbNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1dB—5.02.5—S11LbInput Return Loss LG
*1dB—5.02.5—S22LbOutput Return Loss LG
*1,*2dB2.01.4——NFHbNoise Figure HG
*1dBm—11.57.5
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
IIP3H1b
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB16.014.012.0—GHbPower Gain HG
*1dB–2.5–4.0–6.0—ISOLbReverse Isol ation LG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.80 V
Ta = 25°C±2°C, fRXa = 869 MHz, 881.5 MHz, 894 MHz, PRXa = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 2 on page 11.
AN26011A
6Ver. CEB
*1dB—7.55.5—S11HcInput Return Loss HG
*1dB—7.55.0—S22HcOutput Return Loss HG
*1dBm—10.06.5
f1 = fRXb – 10 MHz
f2 = fRXb – 20 MHz
Input 2 signals (f1, f2)
IIP3H2c
IIP3
–10 MHz offset HG
*1dBm—–7.0–11.0—IP1dBHcInput P1dB
*1dB–20.0–24.0——ISOHcReverse Isolation HG
*1dBm—25.022.0
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
PRXb = –10 dBm
Input 2 signals (f1, f2)
IIP3L1c
IIP3
+10 MHz offset LG
*1dB–1.5–3.0–4.5PRXb = –20 dBmGLcPower Gain LG
*1dB5.03.0——NFLcNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1dB—10.08.5—S11LcInput Return Loss LG
*1dB—15.012.0—S22LcOutput Return Loss LG
*1,*2dB2.11.4——NFHcNoise Figure HG
*1dBm—10.06.5
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
Input 2 signals (f1, f2)
IIP3H1c
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB18.016.014.0—GHcPower Gain HG
*1dB–1.5–3.0–4.5—ISOLcReverse Isolation LG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.80 V
Ta = 25°C±2°C, fRXb = 440 MHz, 450 MHz, 460 MHz, PRXb = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 3 on page 12.
AN26011A
7Ver. CEB
*1μA455—
Current at CNT Pin
Voltage at CNT Pin = 2.80 V
IcntHT
CNT current
(High Gain mode)
*1mA15.511.5—
Vcccurrent at High Gain mode
No input signal
IccHT
Supply current
(High Gain mode)
*1μA200—
Vcccurrent at Low Gain mode
No input signal
IccLT
Supply current
(Low Gain mode)
*1μA200—
Current at CNT Pin
Voltage at CNT Pin = 0 V
IcntLT
CNT current
(Low Gain mode)
DC electrical characteristics
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.65 V to 2.95 V
Ta = -20°C to 70°C, CW unless otherwise specified.
Performance based on application circuit 1 on page 11.
AN26011A
8Ver. CEB
*1dBm—10.05.0
f1 = fRXa – 10 MHz
f2 = fRXa – 20 MHz
Input 2 signals (f1, f2)
IIP3H2Ta
IIP3
–10 MHz offset HG
*1dBm—–6.0–15.0—IP1dBHTaInput P1dB
*1dBm—20.015.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
PRXa = – 15 dBm
Input 2 signals (f1, f2)
IIP3LT1a
IIP3
+10 MHz offset LG
*1dB–1.0–3.0–5.5PRXa = – 20 dBmGLTaPower Gain LG
*1dB7.03.0——NFLTaNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1,*2dB2.41.5——NFHTaNoise Figure HG
*1dBm—10.05.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
IIP3H1Ta
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB18.015.012.0—GHTaPower Gain HG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.65 V to 2.95 V
Ta = -20°C to 70°C, fRXa = 869 MHz, 881.5 MHz, 894 MHz, PRXa = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 1 on page 11.
