MMBD1010LT1 - Motorola / Freescale Semiconductor

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SEMICONDUCTOR TECHNICAL DATA Order this document

bv MMBDIOIOLT1/D

MMBDIOIOLTI

MMBD2010T~

—Switching Diode

Pad of the GreenMneTM Portfolio of devices with energy+onsewing traits.

This switching diode has the following features:

Very Low Leakage (s 500 PA) promotes extended battery life by decreas-

ing energy waste. Guaranteed leakage limit is for each diode in the pair

contingent upon the other diode being in anon–forward-biased condition.

Offered in four Sutiace Mount package types

Available in 8mm Tape and Reel in quantities of 3,000

Applications

ESD Protection

Reverse Polaritv Protection ANODE

●

Steeflng Logic

Medium–Speed Switching

IMMBD2010T1 I

MAXIMUM RATINGS

Rsting Symbol Unit

Continuous ReverseVoltage VR Vdc

-— Peak Forward Current ,.~$F ‘* 200 mAdc

“.,:.,,

—Peak Forward Surge Current ‘ii,,, l;~ 500 mA

~;:y:X.**-,:}*

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DEVICE MARKING .+,~,,‘t<t+ii‘

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CASE 419-02, SVLE 5

SC-701SOT423

MMBD301OTI

THERMAL CHARACTERIS~*@?’$W$” T

Symbol Msx Unit

PD mW

225

150

1.8 mW/OC

1.2

..\ ~’,.,,

Chara*wY

Total Device Dissipati~ F@?&oard (1)

TA =25°C ~:,wB~lOIOLTl ,MMBD301OT1

‘:i.twb2010Tl

Derate above.#&&$~MBDIOl OLT1, MM BD301 OT1

‘~~?%<, ‘MMBD201 OT1

CASE 318D-03, SNLE 3

SC-59

@&on and Storage Temperature

\Device mounted on a FR-4 glass epoxy printed circl TJ, Tstg -55 to+150 ‘c J

~oard using the minimum

recommended footprint,

GreenLine is atrademark of Motorola, Inc.

Thermal Clad is aregistered trademark of the Berquist Company.

Preferred devicesare Motorola recommendedchoices for future use and best overall value.

@Motorola, Inc.1995 @MOTOROLA

MMBD1OIOLTI MMBD201OT1 MMBD301OT1

ELECTRICAL CHARACTERISTICS (TA =25°C unless otherwise noted)

,..,,

Characteristic Symbol Min Max Unit I

OFF CHARACTERISTICS —

Reverse Breakdown Voltage (lBR =100 ~) V(BR) 30 —v

Reverse Voltage Leakage Current (VR =75 V)(2) iR —500 pA

Forward Voltage (IF =1.0 mA) VF —850 mV

(IF= 10 mA) —950 *,\

Diode Capacitance (VR =OV, f=1,0 MHz) CD —2.0 $q~<:;~

Reverse Recovey Time (lF =IR =10 mA) (Figure 1) trr ,.**.

—3.0 ,,~w,‘$~ “

(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being ,’.~~.. -~~

,\$$,..J.,

*+.*

in anon-forward-biased condition. .,,8,.~-<

,, ‘?.!r.:<Lr..\y,>

820Q

tiov 2k

0.1UF

50QINPUT

SAMPLING

OSCILLOSCOPE

I I ,R_mA

OUTPUTPULSE

(IF=IR=10m%measured

atiR(REC)=imA)

10 mA.

—

2Motorola Small–Signal Transistors, FETs and Diodes Device Data

—

MINIMUM RECOMMENDED

MMBD101 OLT1 MM BD201 OTI MMBD3010T1

FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Sutiace mount board layout is acritical potiion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

0.037

l_l 0094

SC-59

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to asolder reflow process.

