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August 2009

FSA2367 • Rev. 1.0.2

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

FSA2367 — Low RON (0.75) Triple-SPDT,

Negative-Swing Audio Source Switch

Features

 10µA Maximum ICCT Current Over Expanded

Control Voltage Range (VIN=2.6V, VCC=4.3V)

 On Capacitance 55pF Typical (CON)

 0.75Ω Typical On Resistance (RON)

 Common Ports 1A, 2A, 3A with Negative Swing

Audio to -2V

 -3db Bandwidth: >150 MHz

 Low Power Consumption (1µA Maximum)

 Power-Off Feature for 1A/2A/3A Pin (IIN < 2µA)

 Packaged in Pb-Free 14-Pin TSSOP and DQFN

Applications

 Cell Phone, PDA, Digital Camera, and Notebook

 LCD Monitor, TV, and Set-Top Box

Description

The FSA2367 is a triple Single-Pole Double-Throw

(SPDT) switch that multiplexes three sources of data or

audio under independent control pins. The FSA2367

has special circuitry on the 1A, 2A, 3A pins that allows a

power-off feature. With the VCC supply removed and a

voltage on the 1A/2A/3A pins, there is minimal leakage

current into the 1A/2A/3A data pins. In addition, the

FSA2367 also features very low quiescent current to

extend battery life. The low quiescent current allows

mobile handset applications direct interface with the

baseband processor general-purpose I/Os. Typical

applications involve switching in portables and

consumer applications such as cell phones, digital

cameras, and notebooks with hubs or controllers.

IMPORTANT NOTE:

For additional information, please contact

analogswitch@fairchildsemi.com.

Ordering Information

Part Number

Top Mark

Eco Status

Package

FSA2367BQX

2367

Green

14-Terminal Depopulated very thin Quad Flat-pack No leads

(DQFN) 2.5 x 3.0mm, JEDEC MO-241

FSA2367MTCX

FSA2367

RoHS

14-Lead Thin Shrink Small Outline Package (TSSOP), 4.4mm

Wide, JEDEC MO-153

For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.

Analog Symbol

S1

1B0

1B1 1A

S2

2B0

2B1 2A

S3

3B0

3B1 3A

FSA2367

Figure 1. Analog Symbol

FSA2367 • Rev. 1.0.2 2

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Pin Assignments

S2

2A

3A

S1

1A

2B0

3B0

3B1

1B1

2B1

1B0 VCC

GND

2

1

3

4

5

6

7

13

14

12

11

10

9

8S3

141

87

5

6 9

10

11

S1

3A

3B0

2B1

3B1

S2

Vcc

S3

GND

2

12

13

1B0

1B1

2A

2B0

1A

4

3

Figure 2. Pin Assignment TSSOP-14

(Top View)

Figure 3. Pad Assignment DQFN-14

(Top View)

Pin Descriptions

Pin Name

Description

S1, S2, S3

Switch Control Selects

1A, 2A, 3A

A Data Bus (Common)

1Bn, 2Bn, 3Bn

Multiplexed Source inputs

Truth Table

S1, S2, S3

Function

LOW

1B0=1A; 2B0=2A; 3B0=3A

HIGH

1B1=1A; 2B1=2A; 3B1=3A

FSA2367 • Rev. 1.0.2 3

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Conditions

Min.

Max.

Unit

VCC

Supply Voltages

-0.5

6.0

V

VSW

Switch I/O Voltage(1)

1Bn, 2Bn Pins

VCC-5.5V

VCC-0.3V

V

1A, 2A Pins

VCC-5.5V

VCC-0.3V

V

VCNTRL

Control Input Voltage(1)

S0, S1

-0.5

6.0

V

Input Clamp Diode Current

-50

mA

Switch I/O Current

Continuous

350

mA

Peak Switch Current

Pulsed at 1ms duration, <10% Duty Cycle

500

mA

PD

Power Dissipation at 85ºC

DQFN14 package

2.5

µW

TSSOP14 package

2.5

µW

TSTG

Storage Temperature Range

-65

+150

C

TJ

Maximum Junction Temperature

+150

C

TL

Lead Temperature

Soldering, 10 seconds

+260

C

ESD

Human Body Model

(JEDEC: JESD22-A114)

