LM185-1.2QML
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LM185-1.2QML Micropower Voltage Reference Diode
Check for Samples: LM185-1.2QML
1FEATURES DESCRIPTION
The LM185-1.2 is a micropower 2-terminal band-gap
2• Operating Current of 10μA to 20mA voltage regulator diodes. Operating over a 10μA to
• 1ΩMaximum Dynamic Impedance (Typical) 20mA current range, it features exceptionally low
• Low Temperature Coefficient dynamic impedance and good temperature stability.
On-chip trimming is used to provide tight voltage
• Radiation Qualified Option tolerance. Since the LM185-1.2 band-gap reference
– 100 krad uses only transistors and resistors, low noise and
– Low Dose Rate Tested at 10 mrad/s good long term stability result.
Careful design of the LM185-1.2 has made the device
exceptionally tolerant of capacitive loading, making it
easy to use in almost any reference application. The
wide dynamic operating range allows its use with
widely varying supplies with excellent regulation.
The extremely low power drain of the LM185-1.2
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life.
Further, the wide operating current allows it to
replace older references with a tighter tolerance part.
Connection Diagrams
Figure 1. LCCC Package Figure 2. TO Package – Bottom View
See Package Number NAJ0020A See Package Number NDU0002A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2014, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1
2
3
4
10
9
8
7
5 6
+VREF
NC
NC
NC
NC
NC
NC
NC
NC
V-
LM185-1.2QML
SNVS384B –OCTOBER 2005–REVISED JANUARY 2014
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Figure 3. CLGA Package
See Package Number NAC0010A
Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Reverse Current 30mA
Forward Current 10mA
Operating Temperature Range −55°C ≤TA≤+125°C
Maximum Junction Temperature (TJmax)(2) +150°C
Storage Temperature −55°C ≤TA≤+150°C
Lead Temperature (Soldering 10 CLGA 260°C
Seconds) TO package 300°C
20LD LCCC package 300°C
Thermal Resistance θJA TO (Still Air) 300°C/W
TO (500LF / Min Air Flow) 139°C/W
20LD LCCC (Still Air) 100°C/W
20LD LCCC (500LF / Min Air 73°C/W
Flow)
CLGA (Still Air) 194°C/W
CLGA (500LF / Min Air Flow) 128°C/W
θJC TO 57°C/W
20LD LCCC 25°C/W
CLGA 23°C/W
Package Weight (Typical) TO TBD
20LD LCCC TBD
CLGA 210mg
ESD Tolerance(3) 4KV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for
the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(3) Human body model, 1.5KΩin series with 100pF.
Quality Conformance Inspection
Table 1. Mil-Std-883, Method 5005 - Group A
Subgroup Description Temp °C
1 Static tests at 25
2 Static tests at 125
3 Static tests at -55
4 Dynamic tests at 25
5 Dynamic tests at 125
6 Dynamic tests at -55
7 Functional tests at 25
8A Functional tests at 125
8B Functional tests at -55
9 Switching tests at 25
10 Switching tests at 125
11 Switching tests at -55
12 Settling time at 25
13 Settling time at 125
14 Settling time at -55
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SNVS384B –OCTOBER 2005–REVISED JANUARY 2014
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LM185–1.2 Electrical Characteristics DC Parameters Sub-
Symbol Parameter Conditions Notes Min Max Units groups
VRef Reverse Breakdown Voltage IR= 10µA 1.223 1.247 V 1
IR= 20µA 1.205 1.26 V 2, 3
IR= 1mA 1.223 1.247 V 1
1.205 1.26 V 2, 3
IR= 20mA 1.223 1.247 V 1
1.205 1.26 V 2, 3
ΔVRef /ΔIRReverse Breakdown Voltage 10µA ≤IR≤1mA -1.0 1.0 mV 1
Change with Current 20µA ≤IR≤1mA -1.5 1.5 mV 2, 3
1mA ≤IR≤20mA -10.0 10.0 mV 1
-20.0 20.0 mV 2, 3
VFForward Bias Voltage IF= 2mA -1.0 -0.4 V 1
LM185–1.2 Electrical Characteristics DC Drift Parameters
Delta calculations performed on QMLV devices at group B, subgroup 5, unless otherwise specified on the IPI. Sub-
Symbol Parameter Conditions Notes Min Max Units groups
VRReverse Breakdown Voltage IR= 10µA -0.01 0.01 V 1
IR= 20mA -0.01 0.01 V 1
LM185BY–1.2 Electrical Characteristics DC Parameters Sub-
Symbol Parameter Conditions Notes Min Max Units groups
VRef Reverse Breakdown Voltage IR= 10µA 1.223 1.247 V 1
IR= 20µA 1.205 1.26 V 2, 3
IR= 1mA 1.223 1.247 V 1
1.205 1.26 V 2, 3
IR= 20mA 1.223 1.247 V 1
1.205 1.26 V 2, 3
ΔVRef /ΔIRReverse Breakdown Voltage 10µA ≤IR≤1mA -1.0 1.0 mV 1
Change with Current 20µA ≤IR≤1mA -1.5 1.5 mV 2, 3
1mA ≤IR≤20mA -10.0 10.0 mV 1
-20.0 20.0 mV 2, 3
VFForward Bias Voltage IF= 2mA -1.0 -0.4 V 1
TCTemperature Coefficient (1) 50 PPM/°C 2, 3
(1) The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between
the operating TMin & TMax, divided by (TMax −TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax −
TMin)
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SNVS384B –OCTOBER 2005–REVISED JANUARY 2014
LM185-1.2RLQV SMD 5962R8759461 Post 100 krad Electrical Characteristics DC Parameters(1)(2)
Sub-
Symbol Parameter Conditions Notes Min Max Units groups
ΔVRef Change in Reverse Breakdown IR= 10µA (3) -3 3 % 1
Voltage IR= 1mA (3) -3 3 % 1
IR= 20mA (3) -2.5 2.5 % 1
ΔVRef /ΔIRReverse Breakdown Voltage 10µA ≤IR≤1mA -15 15 mV 1
Change with Current 1mA ≤IR≤20mA -25 25 mV 1
VFForward Bias Voltage IF= 2mA -1.0 -0.4 V 1
(1) Radiation hardness assured (RHA) products are those with an "RLQV" suffix in the Texas Instruments' part number or those with an "R"
in the SMD number, following "5962".