The power dis~~;fi$o~ for asurface mount device is a

function of the -,wcd~ector pad size. These can vary from

the minimumt:~~~~~;~e for soldering to a pad size given for

maximum Wshdlssipation. Power dissipation for asutiace

mount ~~~i~&is determined by TJ(mm), the maximum rated

junm~w~erature of the die, RgJA, the thermal resistance

fr~%~~~s device junction to ambient, and the operating

‘?~w~rature, TA. Using the values provided on the data

S?eet, PD can be calculated as follows:

PD =

TJ(max)–TA

ROJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one can

calculate the power dissipation of the device. For example,

for aSOT–23 device, PD is calculated as follows.

—

n- t

1.22

0.048

Iu_

2,36 _

- 0.093

4,19 >

— 0.165

SOD-1 23

SURFACE MOUNT DEVICE

inches

PD=150°C –25°C =225 milliwatts

556°C~

The 556°CM for the SOT–23 package assumes the use

of the recommended footprint on a glass epoxy printed circuit

board to achieve apower dissipation of 250 milliwatts. There

are other alternatives to achieving higher power dissipation

from the sutiace mount packages. One is to increase the

area of the drain/collector pad. By increasing the area of the

drain/collector pad, the power dissipation can be increased.

Although the power dissipation can almost be doubled with

this method, area is taken up on the printed circuit board

which can defeat the purpose of using surface mount

technology.

Another alternative would be to use aceramic substrate or

an aluminum core board such as Thermal CladTM. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the same

footprint.

Motorola Small–Signal Transistors, FETs and Diodes Device Data 3

MMBD101OLT1. MMBD201OTI MMBD301OT1

SOLDERING PRECAUTIONS

Themelting temperature ofsolder ishigher than the rated .

temperature of the device. When the entire device is heated

toahigh temperature, failure tocomplete soldering withina .

short time could result in device failure, Therefore, the

following items should always be observed in order to .

minimize the thermal stress to which the devices are

subjected,

.Always preheat the device.

●The delta temperature between the preheat and soldering

should be 10O°C or less,* ●

.When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When *

The soldering temperature and time should not exceed

260°C for more than 10 seconds. —

When shifting from preheating to soldering, the maximum

temperature gradient should be 5°C or less. —

After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient an~x~.ult

in latent failure due to mechanical stress, .t:$’’’*wJ~$

.:,*~;,,.

Mechanical stress or shock should not be ~~~;~ur[ng

cooling .,,

Solderina adevice without preheating&fi’&~se excessive

using infrared heating with the reflow soldering method, thermal sh;ck and stress which ca~~~~~~ damage to the

the difference should be a maximum of 10°C. device. .$istl,,~.,%;Y.

,$,:/, .,,

.$,ix

~,:’t:t.,,,,.+.

SOLDER STENCIL GUIDELINES ?.‘73$$

.“?.:).-!$,..,$;$*.*.

.>,

/~ ,*< ~’~~~

Prior to placing surface mount components onto aprinted The stencil opening si~~~~,~e

circuit board, solder paste must be applied to the pads. Ashould be the same ‘?~~~@ pad

solder stencil is required to screen the optimum amount of board, i.e., a1:1 [=istration.

solder paste onto the footprint. The stencil is made of brass ,,,.],;..,.,,.:.,.,\~

,t,,:.’~a.,.,..

or stainless steel with atypical thickness of 0.008 inches, $!>*?:.“<?

$2,,~A..,,1 ,$:

,, ‘::.:,. ,.

\~><k~$..

,$“’%

TYPICAL SOLDER HEATl~~XOFILE

surface mounted package

size on the printed circuit

,t$:$>,&

For any given circuit board, there will be a group of control ~GJq:i%mperature that might be experienced on the surface

settings that will give the desired heat pattern. The operator ~~ d$est board at or near acentral solder joint. The two

must set temperatures for several heating zones, and a .‘“+X*“’””’s

figure for belt speed. Taken together, these control settings .@j;~~~les are based on a high density and a low density board.