All Pins

5500

kV

I/O to GND

8000

VCC to GND

8000

Charged Device Model (JEDEC-JESD22-C101)

2000

kV

Note:

1. Input and output negative ratings may be exceeded if input and output diode current ratings are observed.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

VCC

Supply Voltages

2.7

4.3

V

VS0:S1

Control Input Voltage

0

VCC

V

VSW

Switch I/O Voltage

VCC -5.5

VCC-0.3

V

TA

Operating Temperature

-40

+85

ºC

JA

Thermal Resistance (free air)

145

ºC/W

FSA2367 • Rev. 1.0.2 4

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

DC Electrical Characteristics

All typical values are at 25°C unless otherwise specified.

Symbol

Parameter

Conditions

Vcc (V)

TA=- 40ºC to +85ºC

Unit

Min.

Typ.

Max.

Analog Signal Range

Vcc-

5.5

Vcc

V

VIK

Clamp Diode Voltage

IIN=-18mA

3.0

-1.2

V

VIH

Input Voltage High

2.7 to 3.6

1.2

V

3.6 to 4.3

1.5

VIL

Input Voltage Low

2.7 to 3.6

0.5

V

3.6 to 4.3

0.7

IIN

Control Input Leakage

VIN=0 to Vcc

4.3

±1

µA

IOFF

Power-Off Leakage Current

(Common Port Only 1A, 2A)

Common Port (1A,

2A), VSW=0 to 4.3V,

VCC=0V

0V

±10

µA

INO(0FF)

Off-Leakage Current of Port

1Bn, 2Bn

1Bn, 2Bn=0.5V,

VCC - 0.5V or Floating

1A, 2A=0.5V,

VCC – 0.5V

Figure 8

4.3

-250

10

250

nA

INC(0N)

On-Leakage Current of Port

1Bn, 2Bn

1Bn, 2Bn=Floating

1A, 2A=0.5V,

VCC – 0.5V

Figure 10

4.3

-250

10

250

nA

RON

Switch On Resistance(2)

1Bn or 2Bn=0V, 0.7V,

2.0V,2.7V,

ION=-100m

Figure 9

2.7

0.75

2.00



∆RON

Delta RON(3)

1Bn or 2Bn=0.7V ,

ION=-100mA

2.7

0.5



RFLAT(ON)

On Resistance Flatness(4)

1Bn or 2Bn=0V, 0.7V,

2.0V,2.7V,

ION=-100mA

2.7 to 4.3

0.23

0.40



ICC

Quiescent Supply Current

VSW=0 or VCC, IOUT=0

4.3

500

nA

ICCT

Increase in ICC Current per

Control Voltage and VCC

VCNTRL=2.6V

4.3

2.2

10.0

µA

VCNTRL=1.8V

4.3

6.5

15.0

Notes:

2. Measured by the voltage drop between the 1Bn (2Bn, 3Bn) and 1A (2A, 3A) pins at the indicated current through

the switch. On resistance is determined by the lower voltage on the two.

3. Guaranteed by characterization; not tested in production.

4. Flatness is defined as the difference between minimum and maximum on resistance over the specified range.

FSA2367 • Rev. 1.0.2 5

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

AC Electrical Characteristics

All typical values are for VCC=3.3V at 25°C unless otherwise specified.

Symbol

Parameter

Conditions

Vcc (V)

TA=- 40ºC to +85ºC

Unit

Min.

Typ.