(2) Testing and qualification for RHA products is done on a wafer level according to MIL-STD-883, Test Method 1019. Testing is performed
with a 1.5X overtest. To be rated at 100 krad(Si) units are tested to 150 krad(Si) with all parameters remaining inside the post 100 krad
Electrical DC test limits in this table. Interim test points are taken at 50, 75 and 100 krad(Si).
(3) Change from the 0 rad reading.
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Typical Performance Characteristics
Reverse Characteristics Reverse Characteristics
Figure 4. Figure 5.
Temperature Drift of 3
Forward Characteristics Representative Units
Figure 6. Figure 7.
Reverse Dynamic Impedance Reverse Dynamic Impedance
Figure 8. Figure 9.
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1.20
1.21
1.22
1.23
1.24
1.25
0 50 100 150
Reference Voltage (V)
Radiation Level (krad)
Low Dose Rate Biased
Low Dose Rate Unbiased
C002
1.20
1.21
1.22
1.23
1.24
1.25
0 50 100 150
Reference Voltage (V)
Radiation Level (krad)
Low Dose Rate Biased
Low Dose Rate Unbiased
C001
LM185-1.2QML
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SNVS384B –OCTOBER 2005–REVISED JANUARY 2014
Typical Performance Characteristics (continued)
Noise Voltage Filtered Output Noise
Figure 10. Figure 11.
Response Time
Figure 12. Figure 13. VRef Radiation Drift at IR= 10 µA
Figure 14. VRef Radiation Drift at IR= 20 mA
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Typical Applications
Figure 15. Wide Input Range Reference
Figure 16. Micropower Reference from 9V Battery
Figure 17. Reference from 1.5V Battery
*IQ≃30μA
Figure 18. Micropower* 5V Regulator
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METER THERMOMETERS
Calibration
1. Short LM385-1.2, adjust R3 for IOUT= temp at 1μA/°K
2. Remove short, adjust R2 for correct reading in centigrade
†IQat 1.3V≃500μA
IQat 1.6V≃2.4mA
Figure 21. 0°C−100°C Thermometer
*2N3638 or 2N2907 select for inverse HFE ≃5
†Select for operation at 1.3V
‡IQ≃600μA to 900μA
Figure 22. Lower Power Thermometer
Calibration
1. Short LM385-1.2, adjust R3 for IOUT= temp at 1.8μA/°K
2. Remove short, adjust R2 for correct reading in °F
Figure 23. 0°F−50°F Thermometer
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Calibration
1. Adjust R1 so that V1 = temp at 1mV/°K
2. Adjust V2 to 273.2mV
†IQfor 1.3V to 1.6V battery volt-
age = 50μA to 150μA
Typical supply current 50μA
Figure 24. Centigrade Thermometer
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 25. Micropower Thermocouple Cold Junction Compensator
Seebeck Voltage Voltage
Thermocouple R1 R2
Coefficient Across R1 Across R2
Type (Ω) (Ω)
(μV/°C) @ 25°C (mV) (mV)
J 52.3 523 1.24k 15.60 14.32
T 42.8 432 1k 12.77 11.78
K 40.8 412 953 12.17 11.17
S 6.4 63.4 150 1.908 1.766
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REVISION HISTORY SECTION
Released Revision Section Originator Changes
10/07/05 A New Release, Corporate format L. Lytle 2 MDS data sheets converted into one Corp.
data sheet format. MNLM185-1.2-X Rev 2A3
and MNLM185BY-1.2-X Rev 0B0 data sheets
will be archived.
03/27/13 A All Changed layout of National Data Sheet to TI
format
01/07/14 B Features, Electrical Characteristics, K. Kruckmeyer Added post irradiation test limits and typical
Typical Performance Characteristics radiation drift plots for radiation qualified option.
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PACKAGE OPTION ADDENDUM
www.ti.com 28-Jul-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8759401XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q
5962-8759401YA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG
-1.2/883 Q
5962-87594
01YA ACO
01YA >T
5962-8759405XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759405XA Q
5962R8759461VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 R8759461VXA Q
LM185BYH1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759405XA Q
LM185H-1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q
LM185H-1.2/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185-1.2 Q
LM185H-1.2RLQV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 R8759461VXA Q
LM185WG-1.2/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG
-1.2/883 Q
5962-87594
01YA ACO
01YA >T
LM185WG-1.2RLQV PREVIEW CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG
-1.2RLQV Q
(5962-87594, 5962R
87594)
(01VYA ACO, 61VYA
ACO)
01VYA >T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Jul-2017
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM185-1.2QML, LM185-1.2QML-SP :
•Military: LM185-1.2QML
•Space: LM185-1.2QML-SP
NOTE: Qualified Version Definitions:
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
MECHANICAL DATA
NAC0010A
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WG10A (Rev H)
MECHANICAL DATA
NDU0002A
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H02A (Rev F)
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