1. Product profile
1.1 General description
NPN/NPN Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD)
plastic packages.
1.2 Features and benefits
1.3 Applications
Low current peripheral driver
Control of IC inputs
Replaces general-purpose transistors in digital applications
1.4 Quick reference data
PEMH11; PUMH11
NPN/NPN resistor-equipped transistors;
R1 = 10 k, R2 = 10 k
Rev. 6 — 29 November 2011 Product data sheet
Table 1. Product overview
Type number Package NPN/PNP
complement PNP/PNP
complement Package
configuration
NXP JEITA
PEMH11 SOT666 - PEMD3 PEMB11 ultra small and flat lead
PUMH11 SOT363 SC-88 PUMD3 PUMB11 very small
100 mA output current capability Reduces component count
Built-in bias resistors Reduces pick and place costs
Simplifies circuit design AEC-Q101 qualified
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per transis tor
VCEO collector-emitter voltage open base - - 50 V
IOoutput current - - 100 mA
R1 bias resistor 1 (input) 7 10 13 k
R2/R1 b ias resis tor ratio 0.8 1 1.2
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 2 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
2. Pinning information
3. Ordering information
4. Marking
[1] * = placeholder for manufacturing site code.
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 GND (emitter) TR1
2 input (base) TR1
3 output (collector) TR2
4 GND (emitter) TR2
5 input (base) TR2
6 output (collector) TR1
001aab555
6 45
1 32
65 4
123
R2
TR1 TR2
R1
R2 R1
sym063
Table 4. Orderin g information
Type number Package
Name Description Version
PEMH11 - plastic surface-mounted package; 6 leads SOT666
PUMH11 SC-88 plastic surface-mounted package; 6 leads SOT363
Table 5. Marking codes
Type number Marking code[1]
PEMH11 H1
PUMH11 H*1
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 3 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transis tor
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 10 V
VIinput voltage
positive - +40 V
negative - 10 V
IOoutput current - 100 mA
ICM peak collector current - 100 mA
Ptot total power dissipation Tamb 25 C[1]
PEMH11 (SOT666) [2] -200mW
PUMH11 (SOT363) - 200 mW
Per device
Ptot total power dissipation Tamb 25 C[1]
PEMH11 (SOT666) [2] -300mW
PUMH11 (SOT363) - 300 mW
Tjjunction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 4 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve for SOT363 (SC-88) and SOT 666
Tamb (°C)
-75 17512525 75-25
006aac749
200
100
300
400
Ptot
(mW)
0
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Per transis tor
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
PEMH11 (SOT666) [2] --625K/W
PUMH11 (SOT363) - - 625 K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
PEMH11 (SOT666) [2] --417K/W
PUMH11 (SOT363) - - 417 K/W
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 5 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for
PEMH11 (SOT666); typical values
FR4 PCB, standard footprint
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for
PUMH11 (SOT363); typical values
006aac751
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33 0.2
0.1
0.05
0.02 0.01
0
006aac750
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33
0.2
0.1 0.05
0.02 0.01
0
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 6 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
7. Characteristics
[1] Characteristics of built-in transistor.