Max.

tON

Turn-On Time, S to Output

VBn=1.5V, RL=50Ω,

CL=35pF

Figure 10, Figure 12

2.7 to 4.3

45

60

ns

tOFF

Turn-Off Time, S to Output

VBn=1.5V, RL=50Ω,

CL=35pF

Figure 10, Figure 12

2.7 to 4.3

25

45

ns

tPD

Propagation Delay(5)

RL=50Ω, CL=5pF

Figure 10, Figure 13

3.3

0.25

ns

tBBM

Break-Before-Make(5)

RL=50Ω, CL=35pF

VIN1=VIN2=VIN3=1.5V

Figure 11

2.7 to 4.3

1

6

ns

Q

Charge Injection

RGEN=0Ω, CL=100pF,

RL=OPEN; VGEN=0V

Figure 14

2.7 to 4.3

9

pC

OIRR

Off-Isolation

f=100 kHz, RL=50Ω

Figure 4, Figure 16

2.7 to 4.3

-70

dB

Xtalk

Non-Adjacent Channel

Crosstalk

f=100 kHz, RL=50Ω

Figure 5, Figure 17

2.7 to 4.3

-100

dB

THD

Total Harmonic Distortion

RL=600Ω, VSW=0.5Vpp, f=20

Hz to 20kHz

Figure 20

2.7 to 4.3

0.01

%

BW

-3db bandwidth

RL=50Ω, CL=0, 5pF

Figure 6, Figure 15

2.7 to 4.3

150

MHz

Note:

5. Guaranteed by characterization; not tested in production.

Capacitance

Symbol

Parameter

Conditions

TA=- 40ºC to +85ºC

Unit

Min.

Typ.

Max.

CIN

Control Pin Input Capacitance

VCC=0V

2.5

pF

CON

A/B On Capacitance

VCC=3.3, f=1MHz

Figure 19

55

COFFB

Port 1Bn, 2Bn,3Bn Off Capacitance

VCC=3.3, f=1MHz

Figure 18

16

COFFA

Port 1A, 2A,3A Off Capacitance

VCC=3.3, f=1MHz

Figure 18

20

FSA2367 • Rev. 1.0.2 6

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Typical Performance Characteristics

Freqency Response

-110

-90

-70

-50

-30

-10

0 1 10 100

Frequency (MHz)

Vcc = 3.3V

Off Isolation (dB)

Figure 4. Off Isolation VCC=3.3V, CL=0pF

Freqency Response

-125

-115

-105

-95

-85

-75

-65

-55

-45

-35

-25

-15

-5

0 1 10 100

Frequency (MHz)

VCC = 3.3V

Crosstalk (dB)

Figure 5. Non-Adjacent Crosstalk VCC=3.3, CL=0pF

FSA2367 • Rev. 1.0.2 7

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Typical Performance Characteristics (Continued)

Freqency Response

-8

-7

-6

-5

-4

-3

-2

-1

0110 100 1000

Frequency (MHz)

Bandwidth Characterization, Frequency Response at CL= 0pF,Vcc=3.3V

Gain (dB)

Figure 6. Bandwidth Characterization, Frequency Response at VCC=3.3V, CL=0pF

RON (Ohms)

0.00

0.20

0.40

0.60

0.80

1.00

RON

0.00 0.50 1.00 1.50 2.00 2.50 3.00

VIN

VCC = 2.7V

-40°C

25°C

85°C

Figure 7. On Resistance

FSA2367 • Rev. 1.0.2 8

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Test Diagrams

NC A

InA(OFF)

VIN

GND

VS1, S2, or S3 = 0 or VCC

**Each switch port is tested separately

InA(OFF)

1Bn,2Bn,or 3Bn1A, 2A, or 3A

ION

VON

RON= VON/ ION

GND

VIN

GND

VS1, S2, or S3 = 0 or VCC

Figure 8. Off Leakage

Figure 9. On Resistance

RLand CLare functions of the application

environment (see AC Tables for specific values)

CLincludes test fixture and stray capacitance

RL

CL

1Bn, 2Bn, or 3Bn 1A, 2A, or 3A

GND

VIN

GND VOUT

S1, S2, S3

L

Figure 10. AC Test Circuit Load

0.9*

VCC/2

tBBM

0V

VOUT

Input- VSel

0.9*

tRISE= 2.5ns

90%

10%

CL

1B0, 2B0, or 3B0

RL

1A, 2A, or 3A

GND

VIN1

GND VOUT

VIN2

GND

RLand CLare functions of the application

environment (see AC Tables for specific values)

