NT *R oH S CO M PL IA Features The SDM Series is currently available, although not recommended for new designs. Double contacts Low contact resistance Self-clean on contact area Vapor phase solderable, IR-reflow solderable Terminal plating by gold gives excellent results when soldering RoHS compliant* SDM Series Surface Mount DIP Switch Electrical Life ............2,000 operations min. per switch, 24 VDC, 25 mA Non-Switching Rating ......100 mA, 50 VDC Switching Rating ................25 mA, 24 VDC Contact Resistance (@ current 100mA) ........................50 milliohms max. at initial 100 milliohms max. after life test Insulation Resistance ........100 megohms min. at 500 15 VDC Dielectric Strength ............500 VDC/minute Capacitance ..................5 pF max. between adjacent closed switch Circuit ....................Single pole single throw Product Dimensions Physical Characteristics Base and Cover Materials ..UL94V-0 PPS plus glass fiber reinforced Color ................................................Black Actuator Materials ..............................Nylon plus glass fiber reinforced Color ................................................White Contact Materials ....................Alloy copper Terminal Materials ..............................Brass Contact Plating Materials ....3 micro inches gold plating over 40 micro inches nickel Terminal Plating Materials ....................Gold Soldering Process ............Vapor phase and IR-reflow soldering can be applied Standard Packaging ......IC tubes/all poles in the "off" position 2.00 0.25 DIA. (.079 .010) SDM Series A + 0.2 / - 0 (A + .008/-0) 1.55 0.05 (.061 .002) DIA. 2.00 0.15 (.079 .006) 2.0 (.079) 4.00 0.1 (.157 .004) 6.20 + 0.2 / -0 (.244 = .008/-0) 0.50 (.020) 3.0 + 0.10 / -0 (.118 + .004/-0) Environmental Characteristics Mechanical Life..2,000 operations per switch Operation Force ......................1000 gf max. Stroke ..............................................1.0 mm Operating Temp. Range ....-20 C to +70 C Storage Temperature ........-40 C to +85 C Vibration Test ......................MIL-STD-202F, Method 201A Frequency ..............10-55-10 Hz/1 minute Directions ................X,Y,Z, three mutually perpendicular directions Time......................2 hours each direction. High reliability Shock Test ..........................MIL-STD-202F, Method 213B, Condition A Gravity ..........50 G (peak value), 11 msec Direction & Times....................6 sides and 3 times in each direction. High reliability Packaging Specifications 2.54 (.100) TYP. 1.74 (.069) B 9.80 0.3 (.386 .012) 7.62 0.25 (.300 .010) 0.70 (.028) 16.00 0.1 (.630 .004) 0.70 MIN. (.028) POLE 2,3 4,5,6 7,8 9,10,12 1.0 (.039) 0~4 0.7 0.2 (.028 .088) TAPE SIZE (W) 16 mm 24 mm 32 mm 44 mm How to Order SDMX SERIES SDMR SERIES SDM R - 2 - T R Model RECOMMENDED PCB LAYOUT B0.10=2.54X(P-1) (B.004=.10X(P-1)) 2.54 (.100) TYP. 1.1 (.043) Actuator * X = Raised Actuator * R = Recessed Actuator 7.40 10.4 (.291) (.409) SCHEMATIC SCHEMATIC(TYP.) (TYP.) 1,2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE AVAILABLE 1,2,3,4,5,6,7,8,9,10 POSITIONS Number of Positions * 1 = 1 Position * 2 = 2 Positions * 3 = 3 Positions * 4 = 4 Positions * 5 = 5 Positions * 6 = 6 Positions * 7 = 7 Positions * 8 = 8 Positions * 9 = 9 Positions * 10 = 10 Positions * 12 = 12 Positions Seal * X = Standard (Not Sealed) * T = Top Tape Sealed ("R" Actuator only) Packaging Option (Top Sealed, Recessed only) * R = Tape and Reel Packaging (900 pcs./reel) MODEL NO. SDM-12 SDM-10 SDM-8 SDM-6 SDM-4 SDM-2 POSITIONS 12 10 8 6 4 2 MM DIMENSIONS: (IN) DIM. A DIM. B 31.42 27.94 26.34 22.86 21.26 17.78 16.18 12.70 11.10 7.62 6.02 2.54 Reflow Soldering Profile 275 180 C 175 10-15 Sec. 80-90 Sec. 125 120 C 75 30-40 Sec. 25 REV. 02/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 240 C 225 Temperature (C) Electrical Characteristics 0 20 40 60 35-60 Sec. 80 100 120 140 160 180 200 Time (Seconds)