*,.?he Mtronics SMD31O convectionfinfrared reflow So[deflng

make up a heating “profile” for that particular circuit b~ard.J+

On machines controlled by acomputer, the co,@~ter system was used to generate this profile. The type of solder

remembers these profiles from one operating sessidb,to We used was 62/36/2 Tin Lead Silver with amelting point

next. Figure 8shows atypical heating profile fw$~~$khen between 177–1 89°C. When this type of furnace is used for

soldering asurface mount device to aprinte$~$,$$s?board. solder reflow work, the circuit boards and solder joints tend to

This profile will vary among soldering systQQ~$Qk#’is a good heat first. The components on the board are then heated by

starting point. Factors that can affect t~~w include the conduction. The circuit board, because it has alarge surface

type of soldering system in USeJ:N&N$&y’ and types of area, absorbs the thermal energy more efficiently, then

components on the board, type of $old@sed, and the type distributes this energy to the components. Because of this

of board or substrate material w~~@d. This profile shows effect, the main body of acomponent may be up to 30

temperature versus time. The$tin~~bn the graph shows the

!+....l~,~$!“degrees cooler than the adjacent solder joints.

,,.~<~~‘*;,

,,i:, .,,

,,,

—

4Motorola Small–Signal Transistors, FETs and Diodes Device Data

—

MMBD101OLT1

STEP 1STEP 2STEP 3STEP 4STEP 5

PREHEAT VENT HEATING HEATING HEATING

ZONE 1“SOAK ZONES 2&5 ZONES 3&6ZONES 4&7

MMBD201OTI MMBD301 OT1

STEP 6STEP 7

VENT COOLING

“RAMP” “RAMP “SOAK “SPIKE”

200°c– -II

DESIRED CURVE FOR HIGH 170°c

MASS ASSEMBLIES

160°C

150”

150°c

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

140°c (DEPENDING ON

looOc– –MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

500c_ _.,i

~~,,.

.l*}x.*!\,:t,.:,.

;i+.\..%:,

.‘~?,$,,.,,$:...

>*’+ .~.,

J*;$$;:.:‘.$.>

TIME (3 TO 7MINUTES TOTAL) *T&;+ .y:F

‘.b,..+.,,.

~~,,.t..,.,,,,~,..

...

Motorola Small–Signal Transistors, FETs and Diodes Device Data’ 5

MMBDI OIOLT1 MM BD2010T1 MMBD3010TI

PACKAGE DIMENSIONS

—

6Motorola Small–Signal Transistors, FETs and Diodes Device Data

—

MMBD1OIOLTI MMBD201OT1 MMBD301OTI

CASE 318D-03

ISSUE E

SC-59

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION MILLIMETER

II ,,,, , ,,,.T. ”,

.,,LL,,VIL,C”S INCHES

DIM MIN IMAX IMIN IMAX

Motorola Small–Signal Transistors, FETs and Diodes Device Data 7

MM BD101 OLT1 MMBD201OT1 MMBD301OTI

,/}$. .,*’,

~$s.!..:.~,,,.

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x$: ,,

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Motorola rW&$4~e right to make changes without fuflher notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the sui@lit~~ its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,

and~~~~$lly disclaims any and all liability, including without limitation consequential or incidental damagea. ‘Typical” parameters can and do vary in different

w~!f~g. All operating parameters, including ‘Typicala” must be validated for each customer application by customer’s technical experts. Motorola does

,kw~~b~y any license under~ta patent rights nor the rights of others: Motorola products are not designed, intended, or authorized for use as components in

~l;$~$lntendedforsurgicallmplanti~totpe body, orotherap?llcatlonslntendedtosupport Orsustainlife,or foranyotherappflcationinwhich the failure of

torola product could create as!tuatlon whare personal InJury or death may occur. Should Buyer purchase or use Motorola products for any such

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against all claime, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim allages that Motorola was negligent regerding the design or manufacture of the part,

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—

02PHX34593F+ PRINTED IN USA 6/95 IMPERIAL LITHO 140606,000 SMALL SIGNAL YSASm MMBDIOIOLT1/D

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