CLincludes test fixture and stray capacitance

S1, S2, S3

--

VOUT

VCC

Figure 11. Break-Before-Make Interval Timing

FSA2367 • Rev. 1.0.2 9

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Test Diagrams (Continued)

tRISE= 2.5ns

GND

VCC 90% 90%

10%10%

tFALL = 2.5ns

VCC/2 VCC/2

Input- VSel

Output- VOUT90%

VOH

VOL tON tOFF

90%

-

--

tRISE = 2.5ns

GND

VCC 90%90%

10%10%

tFALL = 2.5ns

VCC /2 VCC /2

Input- VIN

Output- VOUT 50%50%

VOH

VOL tpLH tpHL

- VIN

Figure 12. Turn-On / Turn-Off Waveforms

Figure 13. Switch Propagation Delay Waveforms

Figure 14. Charge Injection Test (Q=VOUT * CL)

VOUT

GND

GND RT

GND

VS

RS

Network Analyzer

VS1, S2 S3

GND

RSand RTare functions of the application

environment (see AC Tables for specific values)

VIN

RT

V

VS1, S2 S3

Figure 15. Bandwidth

RSand RTare functions of the application

environment (see AC Tables for specific values

VOUT

GND

GND RT

GND

VS

RS

Network Analyzer

RT

GND

VS1, S2, or S3

GND

Off-Isolation = 20 Log (VOUT / VIN )

VIN

RT

VS

RS

RT

VIN

Figure 16. Channel Off Isolation

FSA2367 • Rev. 1.0.2 10

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Test Diagrams (Continued)

VOUT

GND

GND RT

GND

VS

RS

Network Analyzer

RT

GND

VS1, S2, S3

GND

NC

CROSSTALK = 20 Log (VOUT/ VIN )

VIN

RT

VS

RS

RT

VIN

Figure 17. Non-Adjacent Channel-to-Channel Crosstalk

VS1, S2, S3

1Bn, 2Bn, 3Bn, or nA

Capacitance

Meter

S1, S2, S3

1Bn, 2Bn, 3Bn, or nA

f = 1MHz

= 0 or VCC

Figure 18. Channel Off Capacitance

VS1, S2, S3

1Bn, 2Bn, 3Bn, or nA

Capacitance

Meter S1, S2, S3

f = 1MHz

1Bn, 2Bn, 

3Bn, or nA = 0 or VCC

Figure 19. Channel On Capacitance

S1, S2, S3

nBn

RL

nA 10nF

VGEN

RGEN

VCC

V

Figure 20. Total Harmonic Distortion

FSA2367 • Rev. 1.0.2 11

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Physical Dimensions

Figure 21. 14-Terminal Depopulated very thin Quad Flat-pack No leads (DQFN)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FSA2367 • Rev. 1.0.2 12

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

Physical Dimensions (Continued)

C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,

AND TIE BAR EXTRUSIONS

F. DRAWING FILE NAME: MTC14REV6

R0.09 min

12.00°TOP & BOTTOM

0.43 TYP

1.00

D. DIMENSIONING AND TOLERANCES PER ANSI

Y14.5M, 1982

R0.09min

E. LANDPATTERN STANDARD: SOP65P640X110-14M

0.65

6.10

1.65

0.45

A. CONFORMS TO JEDEC REGISTRATION MO-153,

VARIATION AB, REF NOTE 6

B. DIMENSIONS ARE IN MILLIMETERS

Figure 22. 4-Lead Thin Shrink Small Outline Package (TSSOP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FSA2367 • Rev. 1.0.2 13

FSA2367 Low RON (0.75) Triple-SPDT, Negative-Swing Audio Source Switch

www.onsemi.com

1

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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