AN26011A
9Ver. CEB
*1dBm—11.56.5
f1 = fRXa – 10 MHz
f2 = fRXa – 20 MHz
Input 2 signals (f1, f2)
IIP3H2Tb
IIP3
–10 MHz offset HG
*1dBm—–5.0–14.0—IP1dBHTbInput P1dB
*1dBm—20.015.0
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
PRXa = –15 dBm
Input 2 signals (f1, f2)
IIP3LT1b
IIP3
+10 MHz offset LG
*1dB–2.0–4.0–6.5PRXa = –20 dBmGLTbPower Gain LG
*1dB8.04.0——NFLTbNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1,*2dB2.31.4——NFHTbNoise Figure HG
*1dBm—11.56.5
f1 = fRXa + 10 MHz
f2 = fRXa + 20 MHz
Input 2 signals (f1, f2)
IIP3H1Tb
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB17.014.011.0—GHTbPower Gain HG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.65 V to 2.95 V
Ta = -20°C to 70°C, fRXa = 869 MHz, 881.5 MHz, 894 MHz, PRXa = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 2 on page 11.
AN26011A
10 Ver. CEB
*1dBm—10.05.0
f1 = fRXb – 10 MHz
f2 = fRXb – 20 MHz
Input 2 signals (f1, f2)
IIP3H2Tc
IIP3
–10 MHz offset HG
*1dBm—–7.0–16.0—IP1dBHTcInput P1dB
*1dBm—25.020.0
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
PRXb = –10 dBm
Input 2 signals (f1, f2)
IIP3LT1c
IIP3
+10 MHz offset LG
*1dB–1.0–3.0–5.0PRXb = –20 dBmGLTcPower Gain LG
*1dB6.53.0——NFLTcNoise Figure LG
LNA AC electrical characteristics ( Low Gain Mode )
*1,*2dB2.41.4——NFHTcNoise Figure HG
*1dBm—10.05.0
f1 = fRXb + 10 MHz
f2 = fRXb + 20 MHz
Input 2 signals (f1, f2)
IIP3H1Tc
IIP3
+10 MHz offset HG
LNA AC electrical characteristics ( High Gain Mod e )
*1dB19.016.013.0—GHTcPower Gain HG
Reference values
Typ Unit
Max Note
Min
ConditionsSymbolParameter
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.1 dB) included.
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note) Vcc = 2.65 V to 2.95 V
Ta = -20°C to 70°C, fRXb = 440 MHz, 450 MHz, 460 MHz, PRXb = –30 dBm, CW unless otherwise specified.
Performance based on application circuit 3 on page 12.
AN26011A
11 Ver. CEB
APPLICATION INFORMATION (Continued)
APPLICATION CIRCUIT
[ Application Circuit 1 for 800 MHz Band ]
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully respo nsible f or t h e incorpor ati o n o f t h e
above application circuit and information in the design of your
equipment.
MurataGJM0332C1E4R0BB01D4.0 pF0603C3
MurataLQPT03TN10NH0410 nH0603L3 MurataLQPT03TN12NH0412 nH0603L2
MurataGRM033B11C102KD011000 pF0603C1
MurataGRM033B30J104KE18
0.1 μF
0603C4
VendorPart NumberValueSizeComponents
MurataGJM0332C1E4R0BB01D4.0 pF0603C2
MurataLQPT03TN12NH0412 nH0603L1
C4
VCC
C1
OUT
IN GND
VCC
CNT
(Gain Control)
C3 L3
54
123
L2
L1 C2
50Ω
IN
50Ω
OUT TOP VIEW
[ Application Circuit 2 for 800 MHz Band ]
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully respo nsible f or t h e incorpor ati o n o f t h e
above application circuit and information in the design of your
equipment.