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transis tor
ICBO collector-base
cut-off current VCB =50V; I
E= 0 A - - 100 nA
ICEO collector-emitter
cut-off current VCE =30V; I
B=0A --1A
VCE =30V; I
B=0A;
Tj= 150 C--5A
IEBO emitter-base
cut-off current VEB =5V; I
C= 0 A - - 400 A
hFE DC current gain VCE =5V; I
C=5mA 30 - -
VCEsat collector-emitter
saturation voltage IC=10mA; I
B= 0.5 mA - - 150 mV
VI(off) off-state input
voltage VCE =5V; I
C=100A-1.10.8V
VI(on) on-state input
voltage VCE = 0.3 V; IC=10mA 2.5 1.8 - V
R1 bias resistor 1 (input) 7 10 13 k
R2/R1 bias resistor ratio 0.8 1 1.2
Cccollector capacitance VCB =10V; I
E=i
e=0A;
f=1MHz --2.5pF
fTtransition frequency VCB =5V; I
C=10mA;
f = 100 MHz [1] - 230 - MHz
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 7 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
VCE =5V
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =40 C
IC/IB=20
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =40 C
Fig 4. DC current gain as a function of collector
current; typical values Fig 5. Collector-emitter satura tio n volt ag e as a
function of collector current; typical values
VCE =0.3V
(1) Tamb =40 C
(2) Tamb =25C
(3) Tamb = 100 C
VCE =5V
(1) Tamb =40 C
(2) Tamb =25C
(3) Tamb = 100 C
Fig 6. On-state input voltage as a function of
collector current; typical valu es Fig 7. Off-state input voltage as a function of
collector current; typical values
IC (mA)
10-1 102
101
006aac768
102
10
103
hFE
1
(1)
(2)
(3)
IC (mA)
110
2
10
006aac769
10-1
1
VCEsat
(V)
10-2
(1)
(2)
(3)
006aac770
IC (mA)
10-1 102
101
1
10
VI(on)
(V)
10-1
(1)
(2)
(3)
IC (mA)
10-1 101
006aac771
1
10
VI(off)
(V)
10-1
(1)
(2)
(3)
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 8 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
f=1MHz; T
amb =25CV
CE =5V; T
amb =25C
Fig 8. Collector capacitance as a function of
collector-base voltage; typical values Fig 9. Transition frequency as a function of collector
current; typical values of built-in transistor
VCB (V)
0504020 3010
006aac772
1
2
3
Cc
(pF)
0
006aac757
IC (mA)
10-1 102
101
102
103
fT
(MHz)
10
Fig 10. Package outline PEMH11 (SOT666) Fig 11. Package outline PUMH11 (SOT363/SC-88)
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
06-03-16Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0 1.35
1.15
2.2
1.8 1.1
0.8
0.45
0.15
132
465
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 9 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
PEMH11 SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
PUMH11 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint PEMH11 (SOT666)
solder lands
placement area
occupied area
solder paste
sot666_fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.0750.538
Dimensions in mm
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 10 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
Fig 13. Reflow soldering footprint PUMH11 (SOT363/SC-88)
Fig 14. W ave soldering footprint PUMH1 1 (SOT363/SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35 0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
sot363_fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 11 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet statu s Change notice Supersedes
PEMH11_PUMH11 v.6 20111129 Product data sheet - PEMH11_PUMH11 v.5
Modifications: The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 1 “Product profile: updated
Section 4 “Marking: updated
Table 7 “Thermal characteristics: updated according to the latest measu r ements
Table 8 “Characteristics: ICEO updated according to the latest measurements, Vi(on) and
Vi(off) changed respectively to VI(on) and VI(off), fT added
Figure 1 to 9: added
Section 8 “Test information: added
Figure 10 and 11: replaced by minimized package outline drawings
Section 10 “Packing information: added
Section 11 “Soldering: added
Section 13 “Legal information: updated
PEMH11_PUMH11 v.5 20031020 Product data sheet - PUMH11 v.4
PEMH11 v.1
PUMH11 v.4 19990413 Product specification - -
PEMH11 v.1 20011022 Preliminary specification - -
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 12 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those descri bed in the
Product data sheet.
13.3 Disclaimers
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Notwithstanding any damages that customer might incur for any reason
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changes to information published in this document, including without
limitation specifications and product descriptions, at any time and with out
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NXP Semiconductors products in such equipment or applications and
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Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or cu stomer product
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damage, costs or problem which is based on any weakness or default in the
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Semiconductors products in order to avoid a default of the applications and
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customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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Export control — This document as well as the item(s) described herein
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Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PEMH11_PUMH11 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 29 November 2011 13 of 14
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PEMH11; PUMH11
NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 November 2011
Document identifier: PEMH11_PUMH11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Contact information. . . . . . . . . . . . . . . . . . . . . 13
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14