MurataLQPT03TN10NH0410 nH0603L3 MurataLQPT03TN12NH0412 nH0603L2
MurataGRM033B11C102KD011000 pF0603C1
MurataGRM033B30J104KE18
0.1 μF
0603C3
VendorPart NumberValueSizeComponents
MurataGJM0332C1E4R0BB01D4.0 pF0603C2
MurataLQP03T56NJ0456 nH0603L1
C3
VCC
C1
OUT
IN GND
VCC
CNT
(Gain Control)
C2 L3
54
123
L2
L1 50Ω
IN
50Ω
OUT TOP VIEW
AN26011A
12 Ver. CEB
APPLICATION INFORMATION (Continued)
APPLICATION CIRCUIT (Continued)
[ Application Circuit 3 for 450 MHz Band ]
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully respo nsible f or t h e incorpor ati o n o f t h e
above application circuit and information in the design of your
equipment.
MurataGJM0332C1E4R5BB01D4.5 pF0603C3
MurataGRM033B30J104KE18
0.1 μF
0603C4
MurataGRM033B11C102KD011000 pF0603C2
PanasonicERJ2GEJ100X10 Ω1005R1
MurataLQP03T22NH0422 nH0603L2
PanasonicERJ2GEJ132X1.3 kΩ1005R2
PanasonicECJ0EC1H0R5C0.5 pF1005C5
VendorPart NumberValueSizeComponents
MurataGJM0334C1E2R0BB012.0 pF0603C1
MurataLQPT03TN12NH0412 nH0603L1
C4
VCC
C1
OUT
IN GND
VCC
CNT
(Gain Control)
C3 L2
54
123
R1
L1
C2
50Ω
IN
50Ω
OUT TOP VIEW
R2
C5
AN26011A
13 Ver. CEB
PIN FUNCTIONS
VCC
Power SupplyVCC4
High Gain / Low Gain switch
L: Low Gain Mode
H: High Gain Mode
InputCNT3
GNDGroundGND2 RF InputInputIN1
RF OutputOutputOUT5
DescriptionTypePin namePin No.
PIN CONFIGURATION Top View
FUNCTIONAL BL OCK DIAGRAM
OUT
IN GND
VCC
CNT
Logic
Gain Select
54
123
IN
GND
CNT
OUT
VCC
1
2
3
5
4
Top View
Notes) This circuit and these circuit constants show an example and do not guarantee the design as a mass-production set.
This block diagram is for explaining func tions. The part of the block diagram may be omitted, or it may be simplified.
AN26011A
14 Ver. CEB
PACKAGE INFORMATION ( Reference Data )
Unit:mm
Lead Finish Method : SnBi Plating
Lead Material : Cu Alloy
Body Material : Br / Sb Free
Epoxy Resin
0 to 0.05 0.55±0.05
(0.5)(0.5)
1.00 ±0.05
(7°)
1.60 ±0.05
0.20 +0.05
-0.02
1.20 ±0.05
1.60 ±0.05
0.13 +0.05
-0.02
(7°)
123
45
0.20±0.05
(0.27)
0.10
Package Code:SSMINI-5DC
AN26011A
15 Ver. CEB
IMPORTANT NOTICE
1.The products and prod uct specifications described in this book are subj ect to change without notice for
modification and/or improvement. At the final stage of your design, purchas ing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety inc luding the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right
owned by Panasonic Corpora tion or any other company. Therefore, no responsibility is assumed by our company
as to the infringement upon any such right owned by any other company which ma y arise as a result of the use of
technical information de-scri bed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment [ 880 MHz / 450 MHz Band Applications].
Consult our sales staff in advance for information on the following applicatio ns: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, air plan e, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsi ble for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special a pplication.
7.This LSI is neither designed nor intended for use in automotive app lications or environments unless t he specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regul ate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held
responsible for any damage incurred as a result of your using the LSI not compl yi ng with the applicable laws and
regulations.
AN26011A
16 Ver. CEB
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating enviro nment etc. ). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Other wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures o n the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-
board), it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent dam age due to short circuit
between pins. In addition, refer to the Pin Description for the pin configura t ion.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, p erform a full technica l
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
And, safety measures such as an installation of fuses are recommended because the e xtent of the above-
mentioned damage and smoke emission will depend on the current capability of the power supply.
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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